WO2005112537A1 - 部品供給ヘッド装置及び部品実装ヘッド装置 - Google Patents
部品供給ヘッド装置及び部品実装ヘッド装置 Download PDFInfo
- Publication number
- WO2005112537A1 WO2005112537A1 PCT/JP2005/008902 JP2005008902W WO2005112537A1 WO 2005112537 A1 WO2005112537 A1 WO 2005112537A1 JP 2005008902 W JP2005008902 W JP 2005008902W WO 2005112537 A1 WO2005112537 A1 WO 2005112537A1
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- WIPO (PCT)
- Prior art keywords
- component
- suction
- head device
- mounting
- suction nozzle
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Definitions
- Component supply head device and component mounting head device are Component supply head device and component mounting head device
- the present invention relates to a component mounting head device that holds a component on a mounting side surface on a substrate and moves it to a component delivery position at a component removal position, reverses the orientation of the mounting side surface, and then moves the component mounting position to the component delivery position
- the present invention relates to a component supply head device for transferring components to a component supply head device. Further, the present invention relates to a component mounting head device that holds a component on a non-mounting surface opposite to a surface on a mounting side on a substrate and mounts the mounting side surface on the substrate.
- the above-described component supply head device includes a suction nozzle for holding components.
- the suction nozzle of the conventional component supply head device will be described with reference to FIGS. 25A and 25B.
- the bump 2 is formed on the mounting surface la of the electronic component 1.
- the outer shape of the tip surface 3a is set smaller than the interval between the bumps 2.
- the tip surface 3a of the suction nozzle 3 is in close contact with the mounting surface la, and the vacuum source (not shown) acting on the suction hole 3c via the suction flow path 3b is suctioned.
- the electronic component 1 is held on the distal end surface 3a of the suction nozzle 3 by a force (static pressure).
- the suction nozzle 4 in FIG. 25B has a pyramid-shaped suction hole 4b on the tip end surface 4a, and the hole wall of the suction hole 4b contacts the periphery of the electronic component 1.
- the mounting surface la and the bump 2 do not directly contact the hole wall of the suction hole 4b, the electronic component 1 is held at the tip of the suction nozzle 4 by the suction force of a vacuum source (not shown).
- the tip end surface 4a of the suction nozzle 4 may interfere with the concave portion. This interference also reduces the holding accuracy of the electronic component 1 by the suction nozzle 4.
- the above-described component mounting head device also includes a suction nozzle for suction-holding a component.
- a suction nozzle of a conventional component mounting head device An example of a suction nozzle of a conventional component mounting head device will be described with reference to FIG.
- a suction hole 218b is formed in the tip surface 218a of the suction nozzle 218.
- the tip surface 218a of the suction nozzle 218 is in close contact with the surface (non-mounting surface lb) opposite to the mounting surface la of the electronic component 1, and the vacuum acting on the suction holes 218b via the suction flow passage 218c.
- the electronic component 12 is held on the tip end surface 218 a of the suction nozzle 218 by a suction force (static pressure) of a source (not shown).
- a heater 217 capable of adjusting the temperature is attached to the back side of the suction nozzle 218.
- the suction nozzle is generally processed in the following process.
- the electronic component 1 held on the substrate is mounted on the substrate 219.
- the suction nozzle 118 moves onto the substrate 219 and is positioned with respect to the substrate 219 such that the substrate electrode 220 formed on the substrate 219 and the bump 2 of the electronic component 1 meet. Subsequently, the suction nozzle 118 descends and presses the bump 2 against the substrate electrode 220.
- the heat generated by the heater 117 is transmitted to the electronic component 1 via the suction nozzle 118, and thereby the bump 2 is heated.
- the bump 2 and the substrate electrode 220 are joined by this pressurization and heating, and the electronic component 1 is mounted on the substrate 219.
- the entire non-mounting surface lb of the electronic component 1 does not uniformly adhere to the suction nozzle 118. Therefore, the electronic component 1 held by the suction nozzle 118 is relatively warped.
- a warp of about 14 / zm occurs. Due to the relatively large warpage, the temperature distribution in the bonding region becomes uneven, and a bonding failure occurs between the electronic component 1 and the substrate 219.
- Patent Document 1 JP-A-8-37395
- Patent Document 2 Japanese Patent Application Laid-Open No. 2003-29778
- the first invention holds a component on a mounting surface on a substrate on which a protruding electrode is formed, reverses the orientation of the mounting surface of the component, and delivers the component to a component mounting head device.
- the present invention relates to a component supply head device that enables a mounting head device to mount the component on the substrate.
- the component supply head device includes a distal end surface on which a suction hole is opened, and a suction flow path having one end communicating with the suction hole, and a portion of the distal end surface outside the suction hole is connected to the projection electrode of the component.
- the suction hole is opposed to a portion of the surface on the mounting side where the protruding electrode does not exist with a gap therebetween, and the suction hole and the mounting side are opposed by a vacuum suction force acting from the other end of the suction flow path.
- An air flow is generated from the gap between the surfaces to flow into the suction flow path via the suction hole, and a suction nozzle is provided for holding the component on the front end face with a negative pressure generated by the air flow.
- the suction hole faces a portion of the mounting surface where no bump is present with a gap.
- An air flow that flows into the suction channel through the suction hole from the gap is generated, and the component is held by the suction nozzle by negative pressure (dynamic pressure) generated by the air flow.
- the suction nozzle of the component supply head device holds the component with its tip end surface not in contact with the mounting side surface. Therefore, the suction force acts uniformly on the entire surface on the mounting side, and the component can be held on the suction nozzle with high accuracy without causing deformation such as a radius due to excessive suction force.
- Feeding Head Device Strength The accuracy of the delivery of components to the mounting head can be improved.
- the suction hole includes a central portion communicating with the suction channel, and a plurality of branch portions radially extending from the central portion.
