WO2005096377A1 - A heat exchanger - Google Patents

A heat exchanger Download PDF

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Publication number
WO2005096377A1
WO2005096377A1 PCT/AU2005/000475 AU2005000475W WO2005096377A1 WO 2005096377 A1 WO2005096377 A1 WO 2005096377A1 AU 2005000475 W AU2005000475 W AU 2005000475W WO 2005096377 A1 WO2005096377 A1 WO 2005096377A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchanger
base
exchanger according
fins
cover
Prior art date
Application number
PCT/AU2005/000475
Other languages
French (fr)
Inventor
Peter Terence Clarke
Montag Christian Davis
Robert Michael Weymouth
Original Assignee
Hydrocool Pty Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2004901733A external-priority patent/AU2004901733A0/en
Application filed by Hydrocool Pty Limited filed Critical Hydrocool Pty Limited
Priority to JP2007505339A priority Critical patent/JP2007531991A/en
Priority to AU2005228057A priority patent/AU2005228057B2/en
Publication of WO2005096377A1 publication Critical patent/WO2005096377A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a HEAT EXCHANGER TECHNICAL FIELD This invention relates to heat exchangers and more particularly to a heat exchanger suitable for use with computer central processing units and/or thermo-electric modules.
  • BACKGROUND ART A prior art multi-channelled heat exchanger described in Australian patent specification No. 779,519.
  • the invention will be described in relation to the use of a heat exchanger with a computer central processing unit. The performance of a computer central processing unit can be improved by removing heat and thus there is a need for a heat exchanger adapted for use with a computer central processing unit.
  • a heat exchanger comprising:- (i) a conductive base, (ii) an array of heat exchanger fins on the base defining a plurality of channels through which coolant liquid may flow, (iii) a sealing sheet or pad overlying the surface of the fins remote from the base, and (iv) a non-conductive cover sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels.
  • a heat exchanger comprising:- (i) a conductive base, (ii) an array of heat exchanger fins on the base defining a plurality of channels through which coolant liquid may flow, and (iii) a conductive cover sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels.
  • the conductive cover has a central inlet which directs the coldest liquid directly to the metal fins adjacent to the source of heat from a CPU die. A central inlet, will most likely be preferred if only a heat exchanger is applied to the CPU.
  • Fig. 1 is a partially cut away perspective view of a heat exchanger according to one embodiment of the invention
  • Fig. 2 is an exploded view of the heat exchanger shown in Fig. 1
  • Fig. 3 is a plan view of the heat exchanger shown in Fig. 1
  • Fig. 4 is a cross-sectional view of the heat exchanger taken along lines A-A of Fig. 3
  • Fig. 5 is an enlarged view of portion C of Fig. 4
  • Fig. 6 is a cross-sectional view of the heat exchanger taken along lines D-D of Fig.
  • Fig. 7 is an enlarged view of portion F of Fig. 6
  • Fig. 8 is a perspective view of a heat exchanger according to another embodiment of the invention
  • Fig. 9 is a plan view of the cover shown in Fig. 8
  • Fig. 10 is a cross-sectional view of the cover shown in Fig. 8 taken along lines A-A of Fig. 9
  • Fig. 11 is a cross-sectional view of the cover shown in Fig. 8 taken along lines B-B
  • Fig. 12 is a graph of thermal resistance (°C/W) and pressure drop (kPa) against flow rate (L/min) for a heat exchanger according to one embodiment of the invention. MODES FOR CARRYING OUT THE INVENTION The heat exchanger 10 shown in Figs.
  • 1 to 7 consists of a copper base or tray 11 which seats in a plastic bottom flange 12 and supports an array of copper fins 13 which define heat exchanger channels.
  • a rubber sealing member in the form of a sheet or pad 14 overlies the fins 13 and a plastic cover 15 is sealingly engaged with the base flange 12 with O-ring 16 therebetween.
