WO2005084183A2 - Electronic interconnect devices - Google Patents
Electronic interconnect devices Download PDFInfo
- Publication number
- WO2005084183A2 WO2005084183A2 PCT/US2004/004748 US2004004748W WO2005084183A2 WO 2005084183 A2 WO2005084183 A2 WO 2005084183A2 US 2004004748 W US2004004748 W US 2004004748W WO 2005084183 A2 WO2005084183 A2 WO 2005084183A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- carbon nanotubes
- composite substrate
- substrate material
- conducting
- percent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
Definitions
- the present invention relates to a method of fabricating an electronic interconnect device using direct imaging of dielectric composite material by the inclusion of a conducting material in the composite material that becomes nonconducting through exposure to electromagnetic radiation.
- Nanotubes have been identified as materials of interest for a variety of applications. Nanotubes have been contemplated for use in such products as compact fuel cells, fluorescent lights, and sensors.
- Carbon nanotubes are two-dimensional sheets of graphite that are rolled and joined into tubular structures. In graphite, the orbits of its outer electrons form three lobes that flare outward at 120-degree angles.
- Graphene a singe atomic layer of graphite, consists of a two-dimensional honeycomb structure of bonded carbon atoms. Each lobe bonds with a lobe of a neighboring carbon atom, forming a honeycomb pattern, forming bonds between the carbon atoms that are stronger than those of diamond.
- Graphite becomes extremely stiff, when the opposite edges of a.rectangular sheet are connected to form a cylinder (nanotube).
- Carbon nanotubes generally have diameters in the range of from 1 to 100 nanometers and may range in length up to about 100 micrometers, although other diameters and lengths are possible.
- Carbon nanotubes can have either a single-wall construction (SWNT) or a multi-wall construction (MWNT).
- SWNT single-wall construction
- MWNT multi-wall construction
- Single-wall carbon nanotubes are more pure conductors than multi-wall carbon nanotubes and generally have a diameter of approximately 1 to 4 nanometers.
- multi-wall carbon nanotubes generally have a diameter of approximately 2 to 40 nanometers.
- Multi-wall carbon nanotubes can range from metallic to insulating, and because there may be differences between each tube in a multi-wall construction, single-wall carbon nanotubes are preferred for many applications.
- Single-walled carbon nanotubes can be either metals or semiconductors, and their electrical properties can rival, or even exceed, the best metals or semiconductors known. The remarkable electrical properties of single-walled carbon nanotubes stem from the unusual electronic structure of the graphene.
- Nanotubes can be either conductors or semiconductors, depending on how the tube is rolled up.
- Carbon nanotubes are grown by combining a source of carbon with a catalytic nanostructured material, such as iron or cobalt, at elevated temperatures.
- Sources of carbon employed to date include bulk graphite, hydrocarbons and carbon monoxide.
- the catalyst has a high solubility for carbon.
- the carbon in the particle links up to form graphene and wraps around the catalyst to form a cylinder.
- Subsequent growth occurs from the continuous addition of carbon to the base of the tube at the nanoparticle/tube interface.
- Creating the proper conditions from growth can be done in a variety of ways, including bulk synthesis techniques, such as arc synthesis and laser assisted growth.
- An alternative technique is to grow the nanotubes directly on the substrate, for example, by using chemical vapor deposition.
- Nanotubes may be rendered non-conductive through the application of electromagnetic radiation.
- the radiation may be applied in such a manner as to cause partial or full destruction of the tubular structure, resulting in a loss of bulk conductivity.
- researchers have determined that single-walled nanotubes ignite when exposed to a conventional photographic flash, as described by Ajayan et al., "Nanotubes in a Flash - Ignition and Reconstruction", Science, Vol. 296, April 26, 2002, the subject matter of which is herein incorporated by reference in its entirety. This photoeffect occurs for single-walled carbon nanotubes prepared by carbon arc, laser ablation, or chemical vapor deposition techniques upon expose to a camera flash at close range.
- U.S. Patent No. 6,420,092 to Yang et al. discloses a fabrication method for a dielectric material with a low dielectric constant using a low dielectric constant nanotube.
- the inventors found that using a nanotube for a dielectric layer results in low dielectric constant because of the existence of pores throughout the structure of the nanotube.
- the nanotube was also found to have good thermal stability because it does not easily absorb moisture due to the low polarity of the nanotube wall.
- the inventors of the 6,420,092 patent determined that the formation of the dielectric layer with a nanotube stabilizes the quality of the dielectric layer.
- the use of the substrate material of the instant invention has an advantage over traditional electronic interconnection fabrication methods, because the process for forming circuits is a one-step exposure to electromagnetic radiation rather than the multi-step process used in conventional manufacturing.