- the outer dimensions of the tip end face are set such that the outer peripheral edge is located inside the edge of the component held by the suction nozzle and located outside the projecting electrode. . Since the outer peripheral edge of the tip surface of the suction nozzle is located inside the peripheral edge of the component, it prevents the suction nozzle from interfering with the wall surface that constitutes the recess when holding the component stored in the recess of the tray by suction. can do. Further, since the outer peripheral edge of the tip surface of the suction nozzle is located outside the bump, the bump reliably contacts the tip surface of the portion outside the suction hole. Therefore, the component is reliably held by the suction nozzle by the negative pressure generated in the gap between the suction hole and the mounting surface.
- a second invention holds a component on a non-mounting side surface opposite to a mounting side surface on which a plurality of protruding electrodes are formed, and joins the protruding electrode to a corresponding substrate electrode formed on a substrate.
- a component mounting head device for mounting the component on the substrate.
- the component mounting head device includes a heater for heating the component, and a region corresponding to a bonding region in which a suction hole is opened and the protruding electrode is formed on the mounting side surface of the component.
- the suction groove connected to the suction hole is formed in the entire area corresponding to the joining area of the component, the suction force acting on the suction hole and the suction groove via the suction channel causes the non-mounting of the component.
- the entire area of the side surface corresponding to the bonding area is suctioned densely to the tip end surface of the suction nozzle.
- the component is suction-held by the suction nozzle in a state of having a high flatness, and the warpage of the component is greatly reduced. For example, in the case of a part with a side of about 10 mm and a thickness of about 0.1 mm, only a warp of about 5 m occurs.
- the components are densely attracted and held by the suction nozzle, so that the heat generated by the heater is uniformly transmitted to the entire joining area of the components.
- the temperature distribution in the joining region is made uniform, and the plurality of projecting electrodes are heated evenly, so that the plurality of projecting electrodes can be joined to the substrate electrode in a uniform joining state.
- the suction groove may be provided outside the region corresponding to the bonding region in addition to the bonding region, that is, between the region and the peripheral edge of the suction nozzle.
- the arrangement, dimensions, and shape of the suction grooves are such as dimensions, materials including shape and thickness of the component, such that the non-mounting surface of the component has high flatness and is suctioned to the tip surface of the suction nozzle. Is set according to the factor of.
- the suction groove may be a combination of a frame portion and a lattice portion.
- the suction groove is arranged so as to extend in a first direction within the closed-shaped portion and one closed-shaped portion arranged along the peripheral edge of the distal end surface, and both ends are defined as described above.
- a plurality of second linear portions communicating with the first linear portions intersecting with each other.
- the closed figure part may be a polygon such as a quadrangle. Further, the closed figure part may be a closed curve such as a circle or an ellipse.
- the first and second linear portions may be any of a straight line, a curved line such as a wavy line, or a polygonal line.
- the suction grooves may be lattice-shaped as a whole. More specifically, the suction groove is arranged to extend in a second direction intersecting with the first direction, and a plurality of first linear portions arranged to extend in a first direction; and A plurality of second linear portions communicating with the intersecting first linear portions.
- the suction groove may include at least one closed-shaped portion arranged so as to surround a center of a region corresponding to the joining region on the distal end surface, and the joining region on the distal end surface. And a plurality of linear portions that extend radially from the center of the region corresponding to and that intersect with the closed figure-shaped portion.
- the closed figure portion may be a polygon such as a quadrangle.
- the closed figure part may be a closed curve such as a circle or an ellipse.
- the first and second linear portions may be straight lines, curved lines such as wavy lines, or polygonal lines.
- the suction groove may be a continuous single linear shape. In detail, the suction groove may be spiral or rectangular wave-shaped!
- the suction nozzle may be provided with a dent on the distal end surface that also blocks the suction hole.
- the depression is disposed between the suction groove and the peripheral edge of the distal end surface. Even if air enters a very small gap between the periphery of the tip surface of the suction nozzle and the electronic component sucked and held by the suction nozzle, the air that has entered is heated when passing through the depression. Therefore, it is possible to prevent a region corresponding to the joining region on the tip surface of the suction nozzle from being cooled by the air entering the gap. Therefore, by providing the depression, the temperature distribution of the joining region of the components held by the suction nozzle can be made more uniform.
- the suction nozzle of the component supply head device has a tip end surface outside of the suction hole in contact with the bump of the component, while the suction hole has a bump on the mounting surface of the component.
- the suction hole has a bump on the mounting surface of the component.
- the outer dimensions of the tip surface of the suction nozzle are set such that the outer peripheral edge is located inside the end edge of the component and outside the bump, even if the component is supplied in a state accommodated in the tray. It is possible to prevent interference between the tip of the suction head and the recess in which the component is accommodated. Therefore, it is possible to improve the holding accuracy of the component by the suction nozzle, and to improve the accuracy of transferring the component to the mounting head device and the mounting accuracy of the component.
- the suction nozzle connected to the suction hole is formed in the entire surface of the tip surface of the suction nozzle of the component mounting head device that corresponds to the connection region of the component.
- the entire area corresponding to the bonding area on the non-mounting side surface of the component is suctioned densely to the tip surface of the suction nozzle, and the component is suction-held by the suction nozzle in a state of having a high flatness.
- the temperature distribution in the bonding region of the component is made uniform, and the plurality of protruding electrodes are heated evenly, so that the plurality of protruding electrodes can be bonded to the substrate electrode in a uniform bonding state.
- FIG. 1 is a perspective view showing a component mounting apparatus according to an embodiment of the present invention.
- ⁇ 2] A schematic partial perspective view of the component mounting apparatus of FIG.
- FIG. 4 is a semi-transparent perspective view showing a component supply device included in the component mounting device of FIG.
- FIG. 5 is a perspective view showing a wafer supply plate.
- [6] A perspective view showing a tray supply plate.
- FIG. 7 is a partially enlarged perspective view of the tray of FIG. 6.