  • the fins 13 are made from a continuous sheet of copper, folded in a concertina fashion. The top and bottom surfaces of the channels are sealed by virtue of the compression of the fins against each other.
  • the fins 13 are soldered to the copper base and sealed with the rubber pad 14 at the top to prevent liquid bypass between the top of the fins and the plastic cover.
  • the heat exchanger channels defined by the array of fins 13 extend from an inlet side 20 to an outlet side 21 of the heat exchanger 10.
  • the cover 15 has an inlet 22 leading to the inlet side 20 and an outlet 23 leading from the outlet side 21.
  • the cover or manifold top 15 has a peripheral flange 24 which terminates in an inwardly directed flange 25 to define therebetween a channel 26 in which the O-ring 16 is seated.
  • the flange 24 has a stepped recess 27 on its inner face 28 which receives a similarly shaped lip 29 of the bottom flange 12.
  • the heat exchanger 10 is placed directly onto the computer central processing unit and then clamped in place.
  • thermo electric module 40 which is placed into contact with the computer central processing unit or other heat source or cold sink.
  • the thermo electric module actively removes heat from the computer central processing unit and transfers it to water flowing through the heat exchanger mounted on the hot side of the thermo electric module.
  • water is piped to a remote radiator which dissipates the heat to atmosphere.
  • the heat exchanger of the embodiment shown in Figs. 8 to 11 has a cover or manifold top 30 made of copper and has a central inlet 31 and two outlets 32 and 33 on either side of the inlet 31.
  • the copper cover 30 allows a soldered joint to be used in place of the O-ring 16 of the embodiment of Fig. 1.
  • the base 34 is soldered to the cover 30 and obviates the need for the flange 12 of the Fig. 1 embodiment and rubber pad 14 and o-ring 16.
  • the copper fins 13 have a V-shaped cut 35 across them to assist the entry of fluid. This jet impingement feature directs the coldest liquid directly to the metal fins adjacent to the source of heat from the CPU die thereby enhancing cooling performance.
  • the thermo-electric heat exchangers shown in the drawings have a remarkably low thermal resistance at very modest pumping power.
  • thermo-electric module A thermal resistance of only 0.01 °C/W with a pumping power requirement of 2.2 watts for 2 litres per minute flow rate on a 40mm x 40mm face area has been achieved. Optimized microchannels have enabled these low thermal resistances to be achieved and the benefit can be demonstrated by considering the effect on a high heat pumping thermo-electric module. If the module is cooling at 100W capacity with a coefficient of performance (COP) of 1.0 then the heat passing through the cold side is 100W and the heat passing through the hot side is 200W. Heat exchangers on the cold side and hot side pose thermal resistance to heat flow, i.e. there is a temperature difference required to force the heat across the interface.
  • COP coefficient of performance
  • thermo-electric modules have a thermal resistance of 0.1°C/W compared to 0.01 °C/W heat exchanger of the invention.
  • the table below shows the effect on the dT a thermo-electric module can achieve with a heat exchanger of the invention compared to typical heat exchangers, assuming a 100W coldside.
  • thermo-electric modules have a maximum dT of 75°C so a 30°C loss across the heat exchanger interfaces leaves only 45°C of effective temperature differential. Compare this to the 3°C temperature differential with heat exchangers of the invention where the module is left with 72°C of effective temperature differential.
  • the base is made from pure silver and the cover is made from polycarbonate.
  • the cooling performance of one specific embodiment of the invention is as follows:-
  • Fig. 12 is a graph of the thermal resistance (°C/W) and pressure drop (kPa) against flow rate (L/min) for a heat exchanger according to the invention.
  • Various modifications may be made in details and design and construction of the heat exchanger without departing from the scope and ambit of the invention.

