WO2005065238A3 - Micro pin grid array with pin motion isolation - Google Patents
Micro pin grid array with pin motion isolation Download PDFInfo
- Publication number
- WO2005065238A3 WO2005065238A3 PCT/US2004/043049 US2004043049W WO2005065238A3 WO 2005065238 A3 WO2005065238 A3 WO 2005065238A3 US 2004043049 W US2004043049 W US 2004043049W WO 2005065238 A3 WO2005065238 A3 WO 2005065238A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pin
- flexible substrate
- conductive terminals
- grid array
- microelectronic element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53343703P | 2003-12-30 | 2003-12-30 | |
US60/533,437 | 2003-12-30 | ||
US10/985,119 US7709968B2 (en) | 2003-12-30 | 2004-11-10 | Micro pin grid array with pin motion isolation |
US10/985,119 | 2004-11-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005065238A2 WO2005065238A2 (en) | 2005-07-21 |
WO2005065238A3 true WO2005065238A3 (en) | 2009-03-26 |
Family
ID=34752997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/043049 WO2005065238A2 (en) | 2003-12-30 | 2004-12-21 | Micro pin grid array with pin motion isolation |
Country Status (2)
Country | Link |
---|---|
US (2) | US7709968B2 (en) |
WO (1) | WO2005065238A2 (en) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6826827B1 (en) * | 1994-12-29 | 2004-12-07 | Tessera, Inc. | Forming conductive posts by selective removal of conductive material |
US7183643B2 (en) * | 2003-11-04 | 2007-02-27 | Tessera, Inc. | Stacked packages and systems incorporating the same |
WO2006009772A2 (en) * | 2004-06-18 | 2006-01-26 | Tessera, Inc. | Multi-frequency noise suppression capacitor set |
WO2006004671A2 (en) * | 2004-06-25 | 2006-01-12 | Tessera, Inc. | Microelectronic package structure with spherical contact pins |
US7453157B2 (en) * | 2004-06-25 | 2008-11-18 | Tessera, Inc. | Microelectronic packages and methods therefor |
US20060033515A1 (en) * | 2004-08-13 | 2006-02-16 | Tessera, Inc. | Test fixture with movable pin contacts |
US8525314B2 (en) | 2004-11-03 | 2013-09-03 | Tessera, Inc. | Stacked packaging improvements |
US7687925B2 (en) | 2005-09-07 | 2010-03-30 | Infineon Technologies Ag | Alignment marks for polarized light lithography and method for use thereof |
JP2007103410A (en) * | 2005-09-30 | 2007-04-19 | Elpida Memory Inc | Semiconductor device having dense contact hole |
US8026611B2 (en) | 2005-12-01 | 2011-09-27 | Tessera, Inc. | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another |
US8058101B2 (en) | 2005-12-23 | 2011-11-15 | Tessera, Inc. | Microelectronic packages and methods therefor |
US7534652B2 (en) * | 2005-12-27 | 2009-05-19 | Tessera, Inc. | Microelectronic elements with compliant terminal mountings and methods for making the same |
US7632708B2 (en) * | 2005-12-27 | 2009-12-15 | Tessera, Inc. | Microelectronic component with photo-imageable substrate |
US7453139B2 (en) * | 2005-12-27 | 2008-11-18 | Tessera, Inc. | Compliant terminal mountings with vented spaces and methods |
US7732912B2 (en) * | 2006-08-11 | 2010-06-08 | Tessera, Inc. | Semiconductor chip packages and assemblies with chip carrier units |
US7545029B2 (en) * | 2006-08-18 | 2009-06-09 | Tessera, Inc. | Stack microelectronic assemblies |
US8133808B2 (en) | 2006-09-18 | 2012-03-13 | Tessera, Inc. | Wafer level chip package and a method of fabricating thereof |
KR101572600B1 (en) | 2007-10-10 | 2015-11-27 | 테세라, 인코포레이티드 | Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
US8258410B2 (en) * | 2008-01-26 | 2012-09-04 | International Business Machines Corporation | Construction of reliable stacked via in electronic substrates—vertical stiffness control method |
US7982316B1 (en) * | 2008-02-04 | 2011-07-19 | Amkor Technology, Inc. | Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof |
US20100090339A1 (en) * | 2008-09-12 | 2010-04-15 | Kumar Ananda H | Structures and Methods for Wafer Packages, and Probes |
