WO2005060619A3 - Optical display systems and methods - Google Patents
Optical display systems and methods Download PDFInfo
- Publication number
- WO2005060619A3 WO2005060619A3 PCT/US2004/041249 US2004041249W WO2005060619A3 WO 2005060619 A3 WO2005060619 A3 WO 2005060619A3 US 2004041249 W US2004041249 W US 2004041249W WO 2005060619 A3 WO2005060619 A3 WO 2005060619A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- methods
- optical display
- display systems
- layer
- stack
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
- G03B21/204—LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3129—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM] scanning a light beam on the display screen
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/315—Modulator illumination systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Abstract
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/735,498 | 2003-12-12 | ||
US10/735,498 US7166871B2 (en) | 2003-04-15 | 2003-12-12 | Light emitting systems |
US10/794,452 US7074631B2 (en) | 2003-04-15 | 2004-03-05 | Light emitting device methods |
US10/794,244 US20040259279A1 (en) | 2003-04-15 | 2004-03-05 | Light emitting device methods |
US10/794,244 | 2004-03-05 | ||
US10/794,452 | 2004-03-05 | ||
US55389404P | 2004-03-16 | 2004-03-16 | |
US60/553,894 | 2004-03-16 | ||
US10/872,335 | 2004-06-18 | ||
US10/872,335 US7450311B2 (en) | 2003-12-12 | 2004-06-18 | Optical display systems and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005060619A2 WO2005060619A2 (en) | 2005-07-07 |
WO2005060619A3 true WO2005060619A3 (en) | 2009-04-02 |
Family
ID=34658175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/041249 WO2005060619A2 (en) | 2003-12-12 | 2004-12-08 | Optical display systems and methods |
Country Status (3)
Country | Link |
---|---|
US (4) | US7450311B2 (en) |
TW (1) | TWI356505B (en) |
WO (1) | WO2005060619A2 (en) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7083993B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Methods of making multi-layer light emitting devices |
US7667238B2 (en) * | 2003-04-15 | 2010-02-23 | Luminus Devices, Inc. | Light emitting devices for liquid crystal displays |
US20040259279A1 (en) | 2003-04-15 | 2004-12-23 | Erchak Alexei A. | Light emitting device methods |
US7262550B2 (en) * | 2003-04-15 | 2007-08-28 | Luminus Devices, Inc. | Light emitting diode utilizing a physical pattern |
US7211831B2 (en) * | 2003-04-15 | 2007-05-01 | Luminus Devices, Inc. | Light emitting device with patterned surfaces |
US7074631B2 (en) * | 2003-04-15 | 2006-07-11 | Luminus Devices, Inc. | Light emitting device methods |
US6831302B2 (en) * | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
US7274043B2 (en) * | 2003-04-15 | 2007-09-25 | Luminus Devices, Inc. | Light emitting diode systems |
US7084434B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Uniform color phosphor-coated light-emitting diode |
US7098589B2 (en) * | 2003-04-15 | 2006-08-29 | Luminus Devices, Inc. | Light emitting devices with high light collimation |
US7521854B2 (en) * | 2003-04-15 | 2009-04-21 | Luminus Devices, Inc. | Patterned light emitting devices and extraction efficiencies related to the same |
US7105861B2 (en) * | 2003-04-15 | 2006-09-12 | Luminus Devices, Inc. | Electronic device contact structures |
US7166871B2 (en) * | 2003-04-15 | 2007-01-23 | Luminus Devices, Inc. | Light emitting systems |
US7344903B2 (en) * | 2003-09-17 | 2008-03-18 | Luminus Devices, Inc. | Light emitting device processes |
US7450311B2 (en) * | 2003-12-12 | 2008-11-11 | Luminus Devices, Inc. | Optical display systems and methods |