Abstract

A heat exchanger suitable for cooling computer central processing units has a conductive base (11), an array of heat exchanger fins (13) on the base (11) defining a plurality of channels through which coolant liquid may flow, a sealing sheet or pad (14) overlying the surface of the fins (13) remote from the base (11), and a non-conductive cover (15) sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels.

Description

A HEAT EXCHANGER TECHNICAL FIELD This invention relates to heat exchangers and more particularly to a heat exchanger suitable for use with computer central processing units and/or thermo-electric modules. BACKGROUND ART A prior art multi-channelled heat exchanger described in Australian patent specification No. 779,519. For the sake of convenience, the invention will be described in relation to the use of a heat exchanger with a computer central processing unit. The performance of a computer central processing unit can be improved by removing heat and thus there is a need for a heat exchanger adapted for use with a computer central processing unit. SUMMARY OF THE INVENTION According to one aspect of the invention there is provided a heat exchanger comprising:- (i) a conductive base, (ii) an array of heat exchanger fins on the base defining a plurality of channels through which coolant liquid may flow, (iii) a sealing sheet or pad overlying the surface of the fins remote from the base, and (iv) a non-conductive cover sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels. According to another aspect of the invention there is provided a heat exchanger comprising:- (i) a conductive base, (ii) an array of heat exchanger fins on the base defining a plurality of channels through which coolant liquid may flow, and (iii) a conductive cover sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels. In one form of the invention, the conductive cover has a central inlet which directs the coldest liquid directly to the metal fins adjacent to the source of heat from a CPU die. A central inlet, will most likely be preferred if only a heat exchanger is applied to the CPU. If a thermoelectric module is used in conjunction with the heat exchanger then the preferred form will be with inlet and outlet at either end of the heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially cut away perspective view of a heat exchanger according to one embodiment of the invention, Fig. 2 is an exploded view of the heat exchanger shown in Fig. 1 , Fig. 3 is a plan view of the heat exchanger shown in Fig. 1 , Fig. 4 is a cross-sectional view of the heat exchanger taken along lines A-A of Fig. 3, Fig. 5 is an enlarged view of portion C of Fig. 4, Fig. 6 is a cross-sectional view of the heat exchanger taken along lines D-D of Fig. 3, Fig. 7 is an enlarged view of portion F of Fig. 6, Fig. 8 is a perspective view of a heat exchanger according to another embodiment of the invention, Fig. 9 is a plan view of the cover shown in Fig. 8, Fig. 10 is a cross-sectional view of the cover shown in Fig. 8 taken along lines A-A of Fig. 9, Fig. 11 is a cross-sectional view of the cover shown in Fig. 8 taken along lines B-B, and Fig. 12 is a graph of thermal resistance (°C/W) and pressure drop (kPa) against flow rate (L/min) for a heat exchanger according to one embodiment of the invention. MODES FOR CARRYING OUT THE INVENTION The heat exchanger 10 shown in Figs. 1 to 7 consists of a copper base or tray 11 which seats in a plastic bottom flange 12 and supports an array of copper fins 13 which define heat exchanger channels. A rubber sealing member in the form of a sheet or pad 14 overlies the fins 13 and a plastic cover 15 is sealingly engaged with the base flange 12 with O-ring 16 therebetween. The fins 13 are made from a continuous sheet of copper, folded in a concertina fashion. The top and bottom surfaces of the channels are sealed by virtue of the compression of the fins against each other. The fins 13 are soldered to the copper base and sealed with the rubber pad 14 at the top to prevent liquid bypass between the top of the fins and the plastic cover. The heat exchanger channels defined by the array of fins 13 extend from an inlet side 20 to an outlet side 21 of the heat exchanger 10. The cover 15 has an inlet 22 leading to the inlet side 20 and an outlet 23 leading from the outlet side 21. As can be seen in Figs. 5 and 7, the cover or manifold top 15 has a peripheral flange 24 which terminates in an inwardly directed flange 25 to define therebetween a channel 26 in which the O-ring 16 is seated. The flange 24 has a stepped recess 27 on its inner face 28 which receives a similarly shaped lip 29 of the bottom flange 12. In one embodiment of the invention, the heat exchanger 10 is placed directly onto the computer central processing unit and then clamped in place. Water is pumped through the heat exchanger to remove heat from the computer central processing unit and piped to a remote radiator where the heat is dissipated to atmosphere. In another embodiment of the invention, the heat exchanger 10 is mounted onto a thermo electric module 40 which is placed into contact with the computer central processing unit or other heat source or cold sink. The thermo electric module actively removes heat from the computer central processing unit and transfers it to water flowing through the heat exchanger mounted on the hot side of the thermo electric module. As before, water is piped to a remote radiator which dissipates the heat to atmosphere. The heat exchanger of the embodiment shown in Figs. 8 to 11 has a cover or manifold top 30 made of copper and has a central inlet 31 and two outlets 32 and 33 on either side of the inlet 31. The use of the copper cover 30 allows a soldered joint to be used in place of the O-ring 16 of the embodiment of Fig. 1. Thus, the base 34 is soldered to the cover 30 and obviates the need for the flange 12 of the Fig. 1 embodiment and rubber pad 14 and o-ring 16. As shown in Fig. 11 , the copper fins 13 have a V-shaped cut 35 across them to assist the entry of fluid. This jet impingement feature directs the coldest liquid directly to the metal fins adjacent to the source of heat from the CPU die thereby enhancing cooling performance. The thermo-electric heat exchangers shown in the drawings have a remarkably low thermal resistance at very modest pumping power. A thermal resistance of only 0.01 °C/W with a pumping power requirement of 2.2 watts for 2 litres per minute flow rate on a 40mm x 40mm face area has been achieved. Optimized microchannels have enabled these low thermal resistances to be achieved and the benefit can be demonstrated by considering the effect on a high heat pumping thermo-electric module. If the module is cooling at 100W capacity with a coefficient of performance (COP) of 1.0 then the heat passing through the cold side is 100W and the heat passing through the hot side is 200W. Heat exchangers on the cold side and hot side pose thermal resistance to heat flow, i.e. there is a temperature difference required to force the heat across the interface. Typical forced convection air flow heat exchangers for thermo-electric modules have a thermal resistance of 0.1°C/W compared to 0.01 °C/W heat exchanger of the invention. The table below shows the effect on the dT a thermo-electric module can achieve with a heat exchanger of the invention compared to typical heat exchangers, assuming a 100W coldside.
Figure imgf000007_0001
The best thermo-electric modules have a maximum dT of 75°C so a 30°C loss across the heat exchanger interfaces leaves only 45°C of effective temperature differential. Compare this to the 3°C temperature differential with heat exchangers of the invention where the module is left with 72°C of effective temperature differential. According to another embodiment of the invention, the base is made from pure silver and the cover is made from polycarbonate. The cooling performance of one specific embodiment of the invention is as follows:-
Figure imgf000008_0001
Fig. 12 is a graph of the thermal resistance (°C/W) and pressure drop (kPa) against flow rate (L/min) for a heat exchanger according to the invention. Various modifications may be made in details and design and construction of the heat exchanger without departing from the scope and ambit of the invention.