- Another advantage to the use of the novel material of the invention is the density of electronic interconnections that can be achieved. Limits on conventional circuitry are imposed by material processing limits greater than the resolution of radiation sources. In contrast, the distance between conducting and non-conducting areas of the material formed by the instant invention is limited only by the resolution of the exposing radiation.
- the present invention comprises a method of making a composite substrate material comprising an insulating dielectric material, fibrous reinforcing material and a conducting material, and subsequently selectively exposing the conducting material in the composite substrate material to electromagnetic radiation to render portions of the conducting material non-conducting.
- the conducting material consists of single-walled carbon nanotubes.
- the carbon nanotubes function as both the conducting material and the fibrous reinforcing material.
- DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION The inventor has discovered that the addition of nanotubes to conventional composite substrate materials, comprising an insulating dielectric material and fibrous reinforcing material, produces a substrate that can be used to form a circuit in a printed wiring board in a one-step exposure to radiation, rather than the multi-step process used in conventional manufacturing.
- the composite substrate material of the instant invention generally comprises an insulating dielectric material, a fibrous reinforcing material, and a conducting material. Other materials, including fillers may optionally be present in compositions of the instant invention.
- the insulating dielectric material is generally selected from the group consisting of epoxy resins, polyamides, polyimides, tetrafluoroethylene (Teflon®), and liquid crystal materials. Other materials would also be known to those skilled in the art.
- the fibrous reinforcing material is generally selected from the group consisting of glass fibers, carbon fibers, paper, and aromatic polyamide fibers, (i.e., Kevlar®). Other materials would also be known to those skilled in the art.
- the fibrous reinforcing material is generally present in the composition at a concentration of about 25 to about 75 percent by volume, preferably about 40 to about 50 percent by volume.
- the conducting material in the composition generally comprises carbon (graphite) nanotubes.
- the carbon nanotubes are generally present in the composition at a concentration of about 40 to about 95 percent by volume, preferably about 70 to about 80 percent by volume.
- the carbon nanotubes can also function as the fibrous reinforcing material due to their physical strength.
- the carbon nanotubes are preferably present in the composition at a concentration of about 80 to about 99 percent by volume.
- compositions of the instant invention can also be utilized in compositions of the instant invention to achieve the desired result.
- Flow agents such as surfactants and silanes can be included in compositions of the invention.
- Fillers such as barium sulfate, can also be added.
- the composite substrate material is selectively exposed to electromagnetic radiation in a negative pattern to that of an intended electronic interconnect circuit.
- Selective exposure of the composite substrate is accomplished by use of a laser or focused electron beam as the source of electromagnetic radiation or by exposing the composite substrate material though a phototool or photomask.
- electromagnetic radiation i.e., light
- the substrate can then be used as a circuit path, or as one layer comprising an electronic interconnection substrate.
- the electromagnetic radiation is applied in such a manner as to cause partial or full destruction of the tubular nanotube structure, resulting in a loss of bulk conductivity.
- the composite substrate material may comprise one of a series of circuit layers that may subsequently be joined using traditional innerlayer connectivity methods, including lamination, via formation, and plated through hole formation. Other methods would also be known to one skilled in the art.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Physics & Mathematics (AREA)
- Carbon And Carbon Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04821363A EP1634342B1 (en) | 2003-02-24 | 2004-02-17 | Method of fabricating electronic interconnect devices using direct imaging of dielectric material |
JP2006517073A JP4374019B2 (en) | 2003-02-24 | 2004-02-17 | Fabrication of electronic connection devices using direct imaging of dielectric composites. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/372,747 US6762073B1 (en) | 2003-02-24 | 2003-02-24 | Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material |
US10/372,747 | 2003-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005084183A2 true WO2005084183A2 (en) | 2005-09-15 |
WO2005084183A3 WO2005084183A3 (en) | 2005-11-24 |
Family
ID=32681771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/004748 WO2005084183A2 (en) | 2003-02-24 | 2004-02-17 | Electronic interconnect devices |