US20050205883A1 (en) * | 2004-03-19 | 2005-09-22 | Wierer Jonathan J Jr | Photonic crystal light emitting device |
US20090023239A1 (en) * | 2004-07-22 | 2009-01-22 | Luminus Devices, Inc. | Light emitting device processes |
US7442964B2 (en) * | 2004-08-04 | 2008-10-28 | Philips Lumileds Lighting Company, Llc | Photonic crystal light emitting device with multiple lattices |
US20060038188A1 (en) * | 2004-08-20 | 2006-02-23 | Erchak Alexei A | Light emitting diode systems |
US20060043400A1 (en) * | 2004-08-31 | 2006-03-02 | Erchak Alexei A | Polarized light emitting device |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
US9083781B2 (en) * | 2004-11-15 | 2015-07-14 | Bascule Development Ag Llc | Portable image-capturing device with embedded projector |
US7178735B2 (en) * | 2004-11-15 | 2007-02-20 | Kuo Ching Chiang | Multi-function portable communication device |
US7874486B2 (en) | 2004-11-15 | 2011-01-25 | Kuo-Ching Chiang | Portable communication device with DMD |
US7170100B2 (en) | 2005-01-21 | 2007-01-30 | Luminus Devices, Inc. | Packaging designs for LEDs |
US7692207B2 (en) * | 2005-01-21 | 2010-04-06 | Luminus Devices, Inc. | Packaging designs for LEDs |
US20070045640A1 (en) | 2005-08-23 | 2007-03-01 | Erchak Alexei A | Light emitting devices for liquid crystal displays |
US8163575B2 (en) * | 2005-06-17 | 2012-04-24 | Philips Lumileds Lighting Company Llc | Grown photonic crystals in semiconductor light emitting devices |
JP2007044701A (en) * | 2005-08-05 | 2007-02-22 | Fuji Electric Device Technology Co Ltd | Lead-free solder material |
US7390094B2 (en) * | 2005-09-15 | 2008-06-24 | Lightmaster Systems, Inc. | Method and apparatus to achieve a neutral dark state in image projection systems |
US20080099777A1 (en) * | 2005-10-19 | 2008-05-01 | Luminus Devices, Inc. | Light-emitting devices and related systems |
KR100661602B1 (en) * | 2005-12-09 | 2006-12-26 | 삼성전기주식회사 | Method for forming the vertically structured gan type light emitting diode device |
US20070139625A1 (en) * | 2005-12-21 | 2007-06-21 | Arthur Berman | Method and apparatus to achieve a neutral dark state in image devices |
DE102006014604B4 (en) * | 2006-03-29 | 2008-04-10 | Cinetron Technology Inc. | Light combination / projection system for outputting light beams with the same polarization state |
US7782514B2 (en) * | 2006-07-18 | 2010-08-24 | Jds Uniphase Corporation | Pivoting micro-mirror MEMS device with a sandwiched structure and a closed cellular core |
US7766490B2 (en) * | 2006-12-13 | 2010-08-03 | Philips Lumileds Lighting Company, Llc | Multi-color primary light generation in a projection system using LEDs |
DE102007015492B4 (en) * | 2007-01-30 | 2011-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Illumination device for an image capture device at the distal end of an endoscope |
US8110425B2 (en) | 2007-03-20 | 2012-02-07 | Luminus Devices, Inc. | Laser liftoff structure and related methods |
USD624029S1 (en) | 2007-03-29 | 2010-09-21 | Luminus Devices, Inc. | LED package |
US8640954B2 (en) | 2007-04-10 | 2014-02-04 | Bascule Development Ag Llc | Filter-free projector |
US20090196015A1 (en) * | 2008-02-04 | 2009-08-06 | Kismart Corporation | Lighting module with wavelength converting structure and manufacturing method for the same |
DE102008025160A1 (en) * | 2008-05-26 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Projector for smallest projection surfaces and use of a multi-color LED in a projector |
JP5288967B2 (en) * | 2008-09-22 | 2013-09-11 | ユー・ディー・シー アイルランド リミテッド | LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY HAVING THE LIGHT EMITTING ELEMENT |