Claims

CLAIMS:
1. A heat exchanger comprising:- (i) a conductive base, (ii) an array of heat exchanger fins on the base defining a plurality of channels through which coolant liquid may flow, (iii) a sealing sheet or pad overlying the surface of the fins remote from the base, and (iv) a non-conductive cover sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels.
2. A heat exchanger according to claim 1 and further including an "O" ring seal between the cover and the base.
3. A heat exchanger according to claim 1 wherein the base is made of copper.
4. A heat exchanger according to claim 1 wherein the cover is made of a plastics material.
5. A heat exchanger according to claim 1 wherein the fins are formed from a continuous sheet of copper folded in a concertina manner.
6. A heat exchanger according to claim 5 wherein the array of fins is compressed so that the top and bottom of adjacent channels formed between the fins are sealed by virtue of the compression of the fins against each other.
7. A heat exchanger according to claim 5 wherein the bottom face of the array of fins is soldered to the base.
8. A heat exchanger according to claim 2 wherein the cover has a peripheral flange which terminates in an inwardly directed flange with a channel being defined between the flanges, the channel being adapted to receive the "O" ring.
9. A heat exchanger according to claim 8 wherein the base has a peripheral flange having an outwardly directed lip and the inwardly directed flange of the cover has a similarly shaped lip which is adapted to engage with the lip of the base.
10. A heat exchanger according to claim 1 further including a thermo-electric module in heat transfer relationship with the outside of the base.
11. A heat exchanger comprising:- (i) a conductive base, (ii) an array of heat exchanger fins on the base defining a plurality of channels through which coolant liquid may flow, and (iii) a conductive cover sealingly engaged with the base and enclosing the heat exchange channels, the cover having an inlet leading to the channels and at least one outlet leading from the heat exchange channels.
12. A heat exchanger according to claim 11 wherein the cover has a centrally located inlet and an outlet on either side of the inlet.
13. A heat exchanger according to claim 11 wherein the cover is made of copper.
14. A heat exchanger according to claim 13 wherein the cover is soldered to the base.
15. A heat exchanger according to claim 11 wherein the fins are formed from a continuous sheet of copper folded in a concertina manner.
16. A heat exchanger according to claim 15 wherein the array of fins is compressed so that the top and bottom of adjacent channels formed between the fins are sealed by virtue of the compression of the fins against each other.
17. A heat exchanger according to claim 11 further including a thermoelectric module in heat transfer relationship with the outside of the conductive base.
18. A heat exchanger according to claim 1 wherein the base is made of silver.
19. A heat exchanger according to claim 11 wherein the base is made of silver.
PCT/AU2005/000475 2004-03-31 2005-03-31 A heat exchanger WO2005096377A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007505339A JP2007531991A (en) 2004-03-31 2005-03-31 Heat exchanger
AU2005228057A AU2005228057B2 (en) 2004-03-31 2005-03-31 A heat exchanger