- FIG. 8 is a schematic cross-sectional view showing a plate arrangement device provided in the component mounting apparatus of FIG. [9]
- FIG. 9 is a schematic cross-sectional view showing a plate arrangement device provided in the component mounting apparatus of FIG. [10]
- FIG. 10 is a perspective view showing a component push-up device included in the component mounting device of FIG.
- FIG. 11 An exploded perspective view showing a component push-up device provided in the component mounting device of FIG.
- FIG. 12 is a partial perspective view showing a push-up head of a component push-up device provided in the component mounting apparatus of FIG.
- FIG. 13 is a partial perspective view showing the internal structure of the push-up head of FIG.
- FIG. 14 is a schematic cross-sectional view showing a plate placement device and a component push-up device included in the component mounting device of FIG.
- FIG. 15 is a perspective view showing a reversing head device included in the component mounting apparatus of FIG.
- FIG. 16A is a schematic longitudinal sectional view of a suction nozzle provided in a reversing head device.
- FIG. 16B is a schematic bottom view of the suction nozzle of FIG. 16A.
- 16C is a schematic longitudinal sectional view showing the relationship between the suction nozzle of FIG. 16A and the recess of the tray.
- 17A Schematic sectional view of an alternative of the suction nozzle provided in the reversing head device.
- FIG. 17B is a schematic bottom view of the suction nozzle of FIG. 17A.
- 17C is a schematic longitudinal sectional view showing the relationship between the suction nozzle of FIG. 17A and the concave portion of the tray.
- FIG. 18 is a schematic front view of the component mounting head device.
- FIG. 19 A schematic sectional view of a suction nozzle provided in the component mounting head device.
- FIG. 20A is a schematic bottom view of the suction nozzle of FIG. 19.
- FIG. 20B is a sectional view taken along line XX—XX in FIG. 20A.
- FIG. 20C is a schematic plan view of the suction nozzle of FIG. 19.
- FIG. 21A A bottom view of the first alternative of the suction nozzle included in the component mounting head device.
- FIG. 21B is a cross-sectional view taken along line XXI—XXI of FIG. 21A.
- FIG. 21C is a schematic plan view of the suction nozzle of FIG. 21A.
- FIG. 22A A schematic bottom view of a second alternative of the suction nozzle provided in the component mounting head device.
- FIG. 22B is a schematic side view of the suction nozzle of FIG. 22A.
- FIG. 23A A schematic bottom view of an alternative to the suction nozzle provided in the component mounting head device.
- FIG. 23B A schematic bottom view of an alternative to the suction nozzle provided in the component mounting head device.
- FIG. 23C A schematic bottom view of an alternative to the suction nozzle provided in the component mounting head device.
- FIG. 23D A schematic bottom view of an alternative of the suction nozzle provided in the component mounting head device.
- FIG. 23E A schematic bottom view of an alternative to the suction nozzle provided in the component mounting head device.
- FIG. 24A is a schematic explanatory view showing a relationship between a reversing head device and a component mounting head device.
- FIG. 24B is a schematic explanatory view showing the relationship between the reversing head device and the component mounting head device.
- FIG. 24C is a schematic explanatory view showing the relationship between the reversing head device and the component mounting head device.
- FIG. 24D is a schematic explanatory view showing the relationship between the reversing head device and the component mounting head device.
- [25A] A schematic sectional view showing a suction nozzle of a conventional component supply head device.
- FIG. 25B A schematic sectional view showing a suction nozzle of a conventional component supply head device.
- FIG. 26 A schematic sectional view showing a suction nozzle of a conventional component mounting head device.
- FIGS. 1 to 3 show an electronic component mounting apparatus 11 which is an example of a component mounting apparatus including a component supply head device and a component mounting head device according to an embodiment of the present invention.
- the electronic component mounting apparatus 11 is a device that performs a mounting operation of mounting an electronic component 12 such as a chip component or a bare IC chip, which is an example of a component, on a substrate 13, and can supply a plurality of electronic components 12 roughly.
- the electronic apparatus includes a component supply unit 14 which is an example of a component supply device accommodated in the electronic device, and a mounting unit 15 which performs a mounting operation of mounting each electronic component 12 supplied from the component supply unit 14 on a substrate 13.
- the electronic component mounting apparatus 11 controls the operations of the component supply unit 14 and the mounting unit 15. Or a controller 16 for controlling the operation.
- the component supply unit (component supply device) 14 includes a lifter (component supply storage unit) 17, a plate moving device 18, a plate placement device (component placement unit) 19, and a component push-up.
- the apparatus includes a device 20, a recognition camera 21, and a reversing head device (component supply head device) 22.
- the mounting section 15 includes a component mounting head device 24, an XY table (positioning device) 25, and a two-view recognition camera 26.
- the lifter 17 of the component supply unit 14 includes a vertically movable magazine 28, a wafer supply plate 29 for supplying the electronic components 12 in the form of a wafer to the magazine 28, and an electronic component 12 And a tray supply plate 30 for storing and supplying the tray 30 in the tray 31 so as to be selectively supplied.
- the wafer supply plate 29 has a substantially disk shape, and a wafer sheet 34 which is a stretchable sheet on which a diced wafer 32 is adhered. A wafer 35 and a ring 35 for holding the wafer sheet 34 near the outer peripheral end thereof are provided.
- the tray supply plate 30 has an outer shape similar to that of the wafer supply plate 29, and is a circular plate having a substantially square inner peripheral hole. And a plurality of trays 31 for component supply that are removably mounted on the tray mounting portion 37. As shown in an enlarged manner in FIG. 7, the component supply tray 31 is formed with a concave portion 31a for accommodating the electronic component 12.
- the plate moving device 18 shown only in FIG. 4 is movable in the Y-axis direction, and transports the wafer supply plate 29 or the tray supply plate 30 taken out of the magazine 28 of the lifter 17 to the plate placement device 19. .