CN102265401B (en) * | 2008-09-24 | 2016-11-09 | 发光装置公司 | Including can independent electrical addressing section luminescent device |
KR20110080165A (en) * | 2008-10-17 | 2011-07-12 | 루미너스 디바이시즈, 아이엔씨. | Remote lighting assemblies and methods |
TWM367356U (en) * | 2009-06-04 | 2009-10-21 | Delta Electronics Inc | LED light source module and projection device comprising the same |
CN107591394A (en) * | 2009-10-01 | 2018-01-16 | 发光装置公司 | Luminescent system |
EP2554025A4 (en) * | 2010-03-31 | 2015-01-21 | Automation Tooling Syst | Light generator systems and methods |
US9055688B2 (en) | 2010-08-20 | 2015-06-09 | Rockwell Automation Technologies, Inc. | Input/output circuits having status indicators aligned with respective terminals |
JP5781838B2 (en) * | 2010-08-25 | 2015-09-24 | スタンレー電気株式会社 | Light source device and lamp for vehicle |
KR101973608B1 (en) * | 2011-06-30 | 2019-04-29 | 엘지이노텍 주식회사 | Light emitting device |
EP2613367A3 (en) * | 2012-01-06 | 2013-09-04 | Imec | Method for producing a led device . |
US20130215394A1 (en) * | 2012-02-18 | 2013-08-22 | Rakesh Reddy | Underwater Image Projection Display System and Lighting Control System And Device |
JPWO2014020954A1 (en) * | 2012-07-31 | 2016-07-21 | 日本電気株式会社 | Optical element, illumination device, image display device, and method of operating optical element |
US9134599B2 (en) * | 2012-08-01 | 2015-09-15 | Pentair Water Pool And Spa, Inc. | Underwater image projection controller with boundary setting and image correction modules and interface and method of using same |
US9423608B2 (en) | 2012-08-01 | 2016-08-23 | Pentair Water Pool And Spa, Inc. | Multidimensional rotary motion apparatus moving a reflective surface and method of operating same |
CN105247861B (en) | 2013-03-22 | 2017-11-10 | 精工爱普生株式会社 | Infrared video shows glasses |
TWI674964B (en) * | 2015-10-22 | 2019-10-21 | 揚明光學股份有限公司 | Three dimensional printing apparatus and three dimensional printing method |
WO2019177755A1 (en) | 2018-03-13 | 2019-09-19 | Apple Inc. | Displays with direct-lit backlight units |
US11526051B2 (en) | 2021-04-16 | 2022-12-13 | Apple Inc. | Displays with direct-lit backlight units |
US11333924B1 (en) | 2021-04-16 | 2022-05-17 | Apple Inc. | Displays with direct-lit backlight units |
US11719978B2 (en) | 2021-09-23 | 2023-08-08 | Apple Inc. | Direct-lit backlight units with light-emitting diodes |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6873093B2 (en) * | 2003-02-28 | 2005-03-29 | Motorola, Inc. | Organic light emitting diode display structure |
Family Cites Families (142)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3293513A (en) | 1962-08-08 | 1966-12-20 | Texas Instruments Inc | Semiconductor radiant diode |
US3922706A (en) | 1965-07-31 | 1975-11-25 | Telefunken Patent | Transistor having emitter with high circumference-surface area ratio |
US3739217A (en) | 1969-06-23 | 1973-06-12 | Bell Telephone Labor Inc | Surface roughening of electroluminescent diodes |
US5008658A (en) * | 1986-12-09 | 1991-04-16 | Zenith Electronics Corporation | Domed light housing for back-lit LCD display |
US4864370A (en) | 1987-11-16 | 1989-09-05 | Motorola, Inc. | Electrical contact for an LED |
US5315330A (en) | 1989-12-21 | 1994-05-24 | Sharp Kabushiki Kaisha | Projection type display apparatus |
US5126231A (en) | 1990-02-26 | 1992-06-30 | Applied Materials, Inc. | Process for multi-layer photoresist etching with minimal feature undercut and unchanging photoresist load during etch |
JPH0442582A (en) | 1990-06-08 | 1992-02-13 | Eastman Kodak Japan Kk | Light emitting diode array |
US5073041A (en) | 1990-11-13 | 1991-12-17 | Bell Communications Research, Inc. | Integrated assembly comprising vertical cavity surface-emitting laser array with Fresnel microlenses |