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AU2004901733 2004-03-31
AU2004901733A AU2004901733A0 (en) 2004-03-31 A heat exchanger

Publications (1)

Publication Number Publication Date
WO2005096377A1 true WO2005096377A1 (en) 2005-10-13

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013008385A (en) * 2006-09-28 2013-01-10 Fisher Rosemount Systems Inc Prevention of abnormal state of heat exchanger
US20140251582A1 (en) * 2007-08-09 2014-09-11 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9909820B2 (en) 2007-08-09 2018-03-06 Coolit Systems, Inc. Fluid heat exchange systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

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Publication number Priority date Publication date Assignee Title
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
DE202012002974U1 (en) * 2011-07-27 2012-07-23 Coolit Systems Inc. Fluid heat exchange systems
JP5957686B2 (en) * 2012-01-13 2016-07-27 パナソニックＩｐマネジメント株式会社 COOLING DEVICE AND ELECTRONIC DEVICE AND ELECTRIC CAR HAVING THE SAME
JP6482955B2 (en) * 2015-06-02 2019-03-13 昭和電工株式会社 Liquid cooling system
JP6646005B2 (en) * 2017-03-24 2020-02-14 株式会社ケーヒン Power module
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
EP0243710A2 (en) * 1986-04-30 1987-11-04 International Business Machines Corporation Flexible finned heat exchanger
US5584183A (en) * 1994-02-18 1996-12-17 Solid State Cooling Systems Thermoelectric heat exchanger
EP1204143A2 (en) * 2000-11-03 2002-05-08 Cray Inc. Semiconductor circular and radial flow cooler

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
EP0243710A2 (en) * 1986-04-30 1987-11-04 International Business Machines Corporation Flexible finned heat exchanger
US5584183A (en) * 1994-02-18 1996-12-17 Solid State Cooling Systems Thermoelectric heat exchanger
EP1204143A2 (en) * 2000-11-03 2002-05-08 Cray Inc. Semiconductor circular and radial flow cooler

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8762106B2 (en) 2006-09-28 2014-06-24 Fisher-Rosemount Systems, Inc. Abnormal situation prevention in a heat exchanger
JP2013008385A (en) * 2006-09-28 2013-01-10 Fisher Rosemount Systems Inc Prevention of abnormal state of heat exchanger
US10274266B2 (en) 2007-08-09 2019-04-30 CoolIT Systems, Inc Fluid heat exchange sytems
US20140251582A1 (en) * 2007-08-09 2014-09-11 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9603284B2 (en) * 2007-08-09 2017-03-21 Coolit Systems, Inc. Fluid heat exchanger configured to provide a split flow
US9909820B2 (en) 2007-08-09 2018-03-06 Coolit Systems, Inc. Fluid heat exchange systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US11714432B2 (en) 2011-08-11 2023-08-01 Coolit Systems, Inc. Flow-path controllers and related systems
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US11661936B2 (en) 2013-03-15 2023-05-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11725890B2 (en) 2019-04-25 2023-08-15 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

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