WO2005114093A1 - Verfahren und vorrichtung zur optischen abtastung einer probe - Google Patents
Verfahren und vorrichtung zur optischen abtastung einer probe Download PDFInfo
- Publication number
- WO2005114093A1 WO2005114093A1 PCT/EP2005/003714 EP2005003714W WO2005114093A1 WO 2005114093 A1 WO2005114093 A1 WO 2005114093A1 EP 2005003714 W EP2005003714 W EP 2005003714W WO 2005114093 A1 WO2005114093 A1 WO 2005114093A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sample
- correction
- unit
- control system
- scanning
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/24—Base structure
- G02B21/26—Stages; Adjusting means therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/002—Scanning microscopes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
- H04N1/19—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays
- H04N1/195—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays the array comprising a two-dimensional array or a combination of two-dimensional arrays
Definitions
- the present invention relates to a device and an associated method for optically scanning a sample, comprising at least one adjustment unit, and at least one scanning device, wherein the sample is moved relative to the scanning device by means of the adjustment unit acted upon by a control system, or vice versa.
- the scanning device with the adjusting unit can just as easily undergo movement in comparison with the sample.
- a device of the embodiment described above and an associated method are known and are otherwise described in the context of US-PS 4,760,385 or US-PS 4,673,988.
- individual images of the sample are taken and subsequently assembled in the control system into an overall image.
- the individual images can be joined with overlap or bump to bump to the overall picture.
- the overall picture thus represents a grid of the individual pictures or is composed of one of these.
- the invention is based on the technical problem of specifying a device and a method for the optical scanning of a sample, by means of which, or with the aid of which, rapid sampling of the sample is achieved, taking into account the greatest possible accuracy.
- a generic device for optical scanning of a sample in the invention is characterized in that for mechanical clearance compensation of the adjustment and / or the scanner correction values recorded and stored in the control system and taken into account in the adjustment process.
- the correction values thus always come into play, for example, when a specific position of the sample is to be approached with the aid of the adjusting unit in order to record a single image. Because to this desired position of the sample corresponds to a previously determined correction value, which according to the invention now takes into account in the relevant setting process and the resulting travel.
- the adjustment unit (including the control system controlling it) can act on either the sample or the scanning device or both, as already mentioned above. D. h., In principle, even two adjustment units are conceivable, on the one hand for the sample and on the other hand for the scanning device, which are both acted upon by a common control system or by separate control systems. As a rule, however, the optical scanning device is left stationary, whereas the sample is traversed with the aid of the adjusting unit.
- the sample is usually taken from a sample table which, with the aid of the adjustment unit, moves in one direction (for example in the X direction), in two directions (ie in the X and Y directions) or even in a spatial movement (in the X, Y and Z directions).
- the adjustment unit with an associated drive device ensures that the sample is moved relative to the usually stationary scanning device, so that the desired individual images can be taken up successively.
- the individual images in the control system are combined directly and / or optionally after a data transfer at a remote location in a (other) control system to the desired overall image of the sample.
- Each frame has its own grid position in the overall picture.
- correction values are recorded either in the factory before the actual startup of the device or also before or during each individual measuring process and stored in the associated control system. These correction values take into account, for example, errors which can result from the fact that the drive device assigned to the adjustment unit usually has one or more spindle drives or spindle drives with unavoidable play. Such a spindle drive always has this not to be prevented game, which also depends on the position of a mother moving on the spindle and thus the sample table connected thereto.
- rotational errors must additionally be taken into account, which can arise as a result of, for example, working with different microscope objectives within the scope of the scanning device, which are recorded in an associated objective revolver.
- this objective turret or when changing from one lens to the other the position of the recorded individual image may change compared to a sensor or area sensor in the scanning device, which is also to be corrected.
- At least one reference sample is scanned in the form of a mask, which can advantageously be a so-called lithographic mask with defined markings.
- lithography masks are used in the manufacture of semiconductor devices and serve to the desired structures in the silicon wafer to produce.
- a lithography mask is irradiated with short-wave light and, on the silicon wafer thus covered, causes only areas of the silicon wafer coated with a photoresist to be exposed by the mask.
