WO2005099314A1 - Improved thick film dielectric structure for thick dielectric electroluminescent displays - Google Patents
Improved thick film dielectric structure for thick dielectric electroluminescent displays Download PDFInfo
- Publication number
- WO2005099314A1 WO2005099314A1 PCT/CA2005/000538 CA2005000538W WO2005099314A1 WO 2005099314 A1 WO2005099314 A1 WO 2005099314A1 CA 2005000538 W CA2005000538 W CA 2005000538W WO 2005099314 A1 WO2005099314 A1 WO 2005099314A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thick film
- film dielectric
- smoothing layer
- layer
- surfactant
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3642—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating containing a metal layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3655—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating containing at least one conducting layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3657—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having optical properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3671—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use as electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/116—Deposition methods from solutions or suspensions by spin-coating, centrifugation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/119—Deposition methods from solutions or suspensions by printing
Definitions
- Dielectric breakdown is associated with random defects in the dielectric layers and the probability of breakdown increases with increasing display area. Thus layers with a higher nominal dielectric strength are desired for use for larger area displays to counteract this tendency.
- the Applicant's International Patent Application PCT CA02/01932 discloses a modified thick film paste formulation used to make a thick film dielectric layer. This modified thick film dielectric layer may be sintered at temperatures as low as 650°C to facilitate the use of a glass substrate. However, the nxodified thick film dielectric layer still contains residual porosity. It is therefore desired to provide an improved composite thick film dielectric structure that exhibits fewer defects (i.e. pores or holes) which potentially act as sites for dielectric breakdown and provide a conduit for undesirable reaction-s between the thick film dielectric layer and phosphor layers leading to reduced display life.
- Surfactants have also been contemplated for use with certain low dielectric constant ceramics (U.S. 2003/0219906) or within thick film pastes for facilitating their deposition in high resolution patterns for defining electrical circuits (U.S. 2003/02111406), however, they have never been contemplated for use within a smoothing layer for a high dielectric thick film composition nor have been contemplated for use to correct defects within smoothing layers used in conjunction with high dielectric thick film compositions.
- the improved smoothing layer of the invention can be provided as sol solution and applied onto a thick film dielectric layer using a MOD process that significantly reduces the density of defects on the surface of the resulting composite thick film dielectric layer.
- the sol solution can be applied using sol gel techniques known to those of skill in the art.
- the sol gel or MOD layer is formulated to provide a high dielectric constant material that in aspects is a compatible piezoelectric or ferroelectric material such as a lead zirconate titanate (PZT) smoothing layer as described in the Applicant's WO 00/70917 and PCT CA02/01932 (the disclosures of which are incorporated herein by reference in their entirety).
- PZT lead zirconate titanate
- the MOD solution comprises lead acetate, titanium alkoxide and zirconium alkoxide in a suitable solvent .
- the surfactant is added to this mixture.
- the behaviour of the MOD solution used to deposit the smoothing layer is significantly different for glass substrates than it is for the alumina substrates described in the prior art.
- the surfactant for use in the smoothing layer may be selected from any surfactant that is compatible with the high temperature chemistry that occurs when the MOD solution is fired at high temperature to form the smoothing layer without substantively impairing the high dielectric constant of the smoothing layer itself or reducing the high dielectric strength that the smoothing layer imparts to the overall thick dielectric structure.
- the surfactant is in aspects non-ionic and should be fully miscible with the MOD solvent, which is in aspects is ethylene glycol.
- the surfactant should fully decompose so as not to leave a solid residue within the smoothing layer when it is fired at about 500°C.
- the vehicle is formulated to provide appropriate deposition properties, and does not have a significant effect on the properties of the sintered thick film dielectric layer provided that the constituent elements are burned or volatilized off as the deposited films are heated prior to sintering.
- the properties of the vehicle are important in achieving the deposition of defect free layers, as is the milling time of the paste to reduce the size of the particulates in the paste.
- the viscosity, as well as the solid-to-liquid ratio of the paste are important parameters in determining an optimum paste for defect free printing or deposition.
- the optimum viscosity and solid-to-liquid fraction are different for deposition on glass material substrates than they are for deposition on ceramic substrates, possibly because of differences in their micro-roughness.
