WO2005065274A3 - Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit - Google Patents

Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit Download PDF

Info

Publication number
WO2005065274A3
WO2005065274A3 PCT/US2004/043421 US2004043421W WO2005065274A3 WO 2005065274 A3 WO2005065274 A3 WO 2005065274A3 US 2004043421 W US2004043421 W US 2004043421W WO 2005065274 A3 WO2005065274 A3 WO 2005065274A3
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric sheet
printed circuit
fabricating
dielectric
patch antenna
Prior art date
Application number
PCT/US2004/043421
Other languages
French (fr)
Other versions
WO2005065274A2 (en
Inventor
Gregory J Dunn
Jeffrey M Petsinger
Jovica Savic
Original Assignee
Motorola Inc
Gregory J Dunn
Jeffrey M Petsinger
Jovica Savic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/837,461 external-priority patent/US7079373B2/en
Application filed by Motorola Inc, Gregory J Dunn, Jeffrey M Petsinger, Jovica Savic filed Critical Motorola Inc
Publication of WO2005065274A2 publication Critical patent/WO2005065274A2/en
Publication of WO2005065274A3 publication Critical patent/WO2005065274A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.
PCT/US2004/043421 2003-12-31 2004-12-22 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit WO2005065274A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US53370203P 2003-12-31 2003-12-31
US60/533,702 2003-12-31
US53757804P 2004-01-20 2004-01-20
US60/537,578 2004-01-20
US10/837,461 2004-04-30
US10/837,461 US7079373B2 (en) 2004-04-30 2004-04-30 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit

Publications (2)

Publication Number Publication Date
WO2005065274A2 WO2005065274A2 (en) 2005-07-21
WO2005065274A3 true WO2005065274A3 (en) 2005-11-24

Family

ID=34753694

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/043421 WO2005065274A2 (en) 2003-12-31 2004-12-22 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit

Country Status (1)

Country Link
WO (1) WO2005065274A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109863835B (en) 2016-09-27 2022-04-05 奥特斯奥地利科技与系统技术有限公司 Method for producing a component carrier and components thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596336A (en) * 1995-06-07 1997-01-21 Trw Inc. Low profile TEM mode slot array antenna
US6346918B1 (en) * 2000-03-01 2002-02-12 Massachusetts Institute Of Technology Scan independent array for circular polarization reception and transmission
US6451509B2 (en) * 1998-12-02 2002-09-17 International Business Machines Corporation Composite laminate circuit structure and method of forming the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596336A (en) * 1995-06-07 1997-01-21 Trw Inc. Low profile TEM mode slot array antenna
US6451509B2 (en) * 1998-12-02 2002-09-17 International Business Machines Corporation Composite laminate circuit structure and method of forming the same
US6346918B1 (en) * 2000-03-01 2002-02-12 Massachusetts Institute Of Technology Scan independent array for circular polarization reception and transmission

Also Published As

Publication number Publication date
WO2005065274A2 (en) 2005-07-21

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