- submicron structures can be defined in semiconductor technology.
- the mask in question has defined markings in a fixed coordinate system of the mask whose position (taking into account the abovementioned accuracy values) is thus clearly fixed in the XY plane and thus in the grid of the overall image.
- a three-dimensional mask which also has markings not only in the X and Y plane, but also in the Z direction.
- a mask with defined markings in the X / Y plane is used.
- the position of these markers in comparison to a reference line or a mask boundary and consequently the coordinate system of the mask is accordingly fixed.
- the markings must be found at the defined positions in the individual image and consequently also in the grid of the overall image.
- a first mark may be 50 ⁇ m in position; 50 ⁇ m for the X / Y values compared to a reference zero point (coordinate origin) of the mask.
- the adjusting unit only in the X direction, for example 49 microns must be moved, however, in the Y direction, an adjustment of 45 microns is required.
- correction values for the overall image can now be determined and stored in the control system.
- a central correction value per individual image is acquired.
- the image centers of the individual individual images it is recommended to approach the image centers of the individual individual images to be recorded and then use the mask to record corresponding correction values and store them in the control system.
- the overall picture is composed of, for example, 100 individual pictures
- these correction values can then adjust the adjustment be corrected when starting and recording the respective frame in its associated position.
- correction values are usually stored in a one-dimensional or multidimensional correction matrix.
- a 10x10 matrix as long as the overall picture is square.
- Each individual correction value of this correction matrix in turn has the corresponding correction individual values for the correction in the X, Y and possibly Z direction.
- correction matrices can be defined, depending on whether, for example, the spindle drive for the X direction approaches increasing X values or decreasing X values. The same applies to the spindle drive in the Y direction and possibly in the Z direction. As a result, a large number of correction matrices are obtained, in each case depending on the speed and / or the direction of the drive device for the adjustment unit.
- the scanning device can be equipped with a plurality of imaging and / or recording units.
- This recording unit or an associated sensor or area sensor may not be limited to a CCD (charge coupled device) chip.
- this semiconductor component consists of many cells or pixels arranged in a checkerboard pattern.
- the relevant chip is located at the point where otherwise the film plane is arranged in a photographic recording of the sample.
- a light source arranged below the sample or the sample table, electrons accumulate in the cells of the CCD chip, the number of electrons being a measure of the duration and intensity of the incident light.
- the cells or pixels can be read out and the respective number of electrons is counted. As a result, each pixel can be assigned a specific brightness value.
- the desired digitized image in the control system can be calculated and composed from these values.
- the scanning device has at least one microscope objective or several microscope objectives, which are recorded in a nosepiece.
- the desired microscope objective and thus the selected imaging unit can be used. This happens either manually or controlled by the control system.
- correction values can again be recorded for each imaging unit or each microscope objective separately.
- those are additionally included which correspond as further parameters to a specific imaging unit or a predetermined microscope objective.
- a deviation from the imaging unit or microscope objective to the imaging unit can be determined and compensated, for example, by again identifying the center of the image to be recorded or recorded with a specific XY value (which possibly already has a correction by correction values of the adjustment unit for the sample table, but this is not mandatory). If the position of the center of the image changes when changing to another imaging unit or another microscope objective, the deviation of the "new" image center from the old or original image center can be detected with the aid of the mask and ends in an associated correction value for the "new" image "Imaging unit compared to the original imaging unit.
- the correction values can also be dependent on other parameters, such.
- the size and / or weight of the sample table, the temperature at the site, the number of recording cycles, etc. capture.
- the invention takes into account the fact that possibly different and interchangeable sample tables are used and, accordingly, a correction must be made depending on the selected sample table and its weight.
- the temperature at the site may affect the correction values, which may be accommodated with the aid of an additional temperature sensor.
- the bottom line is thus stored in the control system a whole bunch of correction matrices, one for each conceivable speed of the drive device for the actuator, one for each conceivable direction of the respective drive device, each a correction matrix for each imaging unit or each microscope objective, one for the selected sample table etc.
- the control system can select the corrective matrices belonging to the predetermined parameters. From these individual correction matrices, an overall correction matrix is derived. In the simplest case, this is done by adding the correction values in each case.
