WO2005098940A2 - Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel - Google Patents
Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel Download PDFInfo
- Publication number
- WO2005098940A2 WO2005098940A2 PCT/US2005/010177 US2005010177W WO2005098940A2 WO 2005098940 A2 WO2005098940 A2 WO 2005098940A2 US 2005010177 W US2005010177 W US 2005010177W WO 2005098940 A2 WO2005098940 A2 WO 2005098940A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- die
- microchannel
- rear surface
- microchannels
- coolant
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 36
- 239000002826 coolant Substances 0.000 title claims abstract description 35
- 239000010409 thin film Substances 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- PUZSUGPVBHGJRE-UHFFFAOYSA-N tellanylideneberyllium Chemical compound [Te]=[Be] PUZSUGPVBHGJRE-UHFFFAOYSA-N 0.000 claims description 5
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 4
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 208000032368 Device malfunction Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- FIG. 1 is a partial schematic side cross-sectional view of an integrated circuit (IC) die with a portion of a cooling system and packaging for the die, as provided according to some embodiments.
- FIG. 2 is a partial schematic cross-sectional view from above, taken at line II-II in FIG. 1.
- FIG. 3 is block diagram showing the die of FIG. 1, with additional components of the cooling system for the die.
- FIG. 4 is a view similar to FIG. 1, showing the IC die and a portion of the cooling system and die packaging as provided according to some other embodiments.
- FIG. 5 is a view similar to FIGS. 1 and 4, showing the IC die and a portion of the cooling system and die packaging as provided according to still other embodiments.
- FIG. 6 is a block diagram of a computer system that includes an example of an IC die associated with a cooling system as in one or more of FIGS. 1-5.
- FIG. 1 is a partial schematic side cross-sectional view of an integrated circuit (IC) die 10 with a portion of a cooling system 12 and a die packaging substrate 14, as provided according to some embodiments. To simplify the drawing, various aspects of the die package are omitted.
- FIG. 2 is a partial schematic cross-sectional view of the IC die and cooling system, taken in plan view at line II-II in FIG. 1. Both FIGS. 1 and 2 show simplified examples of the cooling system components, and in practice the layout of cooling system components may be much more complex than illustrated in the drawings. In general the drawings herein are not to scale. Referring to FIG. 1, the IC die 10 is mounted on the package substrate 14 in a conventional "flip-chip" arrangement.
- the IC die 10 may be formed of a conventional semiconductor material such as silicon.
- the IC die 10 has front surface 16 on which an integrated circuit 18 (e.g., a microprocessor) is formed.
- the integrated circuit 18 is directly coupled to the package substrate 14 by die bumps 20. (Traces, etc., present in the substrate 14, and to which the integrated circuit 18 is coupled by the die bumps 20, are not separately shown. "Landside" bumps on the package substrate 14 are also omitted from the drawing.
- the die bumps 20 may be more numerous than as depicted in FIG. 1.)
- the IC die 10 also has a rear surface 22 that is opposite to the front surface 16 of the IC die 10.
- a microchannel member 24 is bonded to the rear surface 22 of the IC die 10 by bonding material 26.
- Grooves 28 are formed in the front side 29 of the microchannel member 24 to allow the microchannel member 24 to define microchannels 30.
- the front side 29 of the microchannel member 24 faces the rear surface 22 of the IC die 10.
- the grooves 28 of the microchannel member 24 define the microchannels 30 in cooperation with the rear surface 22 of the IC die 10, with the rear surface 22 forming the floors of the microchannels 30.
- the grooves 28 may have a rectangular cross-section (as depicted in the drawing) so that the microchannels 30 also have a rectangular cross-section, but other shapes of cross-section are also possible.
- the microchannels 30 may have a height (distance from rear surface 22 of the IC die 10 to the top wall 32 of the groove 28) of about 300 microns and a width (distance from one side wall 34 of the groove 28 to the other side wall 36 of the groove 28) of about 200 microns, but other dimensions of the microchannels 30 are possible. In a practical embodiment, the number of microchannels may be much more than the relatively few microchannels depicted in the drawing.
- the microchannel member 24 may be a heat spreader, such as an integrated heat spreader (HIS) formed of copper or aluminum, which may be provided in accordance with conventional practices except for the presence of the grooves 28.
- HIS integrated heat spreader
- the member 24 may not be a heat spreader, but may still be formed of copper or aluminum, or alternatively of silicon.
- the grooves 28 may be formed in the member 24 by a lithographic process or by micro-machining. Bonding of the member 24 to the rear surface 22 of the IC die 10 may be with gold or solder or by another suitable technique such as thermal compression bonding.
- the member 24 (whether or not it is a heat spreader) may be substantially thicker than the height of the microchannels 30, and the microchannels may be much narrower than suggested by the drawings.
- the microchannels 30 are provided to allow a coolant (not shown) to flow through the microchannels 30. In some embodiments, the coolant may be de-ionized water.