JP2012004166A (en) * | 2010-06-14 | 2012-01-05 | Fujitsu Ltd | Wiring board, wiring board assembly and semiconductor device |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
US9159708B2 (en) | 2010-07-19 | 2015-10-13 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
US8823166B2 (en) | 2010-08-30 | 2014-09-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pillar bumps and process for making same |
KR101075241B1 (en) | 2010-11-15 | 2011-11-01 | 테세라, 인코포레이티드 | Microelectronic package with terminals on dielectric mass |
US20120146206A1 (en) | 2010-12-13 | 2012-06-14 | Tessera Research Llc | Pin attachment |
US9137903B2 (en) | 2010-12-21 | 2015-09-15 | Tessera, Inc. | Semiconductor chip assembly and method for making same |
KR101128063B1 (en) | 2011-05-03 | 2012-04-23 | 테세라, 인코포레이티드 | Package-on-package assembly with wire bonds to encapsulation surface |
US8618659B2 (en) | 2011-05-03 | 2013-12-31 | Tessera, Inc. | Package-on-package assembly with wire bonds to encapsulation surface |
US8872318B2 (en) | 2011-08-24 | 2014-10-28 | Tessera, Inc. | Through interposer wire bond using low CTE interposer with coarse slot apertures |
US8404520B1 (en) | 2011-10-17 | 2013-03-26 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8946757B2 (en) | 2012-02-17 | 2015-02-03 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US8372741B1 (en) | 2012-02-24 | 2013-02-12 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US9349706B2 (en) | 2012-02-24 | 2016-05-24 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US8975738B2 (en) | 2012-11-12 | 2015-03-10 | Invensas Corporation | Structure for microelectronic packaging with terminals on dielectric mass |
US8878353B2 (en) | 2012-12-20 | 2014-11-04 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
US9136254B2 (en) | 2013-02-01 | 2015-09-15 | Invensas Corporation | Microelectronic package having wire bond vias and stiffening layer |
US9023691B2 (en) | 2013-07-15 | 2015-05-05 | Invensas Corporation | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
US8883563B1 (en) | 2013-07-15 | 2014-11-11 | Invensas Corporation | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
US9034696B2 (en) | 2013-07-15 | 2015-05-19 | Invensas Corporation | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation |
US9167710B2 (en) | 2013-08-07 | 2015-10-20 | Invensas Corporation | Embedded packaging with preformed vias |
US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
US20150076714A1 (en) | 2013-09-16 | 2015-03-19 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
JP2015060947A (en) * | 2013-09-19 | 2015-03-30 | イビデン株式会社 | Printed wiring board having metal post and method of manufacturing printed wiring board having metal post |
US9087815B2 (en) | 2013-11-12 | 2015-07-21 | Invensas Corporation | Off substrate kinking of bond wire |
US9082753B2 (en) | 2013-11-12 | 2015-07-14 | Invensas Corporation | Severing bond wire by kinking and twisting |
US9379074B2 (en) | 2013-11-22 | 2016-06-28 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
US9583456B2 (en) | 2013-11-22 | 2017-02-28 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9263394B2 (en) | 2013-11-22 | 2016-02-16 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US10090267B2 (en) * | 2014-03-13 | 2018-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd | Bump structure and method for forming the same |
US9214454B2 (en) | 2014-03-31 | 2015-12-15 | Invensas Corporation | Batch process fabrication of package-on-package microelectronic assemblies |
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US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US9502372B1 (en) | 2015-04-30 | 2016-11-22 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
US9490222B1 (en) | 2015-10-12 | 2016-11-08 | Invensas Corporation | Wire bond wires for interference shielding |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US10043779B2 (en) | 2015-11-17 | 2018-08-07 | Invensas Corporation | Packaged microelectronic device for a package-on-package device |