- a device for optically scanning a sample as well as an associated method of operation are provided with the aid of which mechanical play during sample scanning can be compensated.
- the correction compensation can also take place during the actual sample scanning.
- the invention enables a hitherto unknown precision in the recording of the individual images, which can thus be easily assembled into the overall picture. That can happen shock to shock or with overlap.
- shock to shock or with overlap can happen shock to shock or with overlap.
- FIG. 1 shows the device according to the invention in a perspective view.
- FIG. 2 shows the object according to FIG. 1 schematically
- 3 shows the device according to the invention, reduced to the scanning device and the adjusting unit
- Fig. 4 shows the correction process schematically
- Fig. 5 Details of the adjustment or the associated drive device.
- a device for optical scanning of a sample 1 is shown.
- This sample 1 is not limited to a cut through a biological tissue or material.
- the cut is carried out so that the sample 1 can be transilluminated by a white light source W and its image can be recorded.
- the device has in its basic structure via an adjustment. 2, 3 and a scanning device 4, 5.
- the adjusting unit 2, 3 in the embodiment of two spindle drives 2 as a drive device 2 and a sample table 3 is composed.
- the white light source W is arranged, so that the image of the sample 1 can be picked up by the scanning device 4, 5 arranged above it.
- the scanning device 4, 5 summarizes a plurality of imaging units or microscope objectives 4 and a recording unit or a surface sensor or a CCD chip 5 together.
- the adjusting unit 2, 3 is acted upon by a control system 6.
- correction values K are now added to the mechanical clearance compensation of the adjustment unit 2, 3 and stored in the control system 6 and taken into account during the adjustment process.
- the sample 1 is scanned, taking into account a total of twelve individual images in the example case (cf., FIG. 4). Of the 12 individual pictures, only one single picture B1 is marked for reasons of clarity. In any case, the twelve individual images in the sense of a grid in the control unit 6 are assembled into an overall picture. In order to accomplish this without problems or to compensate for any deviations of the positions of the individual images in the overall image relative to one another by mechanical play within the illustrated device, the described correction values K are recorded.
- a mask or reference mask 7 indicated in FIG. 4 instead of or simultaneously with the sample 1.
- the sample 1 has been applied to a slide 8 on the upper side, as the enlarged view in Fig. 3 makes clear.
- the underside of the slide 8 carries the mask 7.
- This mask or reference mask 7 is not limited to a lithography mask, as is known from semiconductor manufacturing. Such a mask 7 has one or more markings 9 (see Fig. 4).
- each marking 9 is provided centrally, ie in the middle of the picture, in comparison with the individual picture to be taken in each case.
- a plurality of markings 9 can also be arranged elsewhere, and the number of markings 9 can undergo a variation.
- FIG. 4 the correction process will now be explained schematically.
- the "true" position of the mask 7 compared to its coordinate system with the origin 10 is shown in solid.
- the measured actual image of the reference mask 7 corresponds to the dot-dashed representation.
- the associated pixels of the markers 9 are, like the reference mask 7, characterized by a '. That the image of the reference mask 7 - marked by the reference symbol T - is taken by a CCD chip 5, also explains the dot-dashed arrow at this point.
- FIG. 4 assumes that each of the twelve individual images experiences a constant deviation when detecting the reference mask 7, which deviation can be compensated with only a single correction value K.
- the image of the mask or reference mask 7 - identified by the reference symbol T - is now detected by the device shown by the respective associated individual images are assembled to the overall image according to the above illustration in FIG. 4 in the control unit 6 and the position of mapped mask T is compared with the CCD chip 5 by means of the control system 6 is evaluated.
- the mask 7 is imaged on the sensor or surface sensor 5 with the aid of the imaging unit or the microscope objective 4 and here generates the image of the mask 7 '.
- each individual image in the sensor plane corresponds in size essentially to the dimensions of the CCD chip 5 realized at this point.
- Each frame is now read by the control unit 6 from the CCD chip 5 and stored in a memory of the control system 6 and placed in place in the grid of the overall picture.