- the present invention enables achievement of a composite thick film dielectric structure without or with minimal mechanical defects such as pores, holes, cracks and voids that also has acceptably low pyrochlore content to respectively achieve adequate dielectric breakdown strength and a high dielectric constant. This is achieved by a judicious choice of chemical composition and physical properties of the thick film pastes used to form the thick film portion of the composite dielectric layer and the chemical composition and physical properties of the surfactant MOD solution for the smoothing layer.
- the mechanical integrity of electroluminescent devices constructed using the present invention are dependent on the physical properties of the substrate, particularly the thermal expansion coefficient of the substrate.
- a composite thick film dielectric structure for an electroluminescent display is constructed on a rigid substrate where the upper surface of which has a smoothing layer with an areal density of pit defects of less than about 100 defects per square millimeter.
- a pit defect is defined as a hole or depression in the surface the depth of which exceeds 0.5 micrometers.
- a composite thick film dielectric structure for an electroluminescent display comprises a magnesium lead niobate thick film layer formed by printing, compressing and sintering a paste containing a high dielectric constant dielectric powder and overlaying it with at least one smoothing layer of lead zirconate-titanate formed by a process of depositing and firing a MOD solution wherein the solution comprises organo-metallic precursor compounds required to form the smoothing layer and a surfactant comprising that lowers the interfacial surface tension between the MOD solution and the thick film dielectric layer.
- Example 1 With reference to the schematic diagrams of Figure 1 and Figure 2, a set of gold row electrodes 2 and a thick film dielectric layer 3 for a 43 centimeter diagonal electroluminescent display were constructed on a PP8C glass substrate 1 obtained from Nippon Electric Glass Co. Ltd. of Osaka Japan.
- the methods for deposition of the row electrodes and the thick dielectric layer were similar to the methods described in U.S. Patent Application serial number 09/326,777 in combination with the methods described herein.
- the gold electrode layer was deposited onto the substrate prior to deposition of a thick film dielectric layer.
- the thick film dielectric layer was formed of two sequentially formed layers with the process for depositing each layer consisting of printing a thick film paste, drying the printed layer, densifying the printed layer using isostatic pressing and finally sintering the densified layer.
- the densification process was carried out using cold isostatic pressing as taught in U.S. Patent Application 09/540,288 (the disclosure of which is incorporated herein by reference in its entirety).
- the sintering was carried out under air in a belt furnace at a peak temperature of 700°C. The total transit time through the belt furnace was 75 minutes.
- the thick film paste was formulated with perovskite- forming powdered precursor materials including 600 grams of PMN obtained from Ferro Corporation of Niagara Falls, NY USA, 18 grams of lead oxide, 20 grams of lead titanate and 20 grams of barium titanate, all with a typical particle diameter of about one micrometer and an additional 6 grams of barium titanate obtained from TPL of Albuquerque, NM, USA with a particle diameter of about 50 nanometers.
- the precursor materials were blended into a slurry consisting of a solution of 293 grams of alpha- terpineol, 5 grams of acetone, 4 grams of Emphos PS-220 obtained from Witco of Houston, TX and 4 grams of di-n-butyl phthalate into which 15 grams of CF 7589 glass frit obtained from Ferro Electronic Materials of 4511 Hyde Park Blvd. Niagara Falls, NY USA was added and milled for about two hours until the frit particle size was reduced to about one micrometer.
- the resulting slurry was further milled for an additional two hours and then passed through a 10 micrometer filter to remove large particles. The milling was carried out using a zirconia 3 mm ball mill to minimize contamination.
- the viscosity of the solution was measured using a falling ball viscometer to be 25 centipoise, the optical absorbance of the solution was measured to be in the range of 0.05 to 0.2% at 400 nanometers using an Ultrospec 1000 UN/Nisible Spectrophotometer and the water content was measured to be in the range of 0.5 to 1.2 % using Karl Fisher analysis.
- the MOD solution was stored under argon until it was spun onto the thick film dielectric layer described earlier using a spin rate of 350 rpm. The coated substrate was then fired in a belt furnace under air at a peak temperature of 700°C for 75 minutes. Following firing, a second MOD solution was prepared using a MOD solution similar to that used for the first layer, but without the surfactant added.