- bumps (protruding electrodes) 39 are formed on the substrate 13 so that the surface 12a on the mounting side of the electronic component 12 on the substrate 13 faces vertically upward and the mounting side
- the non-mounting side surface 12b opposite to the front surface 12a is held by the plate placement device 19 in a posture in which it faces vertically downward (see Fig. 7). Referring to FIG. 2, FIG. 4, FIG. 8, and FIG.
- the plate arrangement device 19 includes a wafer supply plate 29 ⁇ a plate support pin 41 for supporting the lower surface of the tray supply plate 30, A plate pressing plate 42 is provided on the upper surface side of the plate.
- the plate support pin 41 is supported movably in the vertical direction with respect to a mounting member 43 having a ring shape in plan view.
- a coil spring 44 is mounted on the plate support pin 41, and the plate support pin 41 is energetically urged vertically upward by the coil spring 44.
- the plate pressing plate 42 is driven up and down by a cylinder 45.
- a cylindrical expandable member 46 is disposed inside the mounting member 43, and the tip of the expandable member 46 is in contact with the lower surface of the wafer sheet 34. As shown in FIG.
- the wafer supply plate 29 is sandwiched between the leading end of the plate support pin 41 and the plate pressing plate.
- the plate pressing plate 42 is lowered from the position shown in FIG. 8 by the cylinder 45, the tip of the expanding member 46 becomes a fulcrum, and the wafer sheet 34 extends radially as shown in FIG. This so-called expansion widens the space between adjacent electronic components 12.
- the tray supply plate 30 is also held by the plate placement device 19 in a similar manner.
- the plate placement device 19 is movable in the Y-axis direction by a Y-axis robot 48 having a driving motor 47.
- the component push-up device 20 is movable in the X-axis direction by an X-axis robot 52 having a drive motor 51.
- the component push-up device 20 has a push-up head 54 at the tip of an arm 53.
- a push-up needle or push-up pin 56 is accommodated in a holder 55 of the push-up head 54 so as to be able to move up and down.
- the push-up pins 56 also push up the electronic component 12 attached to the wafer sheet 34 with a lower surface force, so that the electronic component 12 is peeled off from the wafer sheet 34.
- the push-up head 54 is rotatable around the Z axis. The configuration and operation of the component push-up device 20 will be described later in detail.
- the recognition camera 21 is mounted on an X-axis robot 59 having a driving motor 58, and is movable in the X-axis direction.
- the recognition camera 21 optically recognizes the position of the electronic component 12 on the wafer supply plate 29 ⁇ the tray supply plate 30 held by the plate arrangement device 19.
- the reversing head device 22 includes a motor 61 for driving.
- the axis robot 62 can move in the X-axis direction.
- the reversing head device 22 includes a suction nozzle 65 for releasably holding the mounting-side surface 12a of the electronic component 12 by the suction force of the vacuum pump 63 (see FIG. 16A).
- the suction nozzle 65 can move up and down and can rotate around the Z axis. Further, the suction nozzle 65 is capable of reversing the vertical direction.
- the configuration and operation of the inversion head device 22 will be described later in detail.
- the component mounting head device 24 can be moved in the X-axis direction by an X-axis robot 67 operated by a driving motor 66.
- the component mounting head device 24 includes a suction nozzle 118 for releasably holding the non-mounting surface 12b of the electronic component 12 by the suction force of the vacuum pump 125 (see FIG. 19).
- the suction nozzle 118 can move up and down and can rotate around the Z axis. The configuration and operation of the component mounting head device 24 will be described later in detail.
- a substrate holder (substrate holder) 72 for holding the substrate 13 releasably and fixing it is provided on the upper surface of the XY table 25, a substrate holder (substrate holder) 72 for holding the substrate 13 releasably and fixing it is provided.
- the substrate holding table 72 holds the substrate 13 supplied by the substrate transfer device 73 (see FIG. 1) that transfers the substrate 13 leftward in the X-axis direction.
- the XY table 25 is provided with motors 74 and 75 for driving in the X-axis and Y-axis directions, and moves the substrate 13 held on the substrate holding table 72 in the X-axis direction and the Y-axis direction. By this movement, the electronic component 12 held by the component mounting head device 24 is positioned with respect to the substrate 13.
- the two-view recognition camera 26 optically recognizes both the electronic component 12 and the substrate 13 held by the component mounting head device 24.
- the plate moving device 18 takes out the wafer supply plate 29 from the magazine 28 of the lifter 17, moves the wafer supply plate 29 in the Y-axis direction, and supplies it to the plate placement device 19.
- the Y-axis robot 48 moves the plate placement device 19 in the Y-axis direction and the X-axis robot 52 Due to the movement of the component push-up device 20 in the X-axis direction, the push-up head 54 is positioned with respect to the displaced electronic component 12 based on the recognition result of the recognition camera 21.
- the reversing head device 22 when the reversing head device 22 is moved by the X-axis robot 62 in the X-axis direction, the reversing head device 22 is positioned with respect to the electronic component 12. Is done.
- the electronic component 12 is peeled off from the wafer sheet 34 by pushing up the electronic component 12 on the lower surface side of the wafer sheet 34 with the push-up pin 56 of the reversing head device 22 in synchronization with the suction operation of the suction nozzle 65 of the reversing head device 22. Then, it is held by the suction nozzle 65.
- the reversing head device 22 holding the electronic component 12 by the suction nozzle 65 moves in the X-axis direction to the delivery position P2 (see FIG. 24) of the electronic component 12, and reverses the direction of the suction nozzle 65.
- the component mounting head device 24 is also moved in the X-axis direction by the X-axis robot 67 to the delivery position P2.
- the suction by the suction nozzle 65 of the reversing head device 22 is released.
- the electronic component 12 is transferred from the reversing head device 22 to the mounting head device 24.