- the position of the individual imaged markings 9 ' is related to the actual position of the respective mark 9 in relation to the reference point or origin 10. This expresses the Fig. 4. It can be seen that mechanical inaccuracies lead to the respectively depicted marking 9 '(shown in phantom in the upper part of FIG. 4) having a slightly different position than the marking (drawn through) in the original image.
- This deviation can be determined and quantified as a correction value K.
- the CCD chip 5 has the previously mentioned checkerboard-like pixels arranged in a known and fixed position in the X and Y plane, d. H. in his sensor level. Taking into account the magnification given by the imaging unit or the microscope objective 4, it is now possible to deduce the deviation of the respectively depicted mark 9 'from the original mark 9 in the mask 7. Each deviation leads to an X / Y correction value K, as has already been stated in the introduction.
- an associated correction value K with corresponding X / Y values can be determined for each original marking 9 and stored in the control system 6.
- a separate correction value K- 1 , K 2 ,... K- Define 2 and record in the control unit 6.
- each individual image B1, B2,... B12 is flanked by a specific correction value K- 1 , K 2 ,... K- 2 .
- K- 1 , K 2 ,... K- 2 it is also theoretically possible to work with several correction values K per frame. As a rule, however, one resorts to a single correction value K per frame. With the aid of this correction value K, the position of the sample stage 3 is corrected by means of the CCD chip 5 before the sample 1 is taken.
- the correction value K corresponding thereto causes the sample stage 3 to undergo a corresponding adjustment or instead to the dashed setpoint position (in the example 50 .mu.m; 50 .mu.m) into the position (49 .mu.m; ⁇ m).
- the sample 1 also experiences a corresponding displacement, which compensates for the previously determined mechanical inaccuracies, so that the image of the sample 1 comes to rest on the sensor 5 during the subsequent recording at the correct location.
- the described correction values K can be detected as a function of the speed and / or direction of the drive device 2 for the adjustment unit 2, 3. This results in one or more speed-dependent and / or direction-dependent correction matrices, as already described in the introduction.
- a plurality of imaging units 4 as well as different sample tables 3 can be used.
- the scanning device 4, 5 has a plurality of microscope objectives 4, which are received in a lens revolver 11 loaded by the control system 6. In this way, the control system 6 immediately receives feedback about the respective microscope objective 4 in use and can therefore fall back on the associated correction matrix - if necessary.
- the adjusting unit 2, 3 or the associated drive device 2 has two spindle drives 2, which are designed as ball screw drives 2.
- the Spindle drives 2 are each arranged orthogonal to each other and provide for the adjustment of the sample stage 3 and thus the sample 1 in the X direction and Y direction. Details of the respective ball screw drive 2 are shown in FIG. 5. It can be seen that individual balls 12 are guided in circulation.
- control system 6 ensures that the adjustment unit 2, 3 and with it the sample 1 occupies the desired position for receiving the individual image when recording. Subsequently, the single image is detected by the CCD chip 5 and stored in the control system 6 in the grid of the overall image at its position. As a result of the preceding or simultaneous operation of the mechanical clearance compensation and the recording of the correction values K, the control system 6 now "knows" that a specific correction value K (X, Y) corresponds to the associated and recorded individual image. - This can be a total of a mechanical clearance compensation realize that ultimately works electronically, so that even inexpensive adjustment units 2, 3 can be found without further use.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/597,010 US8139105B2 (en) | 2004-05-17 | 2005-04-08 | Method and device for optically scanning a sample |