US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
CN114449751B (en) * | 2021-07-14 | 2023-07-18 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4975079A (en) * | 1990-02-23 | 1990-12-04 | International Business Machines Corp. | Connector assembly for chip testing |
US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
Family Cites Families (182)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3214827A (en) | 1962-12-10 | 1965-11-02 | Sperry Rand Corp | Electrical circuitry fabrication |
US3775844A (en) | 1970-06-25 | 1973-12-04 | Bunker Ramo | Method of fabricating a multiwafer electrical circuit structure |
US3766439A (en) | 1972-01-12 | 1973-10-16 | Gen Electric | Electronic module using flexible printed circuit board with heat sink means |
US3873889A (en) | 1973-08-08 | 1975-03-25 | Sperry Rand Corp | Indicator module and method of manufacturing same |
US4225900A (en) | 1978-10-25 | 1980-09-30 | Raytheon Company | Integrated circuit device package interconnect means |
US4567543A (en) | 1983-02-15 | 1986-01-28 | Motorola, Inc. | Double-sided flexible electronic circuit module |
US4576543A (en) | 1983-11-07 | 1986-03-18 | Kmw Products Limited | Knock-down construction for front end loader |
US5220488A (en) | 1985-09-04 | 1993-06-15 | Ufe Incorporated | Injection molded printed circuits |
US4716049A (en) | 1985-12-20 | 1987-12-29 | Hughes Aircraft Company | Compressive pedestal for microminiature connections |
US4924353A (en) | 1985-12-20 | 1990-05-08 | Hughes Aircraft Company | Connector system for coupling to an integrated circuit chip |
US4695870A (en) | 1986-03-27 | 1987-09-22 | Hughes Aircraft Company | Inverted chip carrier |
JPS6397941A (en) | 1986-10-14 | 1988-04-28 | Fuji Photo Film Co Ltd | Photosensitive material |
US5138438A (en) | 1987-06-24 | 1992-08-11 | Akita Electronics Co. Ltd. | Lead connections means for stacked tab packaged IC chips |
KR970003915B1 (en) | 1987-06-24 | 1997-03-22 | 미다 가쓰시게 | Semiconductor device and the use memory module |
US4781601A (en) | 1987-07-06 | 1988-11-01 | Motorola, Inc. | Header for an electronic circuit |
US4804132A (en) | 1987-08-28 | 1989-02-14 | Difrancesco Louis | Method for cold bonding |
US5198888A (en) | 1987-12-28 | 1993-03-30 | Hitachi, Ltd. | Semiconductor stacked device |
US5028986A (en) | 1987-12-28 | 1991-07-02 | Hitachi, Ltd. | Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices |
US4991290A (en) | 1988-07-21 | 1991-02-12 | Microelectronics And Computer Technology | Flexible electrical interconnect and method of making |
JPH02174255A (en) | 1988-12-27 | 1990-07-05 | Mitsubishi Electric Corp | Semiconductor integrated circuit |
US5077598A (en) | 1989-11-08 | 1991-12-31 | Hewlett-Packard Company | Strain relief flip-chip integrated circuit assembly with test fixturing |
AU637874B2 (en) | 1990-01-23 | 1993-06-10 | Sumitomo Electric Industries, Ltd. | Substrate for packaging a semiconductor device |
CA2034703A1 (en) | 1990-01-23 | 1991-07-24 | Masanori Nishiguchi | Substrate for packaging a semiconductor device |
US5083697A (en) | 1990-02-14 | 1992-01-28 | Difrancesco Louis | Particle-enhanced joining of metal surfaces |
US5046238A (en) | 1990-03-15 | 1991-09-10 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
US5345205A (en) | 1990-04-05 | 1994-09-06 | General Electric Company | Compact high density interconnected microwave system |
US5220448A (en) | 1990-04-09 | 1993-06-15 | Ascom Tech Ag | Bit and frame synchronization unit for an access node of optical transmission equipment |
US5148265A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US5679977A (en) | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5148266A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5117282A (en) | 1990-10-29 | 1992-05-26 | Harris Corporation | Stacked configuration for integrated circuit devices |
