WO2005085932A9 - Altering temporal response of micro electromechanical elements - Google Patents
Altering temporal response of micro electromechanical elementsInfo
- Publication number
- WO2005085932A9 WO2005085932A9 PCT/US2005/005919 US2005005919W WO2005085932A9 WO 2005085932 A9 WO2005085932 A9 WO 2005085932A9 US 2005005919 W US2005005919 W US 2005005919W WO 2005085932 A9 WO2005085932 A9 WO 2005085932A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- elements
- array
- movable
- actuate
- causing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S359/00—Optical: systems and elements
- Y10S359/904—Micromirror
Definitions
- Microelectromechanical (MEMS) systems are generally made up of individual moving elements manufactured on a micrometer scale. Such elements as switches tunable, capacitors, mirrors for display and printing applications, etc., serve as MEMS examples.
- a MEMS device has at least one movable element, a cavity into or out of which the element moves, and some sort of actuation signal that causes the element to move.
- the actuation timing of the element is a key portion of the operation of the device.
- the switch elements may be cascaded and the response time of a first switch may determine the response time of the next switch, etc.
- the movement of the elements generally modulate light, and the timing of the modulation determines the image content seen by a viewer. Having finer control of these elements by their response times may afford better operation, such as a higher image quality. Control of display elements by their response times, for example, may provide a higher bit depth for display applications.
- Figure 1 shows an embodiment of a microelectromechanical element.
- Figure 2a and 2b shows graphs of operational times related to pressure.
- Figure 3 shows an embodiment of an array of display elements.
- Figures 4a and 4b show cross-sections of alternative embodiments of a display element.
- Figure 5 shows an actuation/release response curve for an embodiment of a display element.
- Figure 6 shows an alternative embodiment of an array of display elements.
- Figure 7 shows an actuation/release response curve for an alternative embodiment of a display element.
- Figure 8 shows an embodiment of a picture element comprised of several display elements having differing levels of pressure resistance.
- Figure 9 shows an alternative embodiment of a picture element comprised of several display elements having different levels of pressure resistance.
- Figure 10 shows an alternative embodiment of a picture element having rails for support.
- Figure 1 shows a diagram of a generalized structure for a micromechanical element 10.
- This movable element 10 has a movable member 14 adjacent a cavity 18.
- an actuator 16 of some sort, such as an address transistor or other component that allows actuation of the movable element towards the substrate 12 into the cavity 18.
- the element will be suspended over the substrate, but may also be oriented horizontally across the cavity, or the actuator may be the suspended portion of the movable element 10.
- the movement through the cavity may be the motion of the member 14 into the cavity 18, as would occur if a member went from a position like member 14a to a position parallel to the position of member 14b.
- the movement maybe in the opposite direction, starting at position 14b and ending at a position parallel to the position of member 14a.
- the response time of the element may be affected.
- the response, or actuation, time is that period of time it takes for the movable member to reach its actuated position.
- the mechanical resistance of the gas may act as a damping agent on the motion of the movable member of the element. This damping due to mechanical resistance will be referred to here as pressure resistance.
- the pressure resistance can be exploited to allow finer control of the response of the elements. Air or other gases under pressure may act as if they were fluids, and the resistance caused by the gas is similar to that of viscous fluid damping.
- the gas When the gas resides in a gap that is very small, it no longer acts as a fluid, but resists movement by the pressure of the gas itself.
- the pressure resistance of the gas between the movable element and the substrate or other fixed structure may be viscous fluid damping initially, and as the gap closes become pressure as characterized above.
- This pressure resistance may be manipulated by varying the pressure resistance across the elements, where different elements have different pressure resistances and therefore have different response times.
- a different approach, where the response time is altered for movable elements by gas holes is discussed in US Patent Application Serial No. 09/966,843, "Interferometric Modulation of Radiation," filed September 28,2001. In that approach, the desire was to speed up the response time, and all of the elements had the same pressure resistance as they all had the same pattern of holes. As the movable elements deflect, they all have uniform pressure resistance.
- FIG. 2a A graph of response time versus pressure is shown in Figure 2a. As can be seen from the 3 different plots, gas pressure is the dominant factor in the response of the device.