JP2007516996A JP2007538276A (ja) | 2004-05-17 | 2005-04-08 | 試料を光学的に走査するための方法及び装置 |
EP05734876.5A EP1747421B1 (de) | 2004-05-17 | 2005-04-08 | Verfahren und vorrichtung zur optischen abtastung einer probe |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004024810.9 | 2004-05-17 | ||
DE102004024810A DE102004024810A1 (de) | 2004-05-17 | 2004-05-17 | Verfahren und Vorrichtung zur optischen Abtastung einer Probe |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005114093A1 true WO2005114093A1 (de) | 2005-12-01 |
Family
ID=34965299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/003714 WO2005114093A1 (de) | 2004-05-17 | 2005-04-08 | Verfahren und vorrichtung zur optischen abtastung einer probe |
Country Status (5)
Country | Link |
---|---|
US (1) | US8139105B2 (de) |
EP (1) | EP1747421B1 (de) |
JP (1) | JP2007538276A (de) |
DE (1) | DE102004024810A1 (de) |
WO (1) | WO2005114093A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008021641A1 (de) * | 2008-04-30 | 2009-11-05 | Carl Zeiss Microlmaging Gmbh | Auflösungsgesteigerte Lumineszenzmikroskopie |
DE102014225691A1 (de) * | 2014-12-12 | 2016-06-16 | Homag Holzbearbeitungssysteme Gmbh | Verfahren und Vorrichtung zum Steuern einer Werkzeugmaschine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5323003A (en) * | 1991-09-03 | 1994-06-21 | Canon Kabushiki Kaisha | Scanning probe microscope and method of observing sample by using such a microscope |
US5825670A (en) * | 1996-03-04 | 1998-10-20 | Advanced Surface Microscopy | High precison calibration and feature measurement system for a scanning probe microscope |
US20010030286A1 (en) * | 2000-03-28 | 2001-10-18 | Akira Egawa | Scanning probe microscope |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4760385A (en) * | 1985-04-22 | 1988-07-26 | E. I. Du Pont De Nemours And Company | Electronic mosaic imaging process |
US4673988A (en) * | 1985-04-22 | 1987-06-16 | E.I. Du Pont De Nemours And Company | Electronic mosaic imaging process |
JP2829642B2 (ja) * | 1989-09-29 | 1998-11-25 | キヤノン株式会社 | 露光装置 |
JP3103217B2 (ja) * | 1991-09-03 | 2000-10-30 | キヤノン株式会社 | 走査型プローブ顕微鏡及びそれを用いて試料を観察する方法 |
JPH07325623A (ja) * | 1994-05-31 | 1995-12-12 | Ushio Inc | Xyステージの制御方法および装置 |
JPH10260021A (ja) * | 1997-03-18 | 1998-09-29 | Toshiba Corp | パターン検査装置 |
JP3757854B2 (ja) * | 2001-12-06 | 2006-03-22 | 株式会社島津製作所 | 複数の蛍光物質を含む試料の分析方法及び装置 |
US7246343B2 (en) * | 2004-09-01 | 2007-07-17 | Invarium, Inc. | Method for correcting position-dependent distortions in patterning of integrated circuits |
EP1669740A1 (de) * | 2004-12-10 | 2006-06-14 | Olympus Corporation | Mikroskopgerät, Sensitivitätseinstellungsverfahren für einen Photodetektor, Steuereinheit und Speichermedium |
-
2004
- 2004-05-17 DE DE102004024810A patent/DE102004024810A1/de not_active Ceased
-
2005
- 2005-04-08 WO PCT/EP2005/003714 patent/WO2005114093A1/de active Application Filing
- 2005-04-08 JP JP2007516996A patent/JP2007538276A/ja active Pending
- 2005-04-08 US US11/597,010 patent/US8139105B2/en not_active Expired - Fee Related
- 2005-04-08 EP EP05734876.5A patent/EP1747421B1/de not_active Not-in-force
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5323003A (en) * | 1991-09-03 | 1994-06-21 | Canon Kabushiki Kaisha | Scanning probe microscope and method of observing sample by using such a microscope |
US5825670A (en) * | 1996-03-04 | 1998-10-20 | Advanced Surface Microscopy | High precison calibration and feature measurement system for a scanning probe microscope |
US20010030286A1 (en) * | 2000-03-28 | 2001-10-18 | Akira Egawa | Scanning probe microscope |
Also Published As
Publication number | Publication date |
---|---|
US20070258114A1 (en) | 2007-11-08 |
JP2007538276A (ja) | 2007-12-27 |
EP1747421A1 (de) | 2007-01-31 |
US8139105B2 (en) | 2012-03-20 |
EP1747421B1 (de) | 2018-10-10 |
DE102004024810A1 (de) | 2005-12-08 |
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