- the viscosity of this solution was adjusted to 9 cps and was spin coated onto the first MOD layer under the same conditions as the first MOD layer to form the completed composite thick dielectric structure.
- the combined thickness of the two MOD derived layers was about 1500 nanometers.
- the surface of the completed composition dielectric layer was examined under a microscope. A photomicrograph of the surface is shown in Figure 3. Only a small number of defects in the form of pits or indentations in the surface are evident in the photomicrograph. The areal density of pit defects is about 50 defects per square millimeter.
- Figure 5 shows a histogram with the number of defects for several 0.15 square millimeter sections of a thick dielectric layer made according to the method of the prior art without the use of a surfactant in the MOD solution used to form the smoothing layer as compared to the number of defects for several sections of a similar thick dielectric layer with the same area made according to the method of the invention.
- the sections were selected from comparable areas of thick film deposited on the 43 centimeter diagonal substrates of examples 1 and 2.
- the approximate location of the selected areas for the panels made with and without surfactant added to the MOD solution are shown in Figure 6.
- the numbered locations in Figure 6 correspond to the locations identified on the horizontal axis of Figure 5.
- the defects density was reduced by about a factor of about 5 using the methods of the invention. Further the variability in the defect density at different locations on the substrate was substantially reduced, indicating the invention improves the uniformity of the surface quality over that achievable with the methods of the prior art.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002561618A CA2561618A1 (en) | 2004-04-09 | 2005-04-08 | Improved thick film dielectric structure for thick dielectric electroluminescent displays |
JP2007506627A JP2007533068A (en) | 2004-04-09 | 2005-04-08 | Improved thick film dielectric structures for thick dielectric light emitting displays |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56060204P | 2004-04-09 | 2004-04-09 | |
US60/560,602 | 2004-04-09 |
Publications (1)
Publication Number | Publication Date |
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WO2005099314A1 true WO2005099314A1 (en) | 2005-10-20 |
Family
ID=35125477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CA2005/000538 WO2005099314A1 (en) | 2004-04-09 | 2005-04-08 | Improved thick film dielectric structure for thick dielectric electroluminescent displays |
Country Status (5)
Country | Link |
---|---|
US (1) | US7741773B2 (en) |
JP (1) | JP2007533068A (en) |
CN (1) | CN100551191C (en) |
CA (1) | CA2561618A1 (en) |
WO (1) | WO2005099314A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009514177A (en) * | 2005-11-02 | 2009-04-02 | アイファイアー・テクノロジー・コープ | Conformal laminated seal for electroluminescent display |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US20170194515A9 (en) * | 2007-10-17 | 2017-07-06 | Heraeus Precious Metals North America Conshohocken Llc | Dielectric coating for single sided back contact solar cells |
KR100963834B1 (en) | 2008-11-18 | 2010-06-15 | 희성전자 주식회사 | Inorganic electro-luminescence structure having improved luminance |
CN102432288A (en) * | 2011-09-16 | 2012-05-02 | 东南大学 | Preparation method of cracking-free lead lanthanum zirconate titanate film |
KR20140108244A (en) | 2011-12-19 | 2014-09-05 | 이노피슈코아트 게엠베하 | Luminous elements with an electroluminescent arrangement and method for producing a luminous element |
GB201219511D0 (en) | 2012-10-30 | 2012-12-12 | Liverpool The | Composite material |
US10170297B2 (en) | 2013-08-22 | 2019-01-01 | Versum Materials Us, Llc | Compositions and methods using same for flowable oxide deposition |
CN109053225B (en) * | 2018-08-16 | 2021-07-20 | 佛山市东鹏陶瓷有限公司 | Piezoelectric inducible negative ion surface glaze, ceramic tile and preparation process of ceramic tile |