- the mounting head device 24 to which the electronic component 12 has been transferred moves above the substrate 13 on the XY table 25.
- the substrate 13 is moved in the X-axis direction and the Y-axis direction by the XY table 25, the electronic component 12 held by the suction nozzle 118 of the mounting head device 24 based on the recognition result of the two-view recognition camera 26.
- the substrate 13 is positioned with respect to the substrate. After this positioning, the mounting head device 24 mounts the electronic component 12 on the substrate 13. The same operation is performed for the tray supply plate 30.
- the component push-up device 20 includes a base 80 mounted on an X-axis robot 52 having a motor 51 for driving.
- the base end of an arm 53 extending in the Y-axis direction is attached to the base 80.
- the base end of the arm 53 is attached to the base 80 via an LM guide or a straight guide 81 extending in the Z-axis direction.
- the entire arm 53 is moved up and down by a cylinder 82 supported by the base 80.
- the arm 53 has a push-up head 54 at its tip. Further, as shown most clearly in FIG. 14, the push-up head 54 is arranged below the wafer supply plate 29 held by the plate arrangement device 19.
- the push-up head 54 has a casing 83 fixed to the tip of the arm 53.
- a ball spline 84 is attached to the casing 83 so that a spline shaft 85 extends in the vertical direction.
- a pin fixing member 87 that fixes the base end of the plurality of push-up pins 56 to the distal end of the spline shaft 85 is provided. Installed.
- the rotation operation part 86 of the ball spline 84 is The pulley 89 is fixed on the outer periphery of the pulley 89. As shown in FIGS. 11 and 12, a drive belt 93 is stretched between the pulley 89 and a pulley 92 fixed to an output shaft of a motor 91 arranged on the base end side of the arm 53. . Accordingly, the rotation of the motor 91 is converted into rotation of the spline shaft 85 about the Z axis via the pulleys 89 and 92, the drive belt 93, and the rotation operation unit 86.
- the component push-up device 20 includes a lifting drive mechanism 95 that raises and lowers the spline shaft 85.
- a cam follower 98 in contact with a cam 97 fixed to an output shaft of a motor 96 is attached to an upper end of a lever 99, and the lever 99 is vertically moved by a straight guide 100 supported by a casing 83. You can go straight.
- a projection 101 provided at the L-shaped lower end of the lever 99 is in contact with the lower end of the spline shaft 85.
- a coil spring 102 is mounted on the spline shaft 85, and the spline shaft 85 is naturally urged downward by the coil spring 102 in the vertical direction.
- the lower end of the spline shaft 85 is always in contact with the projection 101.
- the rotation of the motor 96 is converted into a linear motion by the force 97 and the cam follower 98, and the linear motion is transmitted to the spline shaft 85 by the lever 99.
- the upper end of the spline shaft 85 is inserted into a hollow holder 55 fixed to the casing 83. As shown in FIG. 14, the tip surface of the holder 55 is in contact with the lower surface of the wafer sheet 34. Further, a plurality of sheet suction holes (not shown) are provided on the tip end surface of the holder 55, and the suction force of the vacuum pump 103 (shown only in FIG. 14) acting through these sheet suction holes. As a result, the lower surface of the wafer sheet 34 is suction-held on the front end surface 55b of the holder 55.
- a pin fixing member 87 is fixed to the upper end of the spline shaft 85 located in the holder 55.
- a plurality of push-up pins 56 are fixed to the pin fixing member 87.
- the operation of the component push-up device 20 will be described. As described above with reference to FIGS. 8 and 9, the expanding operation of the wafer sheet 34 by the plate placement device 19 is performed. Next, after the leading end surface of the holder 55 comes into contact with the lower surface of the wafer sheet 34 by raising the arm 53, the vacuum pump 63 is operated, and the lower surface of the wafer sheet 34 is sucked into the sheet suction hole 55a (see FIG. 14). ). If the type of the electronic component 12 is changed, the spline shaft 85 is rotated by the motor 91 to adjust the angular position of the pin fixing member 87 around the Z axis. Thereby, the arrangement positions of the plurality of push-up pins 56 in plan view can be adjusted according to the electronic component 12.
- the recognition camera 21 recognizes the position of the electronic component 12 to be pushed up.
- the suction nozzle 65 descends and starts sucking the electronic component 12.
- the push-up operation of the electronic component 12 by the push-up pin 56 is executed in synchronization with the upward movement of the suction nozzle 65.
- the suction nozzle 65 rises while sucking and holding the electronic component 12 separated from the wafer sheet 34 by the push-up operation.
- the reversing head device 22 includes a suction nozzle 65 for releasably holding the electronic component 2 and a rotation driving device 102 for rotating the suction nozzle 65 about the Z axis. And a reversing head 103 having the same.
- the reversing head device 22 raises and lowers the reversing head 103 to move the suction nozzle 65 up and down, and supports the reversing head 103 so as to be able to move up and down, and rotates around a reversing center extending in the Y-axis direction.
- a head reversing device 105 that rotates the reversing head 103 to reverse the vertical direction of the suction nozzle 65 is provided.
- the reversing head device 22 includes a head lifting / lowering device 104 and a head frame 106 that supports the head reversing device 105.
- the head frame 106 is mounted on an X-axis robot 62 having a driving motor 61. Accordingly, the reversing head 103 moves in the X-axis direction between the take-out position P1 of the electronic component 12 (see FIG. 24A) and the delivery position P2 of the electronic component 12 (see FIG. 24B).
- the suction nozzle 65 includes a suction hole 65b opened on a flat distal end surface 65a, and a suction channel 65c having one end communicating with the suction hole 65b.
- a vacuum pump 63 is connected to the other end of the adsorption channel 65c.
- the suction hole 65b includes a central portion 65d that communicates with the suction channel 65c, and a plurality of branch portions 65e extending radially from the central portion 65d. In the present embodiment, four branch portions 65e are provided at an angular interval of 90 degrees in plan view or bottom view.