US5172303A (en) | 1990-11-23 | 1992-12-15 | Motorola, Inc. | Electronic component assembly |
US5116459A (en) | 1991-03-06 | 1992-05-26 | International Business Machines Corporation | Processes for electrically conductive decals filled with organic insulator material |
JPH0513967A (en) | 1991-07-03 | 1993-01-22 | Mitsubishi Electric Corp | Semiconductor storage control device and high density mounting method therefor |
WO1993004375A1 (en) | 1991-08-23 | 1993-03-04 | Nchip, Inc. | Burn-in technologies for unpackaged integrated circuits |
US5281852A (en) | 1991-12-10 | 1994-01-25 | Normington Peter J C | Semiconductor device including stacked die |
US5397916A (en) | 1991-12-10 | 1995-03-14 | Normington; Peter J. C. | Semiconductor device including stacked die |
US5224023A (en) | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
US5222014A (en) | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
JP2894071B2 (en) | 1992-03-09 | 1999-05-24 | 株式会社日立製作所 | Semiconductor device |
US5422435A (en) | 1992-05-22 | 1995-06-06 | National Semiconductor Corporation | Stacked multi-chip modules and method of manufacturing |
US5247423A (en) | 1992-05-26 | 1993-09-21 | Motorola, Inc. | Stacking three dimensional leadless multi-chip module and method for making the same |
US5820770A (en) | 1992-07-21 | 1998-10-13 | Seagate Technology, Inc. | Thin film magnetic head including vias formed in alumina layer and process for making the same |
US6054756A (en) | 1992-07-24 | 2000-04-25 | Tessera, Inc. | Connection components with frangible leads and bus |
WO1994003036A1 (en) | 1992-07-24 | 1994-02-03 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
EP0586888B1 (en) | 1992-08-05 | 2001-07-18 | Fujitsu Limited | Three-dimensional multichip module |
US5324892A (en) | 1992-08-07 | 1994-06-28 | International Business Machines Corporation | Method of fabricating an electronic interconnection |
JP3105089B2 (en) | 1992-09-11 | 2000-10-30 | 株式会社東芝 | Semiconductor device |
JP2716336B2 (en) | 1993-03-10 | 1998-02-18 | 日本電気株式会社 | Integrated circuit device |
US5455740A (en) | 1994-03-07 | 1995-10-03 | Staktek Corporation | Bus communication system for stacked high density integrated circuit packages |
US5811982A (en) | 1995-11-27 | 1998-09-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US5398863A (en) | 1993-07-23 | 1995-03-21 | Tessera, Inc. | Shaped lead structure and method |
US5390844A (en) | 1993-07-23 | 1995-02-21 | Tessera, Inc. | Semiconductor inner lead bonding tool |
US5397921A (en) | 1993-09-03 | 1995-03-14 | Advanced Semiconductor Assembly Technology | Tab grid array |
US5454160A (en) | 1993-12-03 | 1995-10-03 | Ncr Corporation | Apparatus and method for stacking integrated circuit devices |
US5455390A (en) | 1994-02-01 | 1995-10-03 | Tessera, Inc. | Microelectronics unit mounting with multiple lead bonding |
US5448511A (en) | 1994-06-01 | 1995-09-05 | Storage Technology Corporation | Memory stack with an integrated interconnect and mounting structure |
US5802699A (en) | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US6177636B1 (en) | 1994-12-29 | 2001-01-23 | Tessera, Inc. | Connection components with posts |
US5798286A (en) | 1995-09-22 | 1998-08-25 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
US5518964A (en) | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US5989936A (en) | 1994-07-07 | 1999-11-23 | Tessera, Inc. | Microelectronic assembly fabrication with terminal formation from a conductive layer |
US5656550A (en) | 1994-08-24 | 1997-08-12 | Fujitsu Limited | Method of producing a semicondutor device having a lead portion with outer connecting terminal |
US5491302A (en) | 1994-09-19 | 1996-02-13 | Tessera, Inc. | Microelectronic bonding with lead motion |
US5659952A (en) | 1994-09-20 | 1997-08-26 | Tessera, Inc. | Method of fabricating compliant interface for semiconductor chip |