- Figure 2b shows the response times of two different elements. The top curve is the response time for an element tuned to have a slower response. The bottom curve is the response time for an element tuned to have a faster response. This variation of pressure resistance between the devices can be exploited.
- MEMS elements are typically arranged in an x-y grid on a substrate. Depending upon the size of the elements, they may be further grouped into subarrays, where each subarray forms a picture element, or pixel, of the resulting image seen by a viewer. A portion of such an array is shown in Figure 3. In Figure 3, a portion of an array of movable elements is shown. The movable elements are grouped into subarrays corresponding to pixels, such as subarray 20.
- Each element in the array comprises a surface having a hole in the center to allow the gas to escape when the movable member of the element is actuated and moves. While this particular structure is based upon an interferometric modulator, these holes could be used for many different types of structures. To vary the pressure resistance of the element, the size of the holes would be varied, providing elements with different response times.
- Interferometric modulators such as the iMoDTM, rely upon interference effects operating on light inside the cavity to modulate the light in accordance with image data.
- a cross-sectional view of such a modulator is shown in Figure 4a. In this embodiment, the viewing surface would be at the 'bottom' of the picture.
- the modulator array is formed on a transparent substrate 30.
- An optical stack 36 forms a first optically active surface that may be affected by the second optically active surface, the mechanical or mirror layer 33.
- a dielectric layer 38 typically protects the optical stack layer.
- the mechanical layer 32 is supported by posts such as 32, with the location of posts forming the individual elements of the array.
- an interferometric modulator When the circuitry on the substrate, not shown, is activated in a particular region under the mechanical layer, such as that portion of layer 34 that is suspended over cavity 40, the mechanical layer deflects towards the optical stack 36. As it deflects, the mechanical layer causes the portion of the optical stack as seen by the viewer to appear black. Therefore, by addressing the mechanical layer with image data, an image would be seen by the viewer.
- This particular embodiment of an interferometric modulator may be referred to as a monolithic interferometric modulator here.
- the mirror 44 that causes the pixel to appear black when deflected is separated from the support layer 42.
- This may be referred to as a separable modulator here.
- the trapping of gas that is resident inside the array packaging may be used to alter the response time of the movable elements.
- the layer 34 of Figure 4a may be seen by the viewer.
- the holes are so small that no objectionable artifacts would typically be created by forming holes in the center of the portions that actuate.
- the holes would be made in the mirror 44, in the supporting layer 42, or both. Holes made in the supporting layer 42 would not be seen by the viewer, as they would be shielded by the mirror 44.
- the response time would be altered.
- the response time for this type of element is shown in Figure 5. As can be seen these elements have a response time of approximately 200 microseconds.
- FIG. 6 a portion of an array of elements without the holes is shown in Figure 6.
- the pixel 50 comprised of several subpixels and referred to here as a macropixel, would have individual elements such as 52, without holes in their surfaces, and edge 51 is a free edge represented by a dashed line.
- the response time for this type of modulator is shown in Figure 7. As can be seen, the response time approaches 3 milliseconds. In the experiments conducted to gather this data, the two modulators were manufactured from the same wafer, so other factors, such as dielectric charging, that might affect the response time would be similar for both. The longer response time is only due to the trapping of the gas under the modulator elements.
- the edge elements 70a-j may be manufactured to have a lower mechanical resistance than the elements in the middle of the pixel 72a and b.
- a first level such as the beginning portion of a ramp signal
- the edge elements would move first, having less mechanical resistance to the attractive forces drawing the movable member towards the substrate.
- the edge elements move, they cause gas to be trapped under the elements in the middle of the pixel, in this example 72a and 72b.
- One method of fabricating modulators having different mechanical stiffness can be found in US Patent No. 6,574,033, "Microelectromechanical System Device and Method for Fabricating Same," issued June 3, 2003.
- the trapped gas provides another opportunity to control the response time of the final two elements of the pixel.
- the middle elements would then move.
- controlling the voltage allows a system designer to provide pulses of varying times or voltages to determine how many elements of a pixel move and affect the resulting pixel seen by the viewer.
- a first set of elements on a free edge of the pixel such as 70a, 70d, 7Of and 7Oh could be designed to deflect first.