Country Status (7)
Country | Link |
---|---|
US (1) | US6762073B1 (en) |
EP (1) | EP1634342B1 (en) |
JP (1) | JP4374019B2 (en) |
CN (1) | CN100487940C (en) |
ES (1) | ES2367024T3 (en) |
TW (1) | TWI238682B (en) |
WO (1) | WO2005084183A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2743291A1 (en) * | 2012-12-14 | 2014-06-18 | Plastic Components and Modules Automotive S.p.A. | Method for the production of a component or a structural part on-board a vehicle adapted to integrate electrical devices and connections, and composite material for the realization of said component or structural part |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4943703B2 (en) * | 2005-12-26 | 2012-05-30 | 日本電信電話株式会社 | Tunnel junction forming method and tunnel junction forming apparatus |
EP2448383B1 (en) * | 2010-10-26 | 2013-09-11 | C.R.F. Società Consortile Per Azioni | Process for producing conductive and/or piezoresistive traces on a polymeric substrate |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW210422B (en) | 1991-06-04 | 1993-08-01 | Akzo Nv | |
US5576162A (en) | 1996-01-18 | 1996-11-19 | Eastman Kodak Company | Imaging element having an electrically-conductive layer |
DE69739191D1 (en) | 1996-05-15 | 2009-02-12 | Hyperion Catalysis Internat In | GRAPHITE NANO FIBERS IN ELECTROCHEMICAL CAPACITORS |
US6057637A (en) * | 1996-09-13 | 2000-05-02 | The Regents Of The University Of California | Field emission electron source |
US6683783B1 (en) | 1997-03-07 | 2004-01-27 | William Marsh Rice University | Carbon fibers formed from single-wall carbon nanotubes |
DE69834673T2 (en) * | 1997-09-30 | 2006-10-26 | Noritake Co., Ltd., Nagoya | Method for producing an electron-emitting source |
DE69908016T2 (en) * | 1998-04-09 | 2004-08-19 | Enterprise Ireland | Composition containing nanotubes and an organic compound |
US6472705B1 (en) | 1998-11-18 | 2002-10-29 | International Business Machines Corporation | Molecular memory & logic |
US6420092B1 (en) | 1999-07-14 | 2002-07-16 | Cheng-Jer Yang | Low dielectric constant nanotube |
US6297063B1 (en) | 1999-10-25 | 2001-10-02 | Agere Systems Guardian Corp. | In-situ nano-interconnected circuit devices and method for making the same |
KR20010055501A (en) * | 1999-12-10 | 2001-07-04 | 김순택 | Method for forming cathode of field emission display |
US6599961B1 (en) * | 2000-02-01 | 2003-07-29 | University Of Kentucky Research Foundation | Polymethylmethacrylate augmented with carbon nanotubes |
US7335603B2 (en) | 2000-02-07 | 2008-02-26 | Vladimir Mancevski | System and method for fabricating logic devices comprising carbon nanotube transistors |
US6669256B2 (en) * | 2000-03-08 | 2003-12-30 | Yoshikazu Nakayama | Nanotweezers and nanomanipulator |
US6423583B1 (en) | 2001-01-03 | 2002-07-23 | International Business Machines Corporation | Methodology for electrically induced selective breakdown of nanotubes |
JP2002225167A (en) * | 2001-02-01 | 2002-08-14 | Mitsumi Electric Co Ltd | Glass-epoxy substrate and magnetic head device |
DE60229728D1 (en) | 2001-03-12 | 2008-12-18 | Gen Cable Technologies Corp | PROCESS FOR PREPARING COMPOSITIONS WITH THERMOPLASTIC AND CURABLE POLYMERS AND ARTICLES PRODUCED BY SUCH PROCESSES |
WO2002076430A1 (en) * | 2001-03-26 | 2002-10-03 | Eikos, Inc. | Carbon nanotubes in structures and repair compositions |
US6689835B2 (en) * | 2001-04-27 | 2004-02-10 | General Electric Company | Conductive plastic compositions and method of manufacture thereof |
US6762237B2 (en) * | 2001-06-08 | 2004-07-13 | Eikos, Inc. | Nanocomposite dielectrics |
-
2003
- 2003-02-24 US US10/372,747 patent/US6762073B1/en not_active Expired - Lifetime
-
2004
- 2004-02-04 TW TW093102489A patent/TWI238682B/en not_active IP Right Cessation
- 2004-02-17 JP JP2006517073A patent/JP4374019B2/en not_active Expired - Fee Related
- 2004-02-17 CN CN200480007776.0A patent/CN100487940C/en not_active Expired - Fee Related
- 2004-02-17 WO PCT/US2004/004748 patent/WO2005084183A2/en active Search and Examination
- 2004-02-17 ES ES04821363T patent/ES2367024T3/en not_active Expired - Lifetime
- 2004-02-17 EP EP04821363A patent/EP1634342B1/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of EP1634342A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2743291A1 (en) * | 2012-12-14 | 2014-06-18 | Plastic Components and Modules Automotive S.p.A. | Method for the production of a component or a structural part on-board a vehicle adapted to integrate electrical devices and connections, and composite material for the realization of said component or structural part |
Also Published As
Publication number | Publication date |
---|---|
CN100487940C (en) | 2009-05-13 |
TW200428916A (en) | 2004-12-16 |
JP2007524560A (en) | 2007-08-30 |
EP1634342A4 (en) | 2008-03-05 |
JP4374019B2 (en) | 2009-12-02 |
WO2005084183A3 (en) | 2005-11-24 |
US6762073B1 (en) | 2004-07-13 |
EP1634342B1 (en) | 2011-06-15 |
CN1860625A (en) | 2006-11-08 |
ES2367024T3 (en) | 2011-10-27 |
EP1634342A2 (en) | 2006-03-15 |
TWI238682B (en) | 2005-08-21 |
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