JP2570628B2 (en) | 1994-09-21 | 1997-01-08 | 日本電気株式会社 | Semiconductor package and manufacturing method thereof |
US5587342A (en) | 1995-04-03 | 1996-12-24 | Motorola, Inc. | Method of forming an electrical interconnect |
JP2606177B2 (en) | 1995-04-26 | 1997-04-30 | 日本電気株式会社 | Printed wiring board |
US5985692A (en) | 1995-06-07 | 1999-11-16 | Microunit Systems Engineering, Inc. | Process for flip-chip bonding a semiconductor die having gold bump electrodes |
JPH0997791A (en) | 1995-09-27 | 1997-04-08 | Internatl Business Mach Corp <Ibm> | Bump structure, formation of bump and installation connection body |
US5777379A (en) * | 1995-08-18 | 1998-07-07 | Tessera, Inc. | Semiconductor assemblies with reinforced peripheral regions |
JP3549294B2 (en) | 1995-08-23 | 2004-08-04 | 新光電気工業株式会社 | Semiconductor device and its mounting structure |
US5810609A (en) | 1995-08-28 | 1998-09-22 | Tessera, Inc. | Socket for engaging bump leads on a microelectronic device and methods therefor |
US5861666A (en) | 1995-08-30 | 1999-01-19 | Tessera, Inc. | Stacked chip assembly |
US5674785A (en) | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
US5646446A (en) | 1995-12-22 | 1997-07-08 | Fairchild Space And Defense Corporation | Three-dimensional flexible assembly of integrated circuits |
US5731709A (en) | 1996-01-26 | 1998-03-24 | Motorola, Inc. | Method for testing a ball grid array semiconductor device and a device for such testing |
US6001671A (en) | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
US5789815A (en) | 1996-04-23 | 1998-08-04 | Motorola, Inc. | Three dimensional semiconductor package having flexible appendages |
US5689091A (en) | 1996-09-19 | 1997-11-18 | Vlsi Technology, Inc. | Multi-layer substrate structure |
US5762845A (en) | 1996-11-19 | 1998-06-09 | Packard Hughes Interconnect Company | Method of making circuit with conductive and non-conductive raised features |
US5929521A (en) | 1997-03-26 | 1999-07-27 | Micron Technology, Inc. | Projected contact structure for bumped semiconductor device and resulting articles and assemblies |
JPH1140694A (en) | 1997-07-16 | 1999-02-12 | Oki Electric Ind Co Ltd | Semiconductor package, and semiconductor device and their manufacture |
US6335571B1 (en) | 1997-07-21 | 2002-01-01 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
WO1999009595A1 (en) | 1997-08-19 | 1999-02-25 | Hitachi, Ltd. | Multichip module structure and method for manufacturing the same |
CA2213590C (en) | 1997-08-21 | 2006-11-07 | Keith C. Carroll | Flexible circuit connector and method of making same |
JP3937265B2 (en) | 1997-09-29 | 2007-06-27 | エルピーダメモリ株式会社 | Semiconductor device |
US6217972B1 (en) | 1997-10-17 | 2001-04-17 | Tessera, Inc. | Enhancements in framed sheet processing |
US6222136B1 (en) | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
JPH11163022A (en) | 1997-11-28 | 1999-06-18 | Sony Corp | Semiconductor and manufacture of the same and electronic equipment |
US6052287A (en) | 1997-12-09 | 2000-04-18 | Sandia Corporation | Silicon ball grid array chip carrier |
US5973391A (en) | 1997-12-11 | 1999-10-26 | Read-Rite Corporation | Interposer with embedded circuitry and method for using the same to package microelectronic units |
US6329594B1 (en) | 1998-01-16 | 2001-12-11 | Bae Systems Information And Electronic Systems Integration, Inc. | Integrated circuit package |
US5956234A (en) | 1998-01-20 | 1999-09-21 | Integrated Device Technology, Inc. | Method and structure for a surface mountable rigid-flex printed circuit board |
US6061245A (en) | 1998-01-22 | 2000-05-09 | International Business Machines Corporation | Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
US6235996B1 (en) | 1998-01-28 | 2001-05-22 | International Business Machines Corporation | Interconnection structure and process module assembly and rework |
US6300679B1 (en) | 1998-06-01 | 2001-10-09 | Semiconductor Components Industries, Llc | Flexible substrate for packaging a semiconductor component |