CN110342935A (en) * | 2019-06-20 | 2019-10-18 | 广东捷成科创电子股份有限公司 | Modified lead magnesium niobate-lead titanate base piezoelectricity ferro thick-film material of a kind of Sm and preparation method thereof |
Citations (3)
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US6042751A (en) * | 1998-09-17 | 2000-03-28 | E. I. Du Pont De Nemours And Company | Thick film conductor composition for use in biosensors |
JP2003095657A (en) * | 2001-09-25 | 2003-04-03 | Taki Chem Co Ltd | Titanium oxide sol dispersed in organic solvent and method of manufacturing it |
US6699797B1 (en) * | 2002-12-17 | 2004-03-02 | Intel Corporation | Method of fabrication of low dielectric constant porous metal silicate films |
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US5209814A (en) | 1991-09-30 | 1993-05-11 | E. I. Du Pont De Nemours And Company | Method for diffusion patterning |
US5432015A (en) | 1992-05-08 | 1995-07-11 | Westaim Technologies, Inc. | Electroluminescent laminate with thick film dielectric |
US7166470B2 (en) | 1994-10-18 | 2007-01-23 | Symyx Technologies, Inc. | Formation of combinatorial arrays of materials using solution-based methodologies |
US5874516A (en) | 1995-07-13 | 1999-02-23 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ethers) |
JP3871373B2 (en) | 1996-05-10 | 2007-01-24 | 株式会社きもと | How to make display |
US6406803B1 (en) | 1997-05-19 | 2002-06-18 | 3M Innovative Properties Company | Electroluminescent device and method for producing the same |
US6613455B1 (en) | 1999-01-14 | 2003-09-02 | 3M Innovative Properties Company | Electroluminescent device and method for producing same |
JP4030243B2 (en) * | 1999-12-20 | 2008-01-09 | 日本電気株式会社 | Ferroelectric thin film forming solution and ferroelectric thin film forming method |
US6551720B2 (en) | 2000-05-02 | 2003-04-22 | Sarnoff Corporation | Materials to fabricate a high resolution plasma display back panel |
US7052824B2 (en) | 2000-06-30 | 2006-05-30 | E. I. Du Pont De Nemours And Company | Process for thick film circuit patterning |
US20020076543A1 (en) | 2000-12-19 | 2002-06-20 | Sikonia John G. | Layered dielectric nanoporous materials and methods of producing same |
AU2002350325A1 (en) | 2001-12-21 | 2003-07-15 | Ifire Technology Inc. | Low firing temperature thick film dielectric layer for electroluminescent display |
US7241512B2 (en) | 2002-04-19 | 2007-07-10 | 3M Innovative Properties Company | Electroluminescent materials and methods of manufacture and use |
-
2005
- 2005-04-06 US US11/100,190 patent/US7741773B2/en not_active Expired - Fee Related
- 2005-04-08 WO PCT/CA2005/000538 patent/WO2005099314A1/en active Application Filing
- 2005-04-08 JP JP2007506627A patent/JP2007533068A/en not_active Withdrawn
- 2005-04-08 CA CA002561618A patent/CA2561618A1/en not_active Abandoned
- 2005-04-08 CN CNB2005800122239A patent/CN100551191C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6042751A (en) * | 1998-09-17 | 2000-03-28 | E. I. Du Pont De Nemours And Company | Thick film conductor composition for use in biosensors |
JP2003095657A (en) * | 2001-09-25 | 2003-04-03 | Taki Chem Co Ltd | Titanium oxide sol dispersed in organic solvent and method of manufacturing it |
US6699797B1 (en) * | 2002-12-17 | 2004-03-02 | Intel Corporation | Method of fabrication of low dielectric constant porous metal silicate films |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009514177A (en) * | 2005-11-02 | 2009-04-02 | アイファイアー・テクノロジー・コープ | Conformal laminated seal for electroluminescent display |
JP2014123579A (en) * | 2005-11-02 | 2014-07-03 | Ifire Ip Corp | Electroluminescent display |
Also Published As
Publication number | Publication date |
---|---|
JP2007533068A (en) | 2007-11-15 |
CA2561618A1 (en) | 2005-10-20 |
CN100551191C (en) | 2009-10-14 |
US7741773B2 (en) | 2010-06-22 |
US20050255708A1 (en) | 2005-11-17 |
CN1947467A (en) | 2007-04-11 |
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