- Flow of the coolant through the microchannels 30 is schematically represented by arrows 38 in FIG. 2.
- coolant may flow through a microchannel 30 even if an arrow 38 is not indicated in the particular microchannel.
- the manner of defining the microchannels depicted in FIG. 1 contrasts with a previously proposed practice of forming microchannels by lithography or the like directly in the rear surface of the IC die.
- the microchannels 30 need not all be straight and parallel to each other.
- the cooling system 12 also includes, in addition to the microchannels 30, thin film thermoelectric cooling (TFTEC) devices 40.
- TFTEC thin film thermoelectric cooling
- the TFTEC devices 40 are formed on the rear surface 22 of the IC die 10 and are located in at least some of the microchannels 30. Terminals 42 (seen in FIG. 2) are provided at ends 44 of the TFTEC devices 40. Except as schematically indicated at 46 in FIG. 2, leads to supply electrical power to drive the TFTEC devices 40 are not shown to simplify the drawing. However, such leads are present, and may be formed on the rear surface 22 of the IC die 10 at the terminals 42. The leads may be isolated from the coolant to prevent electrical shorts by covering the leads with an insulating layer (not shown) such as silicon oxide. In addition, or alternatively, the coolant may be a dielectric or de-ionized water.
- two or more TFTEC devices 40 may be formed in a vertical stack.
- a stacked pair of TFTEC devices 40 may be provided.
- the two TFTEC devices 40 of a stacked pair need not be coterminous.
- each TFTEC device 40 may have a thickness of about 5 microns, a width in the range of 5 to 50 microns and a length in the range of 5 to 50 microns.
- the TFTEC devices 40 may in some embodiments be formed of a material such as silicon germanium superlattice or beryllium telluride (Be 2 Te 3 ). As suggested by the drawings, the TFTEC devices 40 may be present in some but not all of the microchannels 30, in some embodiments. In particular, TFTEC devices may be placed at specific locations that may be hotspots on the IC die 10. In other embodiments, TFTEC devices 40 are present in all of the microchannels 30.
- FIG. 3 is a block diagram showing the IC die 10, with additional components of the cooling system 12.
- the microchannels 30 and the TFTEC devices 40 are shown as separate blocks in phantom, although in practice the TFTEC devices 40 are located in the microchannels 30.
- the cooling system 12 includes a coolant circulation system 48 to supply the coolant to the microchannels 30.
- the coolant circulation system 48 may be in fluid communication with the microchannels 30 via one or more coolant supply channels 50 and one or more coolant return channels 52.
- a pump and a heat exchanger located remotely from the die 10 may be included in the coolant circulation system 48.
- the coolant system 12 also includes a drive circuit 54 that is coupled to the TFTEC devices 40 to supply electrical power to the TFTEC devices 40.
- the drive circuit 54 may be mounted on the package for the IC die 10. (Only the package substrate 14 is shown in the drawings.)
- the drive circuit 54 may also supply power to the integrated circuit 18 (FIG. 1).
- the integrated circuit 18 and the TFTEC devices 40 may share a power supply, in some embodiments.
- a second tier 56 of microchannels 30 is provided above the first tier 58 of microchannels 30 in a cooling system 12a. In the embodiments illustrated in FIG.
- the microchannel member 24 is not much thicker than the height of the microchannels 30 of the first tier 58 and is interposed between the IC die 10 and a heat spreader (or other member) 60.
- the microchannels of the first tier 58 are defined by the rear surface 22 of the IC die 10 and by grooves 28 in the microchannel member 24; and the microchannels of the second tier 56 are defined by the rear surface 62 of the microchannel member 24 and grooves 28 in the heat spreader 60.
- the floor of the microchannels of the second tier 56 is formed by the rear surface 62 of the microchannel member 24.
- the microchannel member 24 may be formed of copper, aluminum or silicon in some embodiments.
- the heat spreader 60 may, for example, be formed of copper or aluminum.
- the heat spreader 60 may have a thickness that is substantially greater than the height of the microchannels of the second tier 56.
- the height of the microchannels of the second tier 56 may be substantially the same (e.g., 300 microns) as the height of the microchannels of the first tier 58.
- a microchannel member 24a has grooves 28 that face down and grooves 64 that face up.
- the cooling system 12b includes a first tier 58 of microchannels and a second tier 56a of microchannels.
- the microchannel member 24a is interposed between a heat spreader 60a and the rear surface 22 of the IC die 10.
- the microchannels of the first tier are defined by the rear surface 22 of the IC die 10 and by the downward-facing grooves 28 in the microchannel member 24, but the microchannels of the second tier 56a of FIG. 5 are defined by the front surface 66 of the heat spreader 60a and the upward-facing grooves 64 in the microchannel member 24a.
- the top wall of the microchannels of the second tier 56a is formed by the front surface 66 of the heat spreader 60a.