US6414391B1 (en) | 1998-06-30 | 2002-07-02 | Micron Technology, Inc. | Module assembly for stacked BGA packages with a common bus bar in the assembly |
US5854507A (en) | 1998-07-21 | 1998-12-29 | Hewlett-Packard Company | Multiple chip assembly |
US6515355B1 (en) | 1998-09-02 | 2003-02-04 | Micron Technology, Inc. | Passivation layer for packaged integrated circuits |
JP3407275B2 (en) | 1998-10-28 | 2003-05-19 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Bump and method of forming the same |
US6332270B2 (en) | 1998-11-23 | 2001-12-25 | International Business Machines Corporation | Method of making high density integral test probe |
US6965166B2 (en) | 1999-02-24 | 2005-11-15 | Rohm Co., Ltd. | Semiconductor device of chip-on-chip structure |
US6980017B1 (en) | 1999-03-10 | 2005-12-27 | Micron Technology, Inc. | Test interconnect for bumped semiconductor components and method of fabrication |
JP2000277649A (en) | 1999-03-26 | 2000-10-06 | Matsushita Electric Works Ltd | Semiconductor and manufacture of the same |
US6177729B1 (en) | 1999-04-03 | 2001-01-23 | International Business Machines Corporation | Rolling ball connector |
JP3446825B2 (en) | 1999-04-06 | 2003-09-16 | 沖電気工業株式会社 | Semiconductor device and manufacturing method thereof |
US6258625B1 (en) | 1999-05-18 | 2001-07-10 | International Business Machines Corporation | Method of interconnecting electronic components using a plurality of conductive studs |
US6782610B1 (en) | 1999-05-21 | 2004-08-31 | North Corporation | Method for fabricating a wiring substrate by electroplating a wiring film on a metal base |
JP3973340B2 (en) | 1999-10-05 | 2007-09-12 | Necエレクトロニクス株式会社 | Semiconductor device, wiring board, and manufacturing method thereof |
US6882045B2 (en) | 1999-10-28 | 2005-04-19 | Thomas J. Massingill | Multi-chip module and method for forming and method for deplating defective capacitors |
US6869750B2 (en) | 1999-10-28 | 2005-03-22 | Fujitsu Limited | Structure and method for forming a multilayered structure |
US6362525B1 (en) | 1999-11-09 | 2002-03-26 | Cypress Semiconductor Corp. | Circuit structure including a passive element formed within a grid array substrate and method for making the same |
US6534861B1 (en) | 1999-11-15 | 2003-03-18 | Substrate Technologies Incorporated | Ball grid substrate for lead-on-chip semiconductor package |
US6322903B1 (en) | 1999-12-06 | 2001-11-27 | Tru-Si Technologies, Inc. | Package of integrated circuits and vertical integration |
US6216941B1 (en) | 2000-01-06 | 2001-04-17 | Trw Inc. | Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials |
JP3865989B2 (en) | 2000-01-13 | 2007-01-10 | 新光電気工業株式会社 | Multilayer wiring board, wiring board, multilayer wiring board manufacturing method, wiring board manufacturing method, and semiconductor device |
US20030001286A1 (en) | 2000-01-28 | 2003-01-02 | Ryoichi Kajiwara | Semiconductor package and flip chip bonding method therein |
JP3752949B2 (en) | 2000-02-28 | 2006-03-08 | 日立化成工業株式会社 | Wiring substrate and semiconductor device |
WO2001068311A1 (en) | 2000-03-10 | 2001-09-20 | Chippac, Inc. | Flip chip interconnection structure |
JP2001308095A (en) | 2000-04-19 | 2001-11-02 | Toyo Kohan Co Ltd | Semiconductor device and method of manufacture |
US6578754B1 (en) | 2000-04-27 | 2003-06-17 | Advanpack Solutions Pte. Ltd. | Pillar connections for semiconductor chips and method of manufacture |
US6522018B1 (en) | 2000-05-16 | 2003-02-18 | Micron Technology, Inc. | Ball grid array chip packages having improved testing and stacking characteristics |
US6647310B1 (en) | 2000-05-30 | 2003-11-11 | Advanced Micro Devices, Inc. | Temperature control of an integrated circuit |
US6560117B2 (en) | 2000-06-28 | 2003-05-06 | Micron Technology, Inc. | Packaged microelectronic die assemblies and methods of manufacture |