JPH04264781A (en) | 1991-02-20 | 1992-09-21 | Eastman Kodak Japan Kk | Light-emitting diode array |
US5421753A (en) * | 1991-05-13 | 1995-06-06 | Roos; Paul W. | Marine jet drive |
US5359345A (en) | 1992-08-05 | 1994-10-25 | Cree Research, Inc. | Shuttered and cycled light emitting diode display and method of producing the same |
US5724062A (en) | 1992-08-05 | 1998-03-03 | Cree Research, Inc. | High resolution, high brightness light emitting diode display and method and producing the same |
US5363009A (en) | 1992-08-10 | 1994-11-08 | Mark Monto | Incandescent light with parallel grooves encompassing a bulbous portion |
CA2122023A1 (en) * | 1992-09-09 | 1994-03-17 | Alexander H. Slocum | Replicated-in-place internal viscous shear damper for machine structures and components |
EP0614255B1 (en) | 1993-03-04 | 1997-09-10 | AT&T Corp. | Article comprising a focusing surface emitting semiconductor laser |
US5376580A (en) | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
JPH06338630A (en) | 1993-05-28 | 1994-12-06 | Omron Corp | Semiconductor light-emitting element, and optical detector, optical information processor, optical coupler and light-emitting device using the light-emitting element |
TW253999B (en) | 1993-06-30 | 1995-08-11 | Hitachi Cable | |
US5490768A (en) * | 1993-12-09 | 1996-02-13 | Westinghouse Electric Corporation | Water jet propulsor powered by an integral canned electric motor |
US5600483A (en) | 1994-05-10 | 1997-02-04 | Massachusetts Institute Of Technology | Three-dimensional periodic dielectric structures having photonic bandgaps |
US5631190A (en) | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
US5633527A (en) | 1995-02-06 | 1997-05-27 | Sandia Corporation | Unitary lens semiconductor device |
US5814839A (en) | 1995-02-16 | 1998-09-29 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device having a current adjusting layer and a uneven shape light emitting region, and method for producing same |
JPH0936431A (en) * | 1995-07-13 | 1997-02-07 | Toshiba Corp | Semiconductor light emitting element |
DE19629920B4 (en) | 1995-08-10 | 2006-02-02 | LumiLeds Lighting, U.S., LLC, San Jose | Light-emitting diode with a non-absorbing distributed Bragg reflector |
JPH09236826A (en) * | 1995-09-28 | 1997-09-09 | Sharp Corp | Liquid crystal display element and its production |
US5889568A (en) * | 1995-12-12 | 1999-03-30 | Rainbow Displays Inc. | Tiled flat panel displays |
US5779924A (en) | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
WO1998013709A1 (en) | 1996-09-24 | 1998-04-02 | Seiko Epson Corporation | Illuminating device and display using the device |
DE19640594B4 (en) | 1996-10-01 | 2016-08-04 | Osram Gmbh | module |
US5834331A (en) | 1996-10-17 | 1998-11-10 | Northwestern University | Method for making III-Nitride laser and detection device |
US5955749A (en) | 1996-12-02 | 1999-09-21 | Massachusetts Institute Of Technology | Light emitting device utilizing a periodic dielectric structure |
US5777782A (en) | 1996-12-24 | 1998-07-07 | Xerox Corporation | Auxiliary optics for a twisting ball display |
FR2758890B1 (en) | 1997-01-29 | 1999-02-26 | Thomson Multimedia Sa | OPTICAL POLARIZATION DEVICE |
US6388264B1 (en) | 1997-03-28 | 2002-05-14 | Benedict G Pace | Optocoupler package being hermetically sealed |
GB9710062D0 (en) | 1997-05-16 | 1997-07-09 | British Tech Group | Optical devices and methods of fabrication thereof |
US6784463B2 (en) | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US6071795A (en) | 1998-01-23 | 2000-06-06 | The Regents Of The University Of California | Separation of thin films from transparent substrates by selective optical processing |