- the shape and dimensions of the suction hole 65b and the tip surface 65a are such that a portion of the tip surface 65a outside the suction hole 65b contacts the bump 39 of the electronic component 12, while the suction hole 65b is formed by the bump 39 of the mounting surface 12a. It is set so that there is a gap with the part that does not exist. Therefore, the suction operation of the vacuum pump 63 causes the suction flow path 65c to pass through the suction hole 65b from the gap between the tip surface 65a of the suction nozzle 65 and the mounting surface 12a.
- the electronic component 12 is held on the distal end face 65a by the negative pressure (dynamic pressure) generated by the air flow.
- the suction nozzle 65 of the reversing head device 22 sucks and holds the electronic component 12 with its tip end surface 65a not in contact with the mounting surface 12a. Therefore, the suction force acts uniformly on the entire mounting surface 12a, and the electronic component 12 can be held on the suction nozzle 65 with high precision without causing deformation such as a radius due to excessive suction force. .
- the outer dimensions of the tip surface 65a of the suction nozzle 65 are such that the outer peripheral edge of the tip surface 65a is, for example, about 25 to 50 / ⁇ inner than the peripheral edge of the electronic component 12 as shown by the symbol tl in FIG. 16A. It is set to be located. Therefore, as shown in FIG. 16C, even when the electronic component 12 accommodated in the concave portion 31a of the tray 31 is in contact with the wall surface forming the concave portion 31a, the distal end surface 65a of the suction nozzle 65 and the wall surface of the concave portion 3la are provided.
- a gap of about 25 to 50 ⁇ m indicated by the symbol t2 is secured between the suction nozzle 65 and the suction nozzle 65, and it is possible to prevent the suction nozzle 65 from interfering with the wall surface of the recess 31a.
- the outer dimensions of the tip surface 65a of the suction nozzle 65 are set such that the outer peripheral edge of the tip surface 65a is located outside the bump 39. Accordingly, the bump 39 reliably comes into contact with the tip surface 65a outside the suction hole 65b, and the electronic component 12 is reliably sucked by the negative pressure generated in the gap between the suction hole 65a and the mounting surface 12a. It is held by the nozzle 65.
- the shape of the suction hole 65b of the suction nozzle 65 is not limited to those shown in FIGS. 16A to 16C.
- eight branch portions 65e arranged at an angle of 45 degrees in plan view or bottom view may be provided.
- the component mounting head device 24 includes a base 111 mounted on an X-axis robot 67 operated by a motor 66 and movable along the X-axis direction.
- a holder 112 is attached to the base 111.
- the holder 112 is attached movably in the vertical direction to the base 111 from the straight guide 113.
- a ball screw shaft 114 extending in the vertical direction is rotatably supported by the base 111.
- a female screw portion 115 fixed to the holder 112 is screwed to the ball screw shaft 114.
- a rotating shaft mechanism 116 extending in the vertical direction is rotatably supported by the holder 112.
- a heater 117 for heating the electronic component 12 is fixed to a lower end of the rotating shaft mechanism 116.
- a suction nozzle 118 is exchangeably mounted below the heater 117.
- the heater 117 is a surface heater having a pulse ceramic heater power.
- the type of the heater 117 is not particularly limited as long as it is suitable for heating the electronic component 12 held by the suction nozzle 118.
- a pulley 120 is fixed to the upper end side of the rotation drive mechanism 116.
- the motor 69 is fixed to the holder 112 such that the output shaft of the motor 69 faces vertically upward.
- the pulley 121 is also fixed to the output shaft of the motor 69.
- a driving belt 122 force S is stretched between the pulleys 120 and 121. Accordingly, the rotation of the motor 69 is transmitted to the rotating shaft mechanism 116 via the pulleys 120 and 121 and the drive belt 122.
- the suction nozzle 118 includes a flat tip surface 118a on which the non-mounting surface 12b of the electronic component 12 is sucked, and a heater positioned opposite to the tip surface 118a. It has a base end face 118b that abuts at 117.
- suction holes 118c are opened in the distal end surface 118a.
- the suction nozzle 118 is provided with four suction channels 118d, one end of which is in communication with the suction holes 118c.
- the other end of the suction channel 118d communicates with a cross-shaped collecting groove 119e formed on the base end face 118b.
- the heater 117 has an adsorption channel 117a having one end communicating with the collecting groove 119e.
- the other end of the suction channel 117a is connected to a vacuum pump 125 (shown only in FIG. 19) via an adsorption channel 116a formed in the rotary shaft mechanism 116. Therefore, the suction hole 118c communicates with the vacuum pump 125 via the suction channels 118d, 117a, and 116a.
- a suction groove 126 communicating with the suction hole 118c is formed in the tip end surface 118a.
- the tip surface 118a of the suction nozzle 118 covers the entire region corresponding to the region (the bonding region 127) of the mounting surface 12a of the electronic component 12 on which the bump 39 is formed.
- the suction groove 126 is formed.
- the suction grooves 126 are formed at a uniform pitch in a region of the front end surface 118a corresponding to the bonding region 127.
- the suction groove 126 has one rectangular part (closed figure part) 131 and a lattice part 132 arranged in the rectangular part 131.
- the rectangular part 131 is located around the tip surface 118a. It is formed along the edge.
- the lattice portion 132 includes three vertical straight portions 133 and three horizontal straight portions 134.
- the vertical linear portions 133 are arranged so as to extend in the vertical direction in FIG. 20A, and are parallel to each other. Further, both ends of each vertical linear portion 133 communicate with the rectangular portion 131.
- the horizontal linear portions 134 are arranged so as to extend in the left-right direction in FIG. 20A, that is, in a direction orthogonal to the vertical linear portions 133, and are parallel to each other.
- each horizontal linear portion 134 communicates with the rectangular portion 131.