JP2002289768A (en) | 2000-07-17 | 2002-10-04 | Rohm Co Ltd | Semiconductor device and its manufacturing method |
US6462575B1 (en) | 2000-08-28 | 2002-10-08 | Micron Technology, Inc. | Method and system for wafer level testing and burning-in semiconductor components |
JP3874062B2 (en) | 2000-09-05 | 2007-01-31 | セイコーエプソン株式会社 | Semiconductor device |
JP3735526B2 (en) | 2000-10-04 | 2006-01-18 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
JP2002124548A (en) | 2000-10-17 | 2002-04-26 | Hitachi Cable Ltd | Tape carrier and semiconductor device using the tape carrier |
US6555906B2 (en) | 2000-12-15 | 2003-04-29 | Intel Corporation | Microelectronic package having a bumpless laminated interconnection layer |
US6734539B2 (en) | 2000-12-27 | 2004-05-11 | Lucent Technologies Inc. | Stacked module package |
US6800169B2 (en) | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
US6388322B1 (en) | 2001-01-17 | 2002-05-14 | Aralight, Inc. | Article comprising a mechanically compliant bump |
TWI313507B (en) | 2002-10-25 | 2009-08-11 | Megica Corporatio | Method for assembling chips |
US6648213B1 (en) | 2001-03-05 | 2003-11-18 | Saturn Electronics & Engineering, Inc. | Manufacturing method for attaching components to a substrate |
US20050097727A1 (en) | 2001-03-28 | 2005-05-12 | Tomoo Iijima | Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board |
JP2002313996A (en) | 2001-04-18 | 2002-10-25 | Toshiba Chem Corp | Substrate for semiconductor package, and its manufacturing method |
JP2003007768A (en) | 2001-06-25 | 2003-01-10 | Sumitomo Metal Mining Co Ltd | Interlayer connection material, and manufacturing method and using method therefor |
US6550666B2 (en) | 2001-08-21 | 2003-04-22 | Advanpack Solutions Pte Ltd | Method for forming a flip chip on leadframe semiconductor package |
US6992379B2 (en) | 2001-09-05 | 2006-01-31 | International Business Machines Corporation | Electronic package having a thermal stretching layer |
WO2003032370A2 (en) | 2001-10-09 | 2003-04-17 | Tessera, Inc. | Stacked packages |
US6977440B2 (en) | 2001-10-09 | 2005-12-20 | Tessera, Inc. | Stacked packages |
JP3583396B2 (en) | 2001-10-31 | 2004-11-04 | 富士通株式会社 | Semiconductor device manufacturing method, thin film multilayer substrate, and manufacturing method thereof |
JP3875077B2 (en) | 2001-11-16 | 2007-01-31 | 富士通株式会社 | Electronic device and device connection method |
TWI245402B (en) | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
SG115456A1 (en) | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Semiconductor die packages with recessed interconnecting structures and methods for assembling the same |
TWI284973B (en) | 2002-04-03 | 2007-08-01 | Advanced Semiconductor Eng | Flip-chip joint structure, and fabricating process thereof |
US6744142B2 (en) | 2002-06-19 | 2004-06-01 | National Central University | Flip chip interconnection structure and process of making the same |
US6803303B1 (en) | 2002-07-11 | 2004-10-12 | Micron Technology, Inc. | Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts |
JP2005026645A (en) | 2002-10-15 | 2005-01-27 | Shinko Electric Ind Co Ltd | Circuit board and its manufacturing method |
US7087458B2 (en) | 2002-10-30 | 2006-08-08 | Advanpack Solutions Pte. Ltd. | Method for fabricating a flip chip package with pillar bump and no flow underfill |
TW200423344A (en) | 2002-12-31 | 2004-11-01 | Texas Instruments Inc | Composite metal column for mounting semiconductor device |
JP2004221450A (en) | 2003-01-17 | 2004-08-05 | Toppan Printing Co Ltd | Printed board and its manufacturing method |
TW200507218A (en) | 2003-03-31 | 2005-02-16 | North Corp | Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module |
TWI234252B (en) | 2003-05-13 | 2005-06-11 | Siliconware Precision Industries Co Ltd | Flash-preventing window ball grid array semiconductor package and chip carrier and method for fabricating the same |
