WO2005119707A3 - Power light emitting die package with reflecting lens and the method of making the same - Google Patents

Power light emitting die package with reflecting lens and the method of making the same Download PDF

Info

Publication number
WO2005119707A3
WO2005119707A3 PCT/US2005/019719 US2005019719W WO2005119707A3 WO 2005119707 A3 WO2005119707 A3 WO 2005119707A3 US 2005019719 W US2005019719 W US 2005019719W WO 2005119707 A3 WO2005119707 A3 WO 2005119707A3
Authority
WO
WIPO (PCT)
Prior art keywords
leadframe
die package
light emitting
molded body
making
Prior art date
Application number
PCT/US2005/019719
Other languages
French (fr)
Other versions
WO2005119707A2 (en
Inventor
Ban P Loh
Gerald H Negley
Original Assignee
Cree Inc
Ban P Loh
Gerald H Negley
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc, Ban P Loh, Gerald H Negley filed Critical Cree Inc
Priority to EP10185255.6A priority Critical patent/EP2287928B1/en
Priority to EP05758018A priority patent/EP1756879B1/en
Priority to DE602005012259T priority patent/DE602005012259D1/en
Priority to JP2007515655A priority patent/JP5596901B2/en
Publication of WO2005119707A2 publication Critical patent/WO2005119707A2/en
Publication of WO2005119707A3 publication Critical patent/WO2005119707A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

A light emitting die package (10) and a method of manufacturing the die package are disclosed. The die package includes a leadframe (20), at least one light emitting device (LED) (50), a molded body, and a lens. The leadframe includes a plurality of leads (22) and has a top side (24) and a bottom side (26). A portion of the leadframe defines a mounting pad. The LED device (50) is mounted on the mounting pad (28). The molded body (40) is integrated with portions of the leadframe (20) and defines an opening on the top side (24) of the leadframe (20), the opening surrounding the mounting pad (28). The molded body (40) further includes latches on the bottom side (26) of the leadframe (20). The lens (70) is coupled to the molded body (40). A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.
PCT/US2005/019719 2004-06-04 2005-06-03 Power light emitting die package with reflecting lens and the method of making the same WO2005119707A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP10185255.6A EP2287928B1 (en) 2004-06-04 2005-06-03 Power light emitting die package with reflecting lens
EP05758018A EP1756879B1 (en) 2004-06-04 2005-06-03 Power light emitting die package with reflecting lens and the method of making the same
DE602005012259T DE602005012259D1 (en) 2004-06-04 2005-06-03 Housing with light-emitting high-power diode and reflection lens, and associated production method
JP2007515655A JP5596901B2 (en) 2004-06-04 2005-06-03 Power light emitting die package having a reflective lens and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/861,929 2004-06-04
US10/861,929 US7456499B2 (en) 2004-06-04 2004-06-04 Power light emitting die package with reflecting lens and the method of making the same

Publications (2)

Publication Number Publication Date
WO2005119707A2 WO2005119707A2 (en) 2005-12-15
WO2005119707A3 true WO2005119707A3 (en) 2006-06-01

Family

ID=35446717

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/019719 WO2005119707A2 (en) 2004-06-04 2005-06-03 Power light emitting die package with reflecting lens and the method of making the same

Country Status (8)

Country Link
US (3) US7456499B2 (en)
EP (7) EP2287927B1 (en)
JP (2) JP5596901B2 (en)
AT (1) ATE420464T1 (en)
DE (1) DE602005012259D1 (en)
MY (1) MY139974A (en)
TW (2) TW201234644A (en)
WO (1) WO2005119707A2 (en)

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