US6265820B1 (en) | 1998-01-29 | 2001-07-24 | Emagin Corporation | Heat removal system for use in organic light emitting diode displays having high brightness |
US6091085A (en) | 1998-02-19 | 2000-07-18 | Agilent Technologies, Inc. | GaN LEDs with improved output coupling efficiency |
JP3585097B2 (en) * | 1998-06-04 | 2004-11-04 | セイコーエプソン株式会社 | Light source device, optical device and liquid crystal display device |
US6504180B1 (en) | 1998-07-28 | 2003-01-07 | Imec Vzw And Vrije Universiteit | Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom |
US6992718B1 (en) * | 1998-08-31 | 2006-01-31 | Matsushita Electric Industrial Co., Ltd. | Illuminating apparatus, display panel, view finder, video display apparatus, and video camera mounting the elements |
US6335548B1 (en) | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
US6169294B1 (en) * | 1998-09-08 | 2001-01-02 | Epistar Co. | Inverted light emitting diode |
JP3525061B2 (en) | 1998-09-25 | 2004-05-10 | 株式会社東芝 | Method for manufacturing semiconductor light emitting device |
US6307218B1 (en) | 1998-11-20 | 2001-10-23 | Lumileds Lighting, U.S., Llc | Electrode structures for light emitting devices |
US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
JP3469484B2 (en) | 1998-12-24 | 2003-11-25 | 株式会社東芝 | Semiconductor light emitting device and method of manufacturing the same |
US6291339B1 (en) * | 1999-01-04 | 2001-09-18 | Advanced Micro Devices, Inc. | Bilayer interlayer dielectric having a substantially uniform composite interlayer dielectric constant over pattern features of varying density and method of making the same |
US20010042866A1 (en) | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
US6222207B1 (en) | 1999-05-24 | 2001-04-24 | Lumileds Lighting, U.S. Llc | Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip |
TW437104B (en) | 1999-05-25 | 2001-05-28 | Wang Tien Yang | Semiconductor light-emitting device and method for manufacturing the same |
US6288840B1 (en) | 1999-06-22 | 2001-09-11 | Moxtek | Imbedded wire grid polarizer for the visible spectrum |
US6122103A (en) | 1999-06-22 | 2000-09-19 | Moxtech | Broadband wire grid polarizer for the visible spectrum |
US6803603B1 (en) | 1999-06-23 | 2004-10-12 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting element |
US6534798B1 (en) | 1999-09-08 | 2003-03-18 | California Institute Of Technology | Surface plasmon enhanced light emitting diode and method of operation for the same |
US6287882B1 (en) | 1999-10-04 | 2001-09-11 | Visual Photonics Epitaxy Co., Ltd. | Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same |
US6614056B1 (en) | 1999-12-01 | 2003-09-02 | Cree Lighting Company | Scalable led with improved current spreading structures |
US6410942B1 (en) | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
CN1292493C (en) | 1999-12-03 | 2006-12-27 | 美商克立股份有限公司 | Enhanced light extration in LEDs through the use of internal and external optical elements |
JP2001177145A (en) | 1999-12-21 | 2001-06-29 | Toshiba Electronic Engineering Corp | Semiconductor light emitting device and method of manufacturing the same |
US6573537B1 (en) | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
EP1272899A4 (en) * | 2000-02-10 | 2009-11-18 | Light & Sound Design Ltd | Trimmer iris for use with a digitally shape-controlled lighting system |
WO2001064481A2 (en) | 2000-03-02 | 2001-09-07 | Donnelly Corporation | Video mirror systems incorporating an accessory module |
JP4643794B2 (en) | 2000-04-21 | 2011-03-02 | 富士通株式会社 | Semiconductor light emitting device |
GB0011749D0 (en) | 2000-05-17 | 2000-07-05 | Cambridge Display Tech Ltd | Light-eminating devices |