- a second set of elements on a second free edge such as 70c, 7Oe, 7Og and 7Oj could then move after the first set, instead of simultaneously as discussed above.
- the mechanical resistance as discussed above could control the movement timing. It may be desirable to move the first edge and the second edge simultaneously in some applications, or separately in others.
- An example of an approach that varies the mechanical resistance may include altering the post spacing of the modulator posts.
- the modulator of Figure 8 has wider gaps between the posts of the edge pixels 70a-70j, than those posts used for the elements in the middle. This can be seen more clearly by comparing element 52 of Figure 6 with element 70c of Figure 8.
- Other types of variation of mechanical resistance are also possible.
- FIG. 9 it is possible to form holes in the back surfaces of the movable elements, as is shown in Figure 9.
- the center elements 82a and 82b have center holes that allow any trapped air to escape. This may allow for another level of response time.
- the edge elements having a lower mechanical resistance to the actuation signal may respond first, then the middle element 82a with the hole, followed by the element 82b without the hole. Again, this allows control of the actuation signal to different levels to effect different numbers of elements used to form the resulting pixels.
- an array of movable elements Each element has a movable member and a cavity through which the member moves.
- the pressure resistance of the elements are varied such that at least one element has a different level of pressure resistance than the other elements in the subarray or pixel. The difference may be because of air forced under the element by the collapse of neighboring elements, or because of the presence or absence of holes patterned into a surface of the element.
- the movable element 44 may also be formed with holes in it, allowing trapped gas to escape.
- the support layer 42 may be manufactured to be larger than shown here, so as to move and cover the edges of the mirror when the mirror moves, thereby trapping gas under the mirror.
- channels could be manufactured to restrict, or release air between the mirrors.
- the mirror 44 could be formed of two parts or two layers.
- the first layer would be larger and thinner than the second.
- the second layer would be deposited on the first, but have less surface area, forming a mirror having a center, rigid portion and a flexible outer portion. When the mirror moves, the flexible portion would collapse first and trap gas under the edges of the mirror.
- the mirrors or movable elements be supported on all four sides, with the mirror resting on 'rails.' This is shown in Figure 10 where there are not any posts, each sub element and each macropixel being supported from the sides.. Any gas trapped under the macropixel 90 would be isolated from any gas trapped under macropixel 96.
- One embodiment would have the rail 98 between the two macropixels being manufactured so as to not allow any gas movement.
- the substrate may be patterned with structures, such as bumps or grooves to facilitate gas movement.
- structures such as bumps or grooves to facilitate gas movement.
- the movable element itself would have bumps on it to facilitate gas movement.
- the patterns of the bumps and grooves may vary across different elements of a macropixel, to provide the variable pressure resistance desired.
- the two interferometric modulators merely serving as examples of devices to which this invention could be applied, it is possible that the gas-trapping characteristic can be exploited on the release part of the cycle rather than the actuation portion. This was discussed above with regard to Figure 1. However, given the amount of space on the backside of the mirror and the packaging complexities involved, trapping gas on the actuation cycle is probably more practical. However there is no intention to limit application of this invention to only the actuation cycle.
- the discussion up to this point has mentioned that the substance trapped under the elements as a gas.
- This gas is more than likely air, although different gases may be used.
- Using a gas having a density less than air may increase the response time even further, as elements would have even lower pressure resistance.
- the damping force provided by the gas is determined by its properties, such partial pressure, density, and viscosity.
- the geometry of the device as well as the geometry of the gas molecules may also have and effect.