- the cooling systems 12a and 12b may have substantially the same coolant circulation systems and drive circuit as the cooling system 12 of FIGS. 1-3.
- coolant supplied by the coolant circulation system 48 (FIG. 3) flows through the microchannels 30 at or above the rear surface of the IC die 10 to aid in cooling the IC die 10.
- the coolant is operated with two phases—liquid and vapor. That is, in some embodiments at least part of the coolant in the microchannels is in a gaseous state.
- the coolant is single phase—that is, all liquid.
- two phase operation is employed with a single tier of microchannels.
- single phase operation is employed with two or more tiers of microchannels. In either case, the thermal resistance of the cooling system may be very low.
- single phase operation is employed with a single tier of microchannels.
- the IC die is cooled by operation of the TFTEC devices 40 formed on the rear surface of the IC die.
- the presence of the TFTEC devices may mitigate effects of hotspots on the IC die due to localized characteristics of the integrated circuit 18.
- the coolant flowing on the top ("hot side") of the TFTEC devices may enhance the effectiveness of the TFTEC devices by aiding in dissipation of the heat transported by the TFTEC devices from the IC die.
- the combination of the coolant flowing in the microchannels and the operation of the TFTEC devices may aid in achieving a lower average temperature for the IC die than is achieved by conventional die cooling arrangements.
- the cooling systems described herein which include both microchannels at and or adjacent to the rear surface of the IC die, and TFTEC devices formed on the rear surface of the IC die in at least some of the microchannels, may be applicable both to conventional flip-chip mounted dies and to so-called "thin die thin TIM" IC packages, where "TIM" refers to thermal interface material.
- TIM refers to thermal interface material.
- FIG. 6 is a block diagram of a system 100 in which such a die 10 may be incorporated.
- a cooling system 12 as disclosed hereinabove or a cooling system 12a or 12b may be associated with the die 10.
- the die 10 includes many sub-blocks, such as arithmetic logic unit (ALU) 104 and on-die cache 106.
- the microprocessor on die 10 may also communicate to other levels of cache, such as off-die cache 108. Higher memory hierarchy levels, such as system memory 110, are accessed via host bus 112 and chipset 114.
- ALU arithmetic logic unit
- off-die functional units such as graphics accelerator 116 and network interface controller (NIC) 118, to name just a few, may communicate with the microprocessor on die 10 via appropriate busses or ports.
- NIC network interface controller
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112005000672.7T DE112005000672B4 (en) | 2004-03-29 | 2005-03-25 | Cooling an integrated circuit chip with cooling fluid in a microchannel and a thermoelectric thin film cooling device in the microchannel |
CN2005800069580A CN1930681B (en) | 2004-03-29 | 2005-03-25 | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/811,597 | 2004-03-29 | ||
US10/811,597 US7633752B2 (en) | 2004-03-29 | 2004-03-29 | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005098940A2 true WO2005098940A2 (en) | 2005-10-20 |
WO2005098940A3 WO2005098940A3 (en) | 2005-12-08 |
Family
ID=34980087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/010177 WO2005098940A2 (en) | 2004-03-29 | 2005-03-25 | Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
Country Status (6)
Country | Link |
---|---|
US (2) | US7633752B2 (en) |
KR (1) | KR100970031B1 (en) |
CN (1) | CN1930681B (en) |
DE (1) | DE112005000672B4 (en) |
TW (1) | TWI259570B (en) |
WO (1) | WO2005098940A2 (en) |
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2004
- 2004-03-29 US US10/811,597 patent/US7633752B2/en not_active Expired - Fee Related
-
2005
- 2005-03-23 TW TW094109009A patent/TWI259570B/en not_active IP Right Cessation
- 2005-03-25 CN CN2005800069580A patent/CN1930681B/en not_active Expired - Fee Related
- 2005-03-25 DE DE112005000672.7T patent/DE112005000672B4/en not_active Expired - Fee Related
- 2005-03-25 WO PCT/US2005/010177 patent/WO2005098940A2/en active Application Filing
- 2005-03-25 KR KR1020067020172A patent/KR100970031B1/en active IP Right Grant
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2009
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Also Published As
Publication number | Publication date |
---|---|
DE112005000672B4 (en) | 2018-02-01 |
US7957137B2 (en) | 2011-06-07 |
KR100970031B1 (en) | 2010-07-16 |
DE112005000672T5 (en) | 2008-02-28 |
KR20060123783A (en) | 2006-12-04 |
US20050213301A1 (en) | 2005-09-29 |
TWI259570B (en) | 2006-08-01 |
WO2005098940A3 (en) | 2005-12-08 |
US20100046167A1 (en) | 2010-02-25 |
CN1930681B (en) | 2011-04-27 |
CN1930681A (en) | 2007-03-14 |
TW200537667A (en) | 2005-11-16 |
US7633752B2 (en) | 2009-12-15 |
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