JP3934851B2 (en) * | 2000-05-23 | 2007-06-20 | 日本食品化工株式会社 | Novel cyclodextrin gluconotransferase, method for producing the same, and method for producing cyclodextrin using the enzyme |
US6853663B2 (en) | 2000-06-02 | 2005-02-08 | Agilent Technologies, Inc. | Efficiency GaN-based light emitting devices |
JP4024994B2 (en) | 2000-06-30 | 2007-12-19 | 株式会社東芝 | Semiconductor light emitting device |
WO2002005038A2 (en) * | 2000-07-10 | 2002-01-17 | Corporation For Laser Optics Research | Systems and methods for speckle reduction through bandwidth enhancement |
TW445507B (en) | 2000-07-20 | 2001-07-11 | United Epitaxy Co Ltd | Roughened interface of light emitting device |
US6661028B2 (en) | 2000-08-01 | 2003-12-09 | United Epitaxy Company, Ltd. | Interface texturing for light-emitting device |
US6870650B2 (en) * | 2000-08-01 | 2005-03-22 | Riake Corporation | Illumination device and method for laser projector |
US6998281B2 (en) | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
TW579608B (en) | 2000-11-24 | 2004-03-11 | High Link Technology Corp | Method and structure of forming electrode for light emitting device |
JP5110744B2 (en) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | Light emitting device and manufacturing method thereof |
JP2002280607A (en) | 2001-01-10 | 2002-09-27 | Toyoda Gosei Co Ltd | Light emitting device |
US6703780B2 (en) | 2001-01-16 | 2004-03-09 | General Electric Company | Organic electroluminescent device with a ceramic output coupler and method of making the same |
US6794684B2 (en) | 2001-02-01 | 2004-09-21 | Cree, Inc. | Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
WO2002071450A2 (en) | 2001-03-06 | 2002-09-12 | Emcore Corporation | Led lead for improved light extraction |
US6468824B2 (en) | 2001-03-22 | 2002-10-22 | Uni Light Technology Inc. | Method for forming a semiconductor device having a metallic substrate |
US6522063B2 (en) | 2001-03-28 | 2003-02-18 | Epitech Corporation | Light emitting diode |
US6574383B1 (en) | 2001-04-30 | 2003-06-03 | Massachusetts Institute Of Technology | Input light coupler using a pattern of dielectric contrast distributed in at least two dimensions |
US6709929B2 (en) | 2001-06-25 | 2004-03-23 | North Carolina State University | Methods of forming nano-scale electronic and optoelectronic devices using non-photolithographically defined nano-channel templates |
JP2003017751A (en) | 2001-06-28 | 2003-01-17 | Toyoda Gosei Co Ltd | Light emitting diode |
US6740906B2 (en) * | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
DE10147887C2 (en) | 2001-09-28 | 2003-10-23 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor component with a contact, which comprises a plurality of spaced-apart contact points |
KR100440958B1 (en) * | 2001-10-12 | 2004-07-21 | 삼성전자주식회사 | Illumination system and a projector imploying it |
US6692318B2 (en) * | 2001-10-26 | 2004-02-17 | The Penn State Research Foundation | Mixed flow pump |
US6812503B2 (en) | 2001-11-29 | 2004-11-02 | Highlink Technology Corporation | Light-emitting device with improved reliability |
DE10158754A1 (en) | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Light emitting semiconductor component, uses conductive adhesive material for joining semiconductor body electrically and thermally to carrier |
TWI276230B (en) | 2001-12-04 | 2007-03-11 | Epitech Corp Ltd | Structure and manufacturing method of light emitting diode |
US20030111959A1 (en) * | 2001-12-14 | 2003-06-19 | Van De Ven Antony | Method and apparatus for the reduction of electromagnetic radiation from display screens |