- these elements have a response time in the nanosecond range when operating in a vacuum. When packaged with air, they respond in the microsecond range. Therefore, it would seem that elements having a faster response time in a vacuum might employ a different gas than air to tune their response times to the optimal operating range for that type of element.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05732329A EP1740996A2 (en) | 2004-03-03 | 2005-02-25 | Altering temporal response of micro electromechanical elements |
BRPI0508380-0A BRPI0508380A (en) | 2004-03-03 | 2005-02-25 | alteration of temporal response of microelectromechanical elements |
AU2005218462A AU2005218462A1 (en) | 2004-03-03 | 2005-02-25 | Altering temporal response of micro electromechanical elements |
IL177530A IL177530A0 (en) | 2004-03-03 | 2006-08-16 | Altering temporal response of micro electromechanical elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/794,737 | 2004-03-03 | ||
US10/794,737 US7119945B2 (en) | 2004-03-03 | 2004-03-03 | Altering temporal response of microelectromechanical elements |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2005085932A2 WO2005085932A2 (en) | 2005-09-15 |
WO2005085932A3 WO2005085932A3 (en) | 2005-10-13 |
WO2005085932A9 true WO2005085932A9 (en) | 2006-11-02 |
Family
ID=34912338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/005919 WO2005085932A2 (en) | 2004-03-03 | 2005-02-25 | Altering temporal response of micro electromechanical elements |
Country Status (8)
Country | Link |
---|---|
US (1) | US7119945B2 (en) |
EP (1) | EP1740996A2 (en) |
CN (1) | CN100485444C (en) |
AU (1) | AU2005218462A1 (en) |
BR (1) | BRPI0508380A (en) |
IL (1) | IL177530A0 (en) |
TW (2) | TWI353336B (en) |
WO (1) | WO2005085932A2 (en) |
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EP1172681A3 (en) * | 2000-07-13 | 2004-06-09 | Creo IL. Ltd. | Blazed micro-mechanical light modulator and array thereof |
US6847752B2 (en) * | 2000-12-07 | 2005-01-25 | Bluebird Optical Mems Ltd. | Integrated actuator for optical switch mirror array |
US6912078B2 (en) * | 2001-03-16 | 2005-06-28 | Corning Incorporated | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
JP3740444B2 (en) * | 2001-07-11 | 2006-02-01 | キヤノン株式会社 | Optical deflector, optical equipment using the same, torsional oscillator |
US6589625B1 (en) * | 2001-08-01 | 2003-07-08 | Iridigm Display Corporation | Hermetic seal and method to create the same |
US6794119B2 (en) * | 2002-02-12 | 2004-09-21 | Iridigm Display Corporation | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
US6574033B1 (en) * | 2002-02-27 | 2003-06-03 | Iridigm Display Corporation | Microelectromechanical systems device and method for fabricating same |
US6741377B2 (en) * | 2002-07-02 | 2004-05-25 | Iridigm Display Corporation | Device having a light-absorbing mask and a method for fabricating same |
US6674033B1 (en) * | 2002-08-21 | 2004-01-06 | Ming-Shan Wang | Press button type safety switch |
-
2004
- 2004-03-03 US US10/794,737 patent/US7119945B2/en not_active Expired - Fee Related
-
2005
- 2005-02-25 EP EP05732329A patent/EP1740996A2/en not_active Withdrawn
- 2005-02-25 WO PCT/US2005/005919 patent/WO2005085932A2/en active Application Filing
- 2005-02-25 AU AU2005218462A patent/AU2005218462A1/en not_active Abandoned
- 2005-02-25 CN CNB2005800065043A patent/CN100485444C/en not_active Expired - Fee Related
- 2005-02-25 BR BRPI0508380-0A patent/BRPI0508380A/en not_active IP Right Cessation
- 2005-03-03 TW TW096150921A patent/TWI353336B/en not_active IP Right Cessation
- 2005-03-03 TW TW094106473A patent/TWI314133B/en not_active IP Right Cessation
-
2006
- 2006-08-16 IL IL177530A patent/IL177530A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW200533590A (en) | 2005-10-16 |
CN1926461A (en) | 2007-03-07 |
TWI314133B (en) | 2009-09-01 |
US7119945B2 (en) | 2006-10-10 |
CN100485444C (en) | 2009-05-06 |
IL177530A0 (en) | 2006-12-10 |
TW200827285A (en) | 2008-07-01 |
WO2005085932A2 (en) | 2005-09-15 |
US20050195467A1 (en) | 2005-09-08 |
WO2005085932A3 (en) | 2005-10-13 |
BRPI0508380A (en) | 2007-07-31 |
AU2005218462A1 (en) | 2005-09-15 |
AU2005218462A2 (en) | 2005-09-15 |
EP1740996A2 (en) | 2007-01-10 |
TWI353336B (en) | 2011-12-01 |
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