- Each horizontal linear portion 134 communicates with a vertical linear portion 133 that intersects.
- Two suction holes 118c are opened to the vertical linear portion 133 arranged at the center. Further, two suction holes 118c are open to the horizontal linear portion 134 arranged at the center.
- the electronic component 12 is sucked and held by the suction nozzle 118 on the non-mounting side surface 12b.
- the suction force (negative pressure) of the vacuum pump 125 is transmitted to the suction holes 118c and the suction grooves 126 via the suction channels 116a, 117a and 118d, and the non-contact of the electronic component 12 is performed from both the suction holes 118c and the suction grooves 126.
- a suction force acts on the mounting side surface 12b.
- the suction force acts on the non-mounting side surface 12b of the electronic component 12 not only from the suction hole 118c but also from the suction groove 126, the entire area of the non-mounting side surface 12b corresponding to the bonding area 127 is the suction nozzle 118. Adsorbed densely on the tip surface 118a. In other words, the electronic component 12 is suction-held by the suction nozzle 118 in a state of having a high flatness, and the warpage of the electronic component 12 is greatly reduced. Since the electronic component 12 has a high flatness and is suction-held densely by the suction nozzle 118, the heat generated by the heater 117 is uniformly transmitted to the entire bonding region 127 of the electronic component 12. As a result, the temperature distribution in the bonding region 127 is made uniform, and the plurality of bumps 39 are heated evenly. be able to.
- the suction groove 126 is densely formed in at least the entire area corresponding to the joining area 127 of the front end surface 118a. It is preferable that they are arranged uniformly. Referring to FIG. 20A, it is preferable that the number of grooves existing in the bonding region 127 where the width w and the pitch p of the suction groove 126 are smaller is large.
- the width w of the suction groove 126 is set to 0.2 mm and the pitch p is set to lmm, if the electronic component 12 having a thickness of about 0.1 mm and a square of about 10 mm is sucked by the suction nozzle 118, The warpage of the electronic component 12 is reduced to about 5 / zm.
- FIGS. 21A to 21C show a first alternative of the suction nozzle 118 of the component mounting head device 24.
- FIG. A rectangular recess 137 is formed on the distal end surface 118a of the suction nozzle 118 between the rectangular portion 131 of the suction groove 126 and the periphery of the distal end surface 118a. Unlike the suction groove 126, the depression 137 is not in communication with the suction hole 118c, and the suction force of the vacuum pump 125 does not act.
- the temperature distribution of the connection region 127 of the electronic component 12 held by the suction nozzle 118 can be made more uniform.
- Other structures and operations of the alternative shown in FIGS. 21A to 21C are the same as those of the suction nozzle 118 shown in FIGS. 19 to 20C.
- FIG. 22A to FIG. 22C show a second alternative of the suction nozzle 118 of the component mounting head device 24.
- the suction groove 126 formed on the tip end surface 118a of the suction nozzle 118 has a grid-like portion 132 composed of three vertical linear portions 133 and three horizontal linear portions 134, but has a rectangular frame shape. It does not have part 131 (see Figure 20A).
- the suction nozzle 118 is provided with one suction hole 118c whose one end communicates with the central portion of the lattice portion 132.
- FIGS. 23A to 23E show various alternatives to the suction nozzle 118.
- the suction groove 126 includes three rectangular portions 131 concentrically arranged so as to surround the center 138 of the region corresponding to the bonding region 127 of the front end surface 118a. Further, the suction groove 126 has four linear portions 139 extending radially from the center 138 of the region corresponding to the joining region 127 of the distal end surface 118a. One end of each linear portion 139 communicates with the inner rectangular portion 131, and the other end communicates with the outer rectangular portion 131. Each linear portion 139 intersects and communicates with the rectangular frame portion 131 at the intermediate position.
- the suction nozzle 118 has four suction holes 118c, and each suction hole 118c communicates with the suction groove 126 at the intersection of the linear portion 139 and the inner rectangular frame portion 131.
- the suction groove 126 includes three circular portions 140 concentrically arranged so as to surround the center 138 of the region corresponding to the bonding region 127.
- the suction groove 126 is medium It has four linear portions 139 extending radially from the core 138. One end of each linear portion 139 communicates with the inner circular portion 140. Also, each linear portion 139 intersects and communicates with the middle and outer circular portions 140.
- the suction groove 126 has four arc-shaped portions 141 between the outer circular portion 140 and the periphery of the distal end surface 118a. The other end of the linear portion 139 extending beyond the outer circular portion 140 to the peripheral side of the distal end surface 118a communicates with the arc portion 141.
- the suction nozzle 118 has four suction holes 118c, and each suction hole 118c communicates with the suction groove 126 at the intersection of the linear portion 139 and the inner circular portion 140.
- the suction groove 126 has a single linear shape. More specifically, of the four sides constituting the periphery of the distal end surface 118a of the suction nozzle 118, a plurality of linear portions 143 extending in parallel with the lateral side in FIG. A plurality of linear portions 144 extending parallel to the sides in the direction are alternately connected to form a spiral suction groove 126.
- the suction nozzle 118 has two suction holes 118c, one suction hole 118c communicating with the suction groove 126 at the inner end, and the other suction hole 118c halfway between the inner end and the outer end. It communicates with the suction groove 126.
- the alternative suction groove 126 in FIG. 23D is also a single line. Specifically, a plurality of linear portions 145 extending parallel to the horizontal sides of the tip end surface 118a of the suction nozzle 118 and a plurality of linear portions 146 extending parallel to the vertical sides are alternately connected. Thus, a rectangular wave-shaped suction groove 126 is formed.
- the suction nozzle 118 has two suction holes 118c, and the suction holes 118c communicate with the suction grooves 126 at the vertical linear portions 146.