TW576864B (en) * | 2001-12-28 | 2004-02-21 | Toshiba Corp | Method for manufacturing a light-emitting device |
JP3802424B2 (en) | 2002-01-15 | 2006-07-26 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
TWI278995B (en) | 2002-01-28 | 2007-04-11 | Nichia Corp | Nitride semiconductor element with a supporting substrate and a method for producing a nitride semiconductor element |
US20030141563A1 (en) | 2002-01-28 | 2003-07-31 | Bily Wang | Light emitting diode package with fluorescent cover |
US7279718B2 (en) | 2002-01-28 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | LED including photonic crystal structure |
US6869820B2 (en) | 2002-01-30 | 2005-03-22 | United Epitaxy Co., Ltd. | High efficiency light emitting diode and method of making the same |
JP4055610B2 (en) * | 2002-03-22 | 2008-03-05 | セイコーエプソン株式会社 | Image display device and projector |
US6943379B2 (en) | 2002-04-04 | 2005-09-13 | Toyoda Gosei Co., Ltd. | Light emitting diode |
US6849558B2 (en) | 2002-05-22 | 2005-02-01 | The Board Of Trustees Of The Leland Stanford Junior University | Replication and transfer of microstructures and nanostructures |
US20030222263A1 (en) | 2002-06-04 | 2003-12-04 | Kopin Corporation | High-efficiency light-emitting diodes |
US6878969B2 (en) | 2002-07-29 | 2005-04-12 | Matsushita Electric Works, Ltd. | Light emitting device |
JP4027747B2 (en) * | 2002-08-07 | 2007-12-26 | オリンパス株式会社 | Illumination device and projection display device |
US6649437B1 (en) | 2002-08-20 | 2003-11-18 | United Epitaxy Company, Ltd. | Method of manufacturing high-power light emitting diodes |
TW541732B (en) | 2002-08-28 | 2003-07-11 | Arima Optoelectronics Corp | Manufacturing method of LED having transparent substrate |
US6762069B2 (en) | 2002-11-19 | 2004-07-13 | United Epitaxy Company, Ltd. | Method for manufacturing light-emitting element on non-transparent substrate |
US7750059B2 (en) | 2002-12-04 | 2010-07-06 | Hewlett-Packard Development Company, L.P. | Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure |
US20040130263A1 (en) | 2003-01-02 | 2004-07-08 | Ray-Hua Horng | High brightness led and method for producing the same |
US7141828B2 (en) | 2003-03-19 | 2006-11-28 | Gelcore, Llc | Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact |
US7521854B2 (en) * | 2003-04-15 | 2009-04-21 | Luminus Devices, Inc. | Patterned light emitting devices and extraction efficiencies related to the same |
US7074631B2 (en) | 2003-04-15 | 2006-07-11 | Luminus Devices, Inc. | Light emitting device methods |
US7211831B2 (en) * | 2003-04-15 | 2007-05-01 | Luminus Devices, Inc. | Light emitting device with patterned surfaces |
US7166871B2 (en) * | 2003-04-15 | 2007-01-23 | Luminus Devices, Inc. | Light emitting systems |
US7105861B2 (en) * | 2003-04-15 | 2006-09-12 | Luminus Devices, Inc. | Electronic device contact structures |
US7084434B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Uniform color phosphor-coated light-emitting diode |
US7262550B2 (en) * | 2003-04-15 | 2007-08-28 | Luminus Devices, Inc. | Light emitting diode utilizing a physical pattern |
US7083993B2 (en) | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Methods of making multi-layer light emitting devices |
US7098589B2 (en) * | 2003-04-15 | 2006-08-29 | Luminus Devices, Inc. | Light emitting devices with high light collimation |
US20040259279A1 (en) | 2003-04-15 | 2004-12-23 | Erchak Alexei A. | Light emitting device methods |
US7274043B2 (en) * | 2003-04-15 | 2007-09-25 | Luminus Devices, Inc. | Light emitting diode systems |
US6831302B2 (en) * | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
US6869812B1 (en) | 2003-05-13 | 2005-03-22 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
