WO2005065431A3 - Microprobe tips and methods for making - Google Patents

Microprobe tips and methods for making Download PDF

Info

Publication number
WO2005065431A3
WO2005065431A3 PCT/US2005/000301 US2005000301W WO2005065431A3 WO 2005065431 A3 WO2005065431 A3 WO 2005065431A3 US 2005000301 W US2005000301 W US 2005000301W WO 2005065431 A3 WO2005065431 A3 WO 2005065431A3
Authority
WO
WIPO (PCT)
Prior art keywords
tips
variety
voids
via molding
probes
Prior art date
Application number
PCT/US2005/000301
Other languages
French (fr)
Other versions
WO2005065431A2 (en
Inventor
Kieun Kim
Adam L Cohen
Willa M Larsen
Richard T Chen
Ananda H Kumar
Ezekiel J J Kruglick
Vacit Arat
Gang Zhang
Michael S Lockard
Christopher A Bang
Jeffrey A Thompson
Original Assignee
Microfabrica Inc
Kieun Kim
Adam L Cohen
Willa M Larsen
Richard T Chen
Ananda H Kumar
Ezekiel J J Kruglick
Vacit Arat
Gang Zhang
Michael S Lockard
Christopher A Bang
Jeffrey A Thompson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/772,943 external-priority patent/US20050104609A1/en
Priority claimed from US10/949,738 external-priority patent/US20060006888A1/en
Application filed by Microfabrica Inc, Kieun Kim, Adam L Cohen, Willa M Larsen, Richard T Chen, Ananda H Kumar, Ezekiel J J Kruglick, Vacit Arat, Gang Zhang, Michael S Lockard, Christopher A Bang, Jeffrey A Thompson filed Critical Microfabrica Inc
Publication of WO2005065431A2 publication Critical patent/WO2005065431A2/en
Publication of WO2005065431A3 publication Critical patent/WO2005065431A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

Embodiments of the present invention are directed to the formation of microprobe tips elements (164) having a variety of configurations. In some embodiments tips (164) are formed from the same building material as the probes themselves, while in other embodiments the tips (164) may be formed from a different material and/or may include a coating material (508). In some embodiments, the tips (164) are formed before the main portions of the probes and the tips (164) are formed in proximity to or in contact with a temporary substrate (152). Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
PCT/US2005/000301 2003-12-31 2005-01-03 Microprobe tips and methods for making WO2005065431A2 (en)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US53397503P 2003-12-31 2003-12-31
US53393303P 2003-12-31 2003-12-31
US60/533,933 2003-12-31
US60/533,975 2003-12-31
US53686504P 2004-01-15 2004-01-15
US60/536,865 2004-01-15
US54051004P 2004-01-29 2004-01-29
US54051104P 2004-01-29 2004-01-29
US60/540,511 2004-01-29
US60/540,510 2004-01-29
US10/772,943 US20050104609A1 (en) 2003-02-04 2004-02-04 Microprobe tips and methods for making
US10/772,943 2004-02-04
US10/949,738 2004-09-24
US10/949,738 US20060006888A1 (en) 2003-02-04 2004-09-24 Electrochemically fabricated microprobes

Publications (2)

Publication Number Publication Date
WO2005065431A2 WO2005065431A2 (en) 2005-07-21
WO2005065431A3 true WO2005065431A3 (en) 2005-12-08

Family

ID=34754057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/000301 WO2005065431A2 (en) 2003-12-31 2005-01-03 Microprobe tips and methods for making

Country Status (2)

Country Link
TW (1) TW200533926A (en)
WO (1) WO2005065431A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115029747A (en) * 2022-07-26 2022-09-09 上海泽丰半导体科技有限公司 Probe processing method and probe
TWI822486B (en) * 2022-11-24 2023-11-11 漢民測試系統股份有限公司 Membrane circuit structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961052A (en) * 1989-01-07 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Probing plate for wafer testing
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6520778B1 (en) * 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961052A (en) * 1989-01-07 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Probing plate for wafer testing
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
US6520778B1 (en) * 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements

Also Published As

Publication number Publication date
WO2005065431A2 (en) 2005-07-21
TW200533926A (en) 2005-10-16

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