- the suction groove 126 has one rectangular portion 131 surrounding the center 138 of the region corresponding to the joining region 127 of the tip end surface 118a. Further, the suction groove 126 has four linear portions 147 and four broken line portions 148 between the rectangular portion 131 and the periphery of the tip end surface 118a. The linear portion 147 and the broken line portion 148 are arranged concentrically with the rectangular portion 131, and are arranged on a virtual rectangle larger than the rectangular portion 131. Further, the suction groove 126 has eight linear portions 149 extending radially from the center 138. One end of each linear portion 149 communicates with the rectangular portion 131, and the other end communicates with the linear portion 147 or the broken line portion 148.
- the suction nozzle 118 has four suction holes 118c, and these suction holes 118c communicate with the suction grooves 126 at the corners of the rectangular portion 131.
- the shape, size, number, and arrangement position of the suction holes, suction grooves, and depressions formed on the tip end surface of the suction nozzle 118 of the component mounting head device 24 are not limited to the above examples.
- the size, shape, material, and number of bumps 39 of the electronic component 12 are varied according to the ease so that the area corresponding to the bonding area 127 of the non-mounting side surface 12b is in close contact with the tip end face 118a of the suction nozzle 118. Can be set.
- the suction nozzle 65 of the reversing head device 22 removes the electronic component 12 from the wafer supply plate 29 or the tray supply plate 30. Adsorb. At this time, the suction nozzle 65 is oriented vertically upward and holds the mounting side surface 12a of the electronic component 12.
- the suction nozzle 65 moves up, the mounting head device 24 moves to the delivery position P2.
- the reversing head device 22 holding the electronic component 12 on the suction nozzle 65 moves to the delivery position P2 and is disposed below the mounting head device 24.
- the direction of the reversing head 103 is reversed, and as a result, the non-mounting side surface 12b opposite to the mounting side surface 12a of the electronic component 12 is oriented vertically upward.
- the suction nozzle 118 of the mounting head device 24 descends to suck and hold the electronic component 12.
- the electronic component 12 is held by the holding unit 70 with the mounting side surface 12a vertically downward (the non-mounting side surface 12b vertically upward).
- the mounting head device 24 moves above the substrate 13, and the electronic component 12 is positioned with respect to the substrate 13 so that the substrate electrode 135 and the bump 39 match. Subsequently, the suction nozzle 118 descends, and the bump 39 is pressed against the substrate electrode 135. Further, the electronic component 12 is heated by the heater 117. The bump 39 and the substrate electrode 135 are joined by this pressurization and heating, and the electronic component 12 is mounted on the substrate 13.
- the suction nozzle 65 of the reversing head device 22 holds the electronic component 12 in a state where the tip surface 65a is not in contact with the mounting surface 12a. Therefore, the suction force acts uniformly on the entire mounting surface 12a, and the electronic component 12 can be held on the suction nozzle 65 with high accuracy without causing deformation such as a radius due to excessive suction I force. . As a result, the reversing head The accuracy of transferring components from the device 22 to the component mounting head device 24 is improved.
- a suction groove 126 communicating with the suction hole 118c is formed on the entire surface of the tip surface 118a of the suction nozzle 118 of the component mounting head device 24 corresponding to the bonding area 127 of the electronic component 12. Therefore, a region corresponding to the bonding region 127 of the non-mounting side surface 12b of the electronic component 12 is densely sucked to the tip end surface 118a of the suction nozzle 118, and has high flatness. As a result, the temperature distribution in the bonding region 127 is made uniform, and the plurality of bumps 39 are heated evenly, so that the plurality of bumps 39 can be bonded to the substrate electrode 135 in a uniform bonding state.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/596,577 US7650691B2 (en) | 2004-05-17 | 2005-05-16 | Component supply head device and component mounting head device |
CNB2005800157863A CN100493325C (zh) | 2004-05-17 | 2005-05-16 | 部件供给头装置和部件安装头装置 |
EP05739239A EP1753284A4 (en) | 2004-05-17 | 2005-05-16 | TOP PIECE SUPPLYING DEVICE AND TOP PIECE MOUNTING DEVICE |
US12/626,799 US20100064510A1 (en) | 2004-05-17 | 2009-11-27 | Component supply head device and component mounting head device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-146075 | 2004-05-17 | ||
JP2004146075A JP4516354B2 (ja) | 2004-05-17 | 2004-05-17 | 部品供給方法 |
JP2004-167117 | 2004-06-04 | ||
JP2004167117A JP4354873B2 (ja) | 2004-06-04 | 2004-06-04 | 電子部品実装ツール |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/626,799 Division US20100064510A1 (en) | 2004-05-17 | 2009-11-27 | Component supply head device and component mounting head device |
Publications (2)
Publication Number | Publication Date |
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WO2005112537A1 true WO2005112537A1 (ja) | 2005-11-24 |
WO2005112537A9 WO2005112537A9 (ja) | 2006-01-12 |
Family
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/008902 WO2005112537A1 (ja) | 2004-05-17 | 2005-05-16 | 部品供給ヘッド装置及び部品実装ヘッド装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7650691B2 (ja) |
EP (1) | EP1753284A4 (ja) |
JP (1) | JP4516354B2 (ja) |
KR (1) | KR20070011496A (ja) |
CN (1) | CN100493325C (ja) |
TW (1) | TW200603304A (ja) |
WO (1) | WO2005112537A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
EP1753284A4 (en) | 2008-08-06 |
KR20070011496A (ko) | 2007-01-24 |
CN1954652A (zh) | 2007-04-25 |
JP4516354B2 (ja) | 2010-08-04 |
US20080040917A1 (en) | 2008-02-21 |
US7650691B2 (en) | 2010-01-26 |
WO2005112537A9 (ja) | 2006-01-12 |
US20100064510A1 (en) | 2010-03-18 |
TW200603304A (en) | 2006-01-16 |
CN100493325C (zh) | 2009-05-27 |
JP2005327971A (ja) | 2005-11-24 |
EP1753284A1 (en) | 2007-02-14 |
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