JP4389471B2 (en) | 2003-05-19 | 2009-12-24 | パナソニック株式会社 | Electronic circuit connection structure and connection method |
JP4104490B2 (en) | 2003-05-21 | 2008-06-18 | オリンパス株式会社 | Manufacturing method of semiconductor device |
US6888255B2 (en) | 2003-05-30 | 2005-05-03 | Texas Instruments Incorporated | Built-up bump pad structure and method for same |
US7005241B2 (en) | 2003-06-09 | 2006-02-28 | Shinko Electric Industries Co., Ltd. | Process for making circuit board or lead frame |
JP4056001B2 (en) | 2003-07-11 | 2008-03-05 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | Method for manufacturing printed circuit board |
US7462936B2 (en) | 2003-10-06 | 2008-12-09 | Tessera, Inc. | Formation of circuitry with modification of feature height |
US8641913B2 (en) | 2003-10-06 | 2014-02-04 | Tessera, Inc. | Fine pitch microcontacts and method for forming thereof |
US7495179B2 (en) | 2003-10-06 | 2009-02-24 | Tessera, Inc. | Components with posts and pads |
JP2005216696A (en) | 2004-01-30 | 2005-08-11 | Ngk Spark Plug Co Ltd | Relay board and board with relay board |
WO2006004672A1 (en) | 2004-06-25 | 2006-01-12 | Tessera, Inc. | Components with posts and pads |
US7453157B2 (en) | 2004-06-25 | 2008-11-18 | Tessera, Inc. | Microelectronic packages and methods therefor |
US6956165B1 (en) | 2004-06-28 | 2005-10-18 | Altera Corporation | Underfill for maximum flip chip package reliability |
JP4908750B2 (en) | 2004-11-25 | 2012-04-04 | ローム株式会社 | Semiconductor device |
US8294279B2 (en) | 2005-01-25 | 2012-10-23 | Megica Corporation | Chip package with dam bar restricting flow of underfill |
JP2007023338A (en) | 2005-07-15 | 2007-02-01 | Shinko Electric Ind Co Ltd | Method for forming metal sheet pattern and circuit board |
TWI273667B (en) | 2005-08-30 | 2007-02-11 | Via Tech Inc | Chip package and bump connecting structure thereof |
TWI286829B (en) | 2006-01-17 | 2007-09-11 | Via Tech Inc | Chip package |
US7964800B2 (en) | 2006-05-25 | 2011-06-21 | Fujikura Ltd. | Printed wiring board, method for forming the printed wiring board, and board interconnection structure |
US7911805B2 (en) | 2007-06-29 | 2011-03-22 | Tessera, Inc. | Multilayer wiring element having pin interface |
US20090148594A1 (en) | 2007-08-15 | 2009-06-11 | Tessera, Inc. | Interconnection element with plated posts formed on mandrel |
KR101388538B1 (en) | 2007-09-28 | 2014-04-23 | 테세라, 인코포레이티드 | Flip chip interconnection with double post |
KR101572600B1 (en) | 2007-10-10 | 2015-11-27 | 테세라, 인코포레이티드 | Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
JP2009158593A (en) | 2007-12-25 | 2009-07-16 | Tessera Interconnect Materials Inc | Bump structure and method of manufacturing the same |
US20100044860A1 (en) | 2008-08-21 | 2010-02-25 | Tessera Interconnect Materials, Inc. | Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer |
US7569935B1 (en) | 2008-11-12 | 2009-08-04 | Powertech Technology Inc. | Pillar-to-pillar flip-chip assembly |
US8115310B2 (en) | 2009-06-11 | 2012-02-14 | Texas Instruments Incorporated | Copper pillar bonding for fine pitch flip chip devices |
-
2004
- 2004-11-10 US US10/985,119 patent/US7709968B2/en not_active Expired - Fee Related
- 2004-12-21 WO PCT/US2004/043049 patent/WO2005065238A2/en active Application Filing
-
2010
- 2010-04-13 US US12/759,196 patent/US8531039B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
US4975079A (en) * | 1990-02-23 | 1990-12-04 | International Business Machines Corp. | Connector assembly for chip testing |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
US5980270A (en) * | 1994-06-07 | 1999-11-09 | Tessera, Inc. | Soldering with resilient contacts |
Also Published As
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US20050173805A1 (en) | 2005-08-11 |
US7709968B2 (en) | 2010-05-04 |
US8531039B2 (en) | 2013-09-10 |
US20100193970A1 (en) | 2010-08-05 |
WO2005065238A2 (en) | 2005-07-21 |
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