WO2005084183A3 - Electronic interconnect devices - Google Patents

Electronic interconnect devices Download PDF

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Publication number
WO2005084183A3
WO2005084183A3 PCT/US2004/004748 US2004004748W WO2005084183A3 WO 2005084183 A3 WO2005084183 A3 WO 2005084183A3 US 2004004748 W US2004004748 W US 2004004748W WO 2005084183 A3 WO2005084183 A3 WO 2005084183A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic interconnect
interconnect devices
conducting
composite material
electronic
Prior art date
Application number
PCT/US2004/004748
Other languages
French (fr)
Other versions
WO2005084183A2 (en
Inventor
Donald P Cullen
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Priority to JP2006517073A priority Critical patent/JP4374019B2/en
Priority to EP04821363A priority patent/EP1634342B1/en
Publication of WO2005084183A2 publication Critical patent/WO2005084183A2/en
Publication of WO2005084183A3 publication Critical patent/WO2005084183A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221—Carbon nanotubes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application

Abstract

An improved method of fabricating an electronic interconnect device using direct imaging of dielectric composite material by the inclusion of a conducting material in the composite material that becomes non-conducting through exposure to electromagnetic radiation. The conducting material generally comprises single-wall carbon nanotubes.
PCT/US2004/004748 2003-02-24 2004-02-17 Electronic interconnect devices WO2005084183A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006517073A JP4374019B2 (en) 2003-02-24 2004-02-17 Fabrication of electronic connection devices using direct imaging of dielectric composites.
EP04821363A EP1634342B1 (en) 2003-02-24 2004-02-17 Method of fabricating electronic interconnect devices using direct imaging of dielectric material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/372,747 US6762073B1 (en) 2003-02-24 2003-02-24 Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material
US10/372,747 2003-02-24

Publications (2)

Publication Number Publication Date
WO2005084183A2 WO2005084183A2 (en) 2005-09-15
WO2005084183A3 true WO2005084183A3 (en) 2005-11-24

Family

ID=32681771

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/004748 WO2005084183A2 (en) 2003-02-24 2004-02-17 Electronic interconnect devices

Country Status (7)

Country Link
US (1) US6762073B1 (en)
EP (1) EP1634342B1 (en)
JP (1) JP4374019B2 (en)
CN (1) CN100487940C (en)
ES (1) ES2367024T3 (en)
TW (1) TWI238682B (en)
WO (1) WO2005084183A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4943703B2 (en) * 2005-12-26 2012-05-30 日本電信電話株式会社 Tunnel junction forming method and tunnel junction forming apparatus
EP2448383B1 (en) * 2010-10-26 2013-09-11 C.R.F. Società Consortile Per Azioni Process for producing conductive and/or piezoresistive traces on a polymeric substrate
ITTO20121083A1 (en) * 2012-12-14 2014-06-15 Plastic Components And Modules Auto Motive S P A COMPOSITE MATERIAL FOR THE REALIZATION OF A COMPONENT OR A STRUCTURAL PART, PARTICULARLY FOR THE INSTALLATION OF A VEHICLE ON BOARD, TO INTEGRATE DEVICES AND ELECTRICAL CONNECTIONS.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6057637A (en) * 1996-09-13 2000-05-02 The Regents Of The University Of California Field emission electron source

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW210422B (en) 1991-06-04 1993-08-01 Akzo Nv
US5576162A (en) 1996-01-18 1996-11-19 Eastman Kodak Company Imaging element having an electrically-conductive layer
RU98120524A (en) 1996-05-15 2000-10-10 Хайперион Каталайзис Интернэшнл GRAPHITE NANOFIBERS IN ELECTROCHEMICAL CAPACITORS
US6683783B1 (en) 1997-03-07 2004-01-27 William Marsh Rice University Carbon fibers formed from single-wall carbon nanotubes
DE69834673T2 (en) * 1997-09-30 2006-10-26 Noritake Co., Ltd., Nagoya Method for producing an electron-emitting source
EP0949199B1 (en) * 1998-04-09 2003-05-21 Horcom Limited Composition including nanotubes and an organic compound
US6472705B1 (en) 1998-11-18 2002-10-29 International Business Machines Corporation Molecular memory & logic
US6420092B1 (en) 1999-07-14 2002-07-16 Cheng-Jer Yang Low dielectric constant nanotube
US6297063B1 (en) 1999-10-25 2001-10-02 Agere Systems Guardian Corp. In-situ nano-interconnected circuit devices and method for making the same
KR20010055501A (en) * 1999-12-10 2001-07-04 김순택 Method for forming cathode of field emission display
US6599961B1 (en) * 2000-02-01 2003-07-29 University Of Kentucky Research Foundation Polymethylmethacrylate augmented with carbon nanotubes
US7335603B2 (en) 2000-02-07 2008-02-26 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
KR20020006708A (en) * 2000-03-08 2002-01-24 요시카즈 나카야마 Nanotweezers and nanomanupulator
US6423583B1 (en) 2001-01-03 2002-07-23 International Business Machines Corporation Methodology for electrically induced selective breakdown of nanotubes
JP2002225167A (en) * 2001-02-01 2002-08-14 Mitsumi Electric Co Ltd Glass-epoxy substrate and magnetic head device
ATE413266T1 (en) 2001-03-12 2008-11-15 Gen Cable Technologies Corp METHOD FOR PRODUCING COMPOSITIONS WITH THERMOPLASTIC AND CURING POLYMERS AND ARTICLES PRODUCED BY SUCH METHOD
CA2442273A1 (en) * 2001-03-26 2002-10-03 Eikos, Inc. Carbon nanotubes in structures and repair compositions
US6689835B2 (en) * 2001-04-27 2004-02-10 General Electric Company Conductive plastic compositions and method of manufacture thereof
CA2450014A1 (en) * 2001-06-08 2002-12-19 Eikos, Inc. Nanocomposite dielectrics

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6057637A (en) * 1996-09-13 2000-05-02 The Regents Of The University Of California Field emission electron source

Also Published As

Publication number Publication date
WO2005084183A2 (en) 2005-09-15
US6762073B1 (en) 2004-07-13
ES2367024T3 (en) 2011-10-27
EP1634342A4 (en) 2008-03-05
JP2007524560A (en) 2007-08-30
JP4374019B2 (en) 2009-12-02
CN100487940C (en) 2009-05-13
EP1634342B1 (en) 2011-06-15
TWI238682B (en) 2005-08-21
CN1860625A (en) 2006-11-08
EP1634342A2 (en) 2006-03-15
TW200428916A (en) 2004-12-16

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