KR100483049B1 (en) | 2003-06-03 | 2005-04-15 | 삼성전기주식회사 | A METHOD OF PRODUCING VERTICAL GaN LIGHT EMITTING DIODES |
JP2005025160A (en) * | 2003-06-13 | 2005-01-27 | Seiko Epson Corp | Method of driving spatial light modulator and projector |
US6847057B1 (en) | 2003-08-01 | 2005-01-25 | Lumileds Lighting U.S., Llc | Semiconductor light emitting devices |
US6958494B2 (en) | 2003-08-14 | 2005-10-25 | Dicon Fiberoptics, Inc. | Light emitting diodes with current spreading layer |
US20050035361A1 (en) * | 2003-08-15 | 2005-02-17 | Peterson Charles M. | Polarized light emitting devices and methods |
US7344903B2 (en) * | 2003-09-17 | 2008-03-18 | Luminus Devices, Inc. | Light emitting device processes |
US7341880B2 (en) * | 2003-09-17 | 2008-03-11 | Luminus Devices, Inc. | Light emitting device processes |
JP2005107211A (en) * | 2003-09-30 | 2005-04-21 | Olympus Corp | Image projector |
US7012279B2 (en) * | 2003-10-21 | 2006-03-14 | Lumileds Lighting U.S., Llc | Photonic crystal light emitting device |
US7450311B2 (en) * | 2003-12-12 | 2008-11-11 | Luminus Devices, Inc. | Optical display systems and methods |
US7607784B2 (en) * | 2004-01-28 | 2009-10-27 | Panasonic Corporation | Light emission method, light emitting apparatus and projection display apparatus |
JP4665402B2 (en) * | 2004-02-04 | 2011-04-06 | セイコーエプソン株式会社 | Projection type display device, control method for projection type display device, and control program for projection type display device |
US20050205883A1 (en) * | 2004-03-19 | 2005-09-22 | Wierer Jonathan J Jr | Photonic crystal light emitting device |
US7384150B2 (en) * | 2005-05-27 | 2008-06-10 | 3M Innovative Properties Company | Light emitting diode (LED) illumination control system and method |
-
2004
- 2004-06-18 US US10/872,335 patent/US7450311B2/en not_active Expired - Fee Related
- 2004-12-03 TW TW093137376A patent/TWI356505B/en not_active IP Right Cessation
- 2004-12-08 WO PCT/US2004/041249 patent/WO2005060619A2/en active Application Filing
-
2006
- 2006-10-03 US US11/542,660 patent/US7535645B2/en not_active Expired - Fee Related
-
2008
- 2008-11-04 US US12/264,563 patent/US7934841B2/en not_active Expired - Fee Related
-
2011
- 2011-04-08 US US13/082,787 patent/US8251520B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6873093B2 (en) * | 2003-02-28 | 2005-03-29 | Motorola, Inc. | Organic light emitting diode display structure |
Also Published As
Publication number | Publication date |
---|---|
US20050127375A1 (en) | 2005-06-16 |
TWI356505B (en) | 2012-01-11 |
US7450311B2 (en) | 2008-11-11 |
US20110241574A1 (en) | 2011-10-06 |
TW200529116A (en) | 2005-09-01 |
US20070115556A1 (en) | 2007-05-24 |
US7535645B2 (en) | 2009-05-19 |
US7934841B2 (en) | 2011-05-03 |
US8251520B2 (en) | 2012-08-28 |
WO2005060619A2 (en) | 2005-07-07 |
US20090121657A1 (en) | 2009-05-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005060619A3 (en) | Optical display systems and methods | |
WO2005059967A3 (en) | Multiple chip package module having inverted package stacked over die | |
SG148851A1 (en) | Stacked semiconductor packages | |
WO2005045902A3 (en) | Semiconductor device and manufacturing method thereof | |
AU2001239969A1 (en) | Encapsulated microelectronic devices | |
EP2306528A3 (en) | Nitride semiconductor light emitting device and fabrication method thereof | |
WO2004034433A3 (en) | Semiconductor stacked multi-package module having inverted second package | |
EP1455392A4 (en) | Semiconductor device and method for manufacturing the same | |
WO2003073474A8 (en) | Modular semiconductor die package and method of manufacturing thereof | |
TW200419763A (en) | Multi-chips stacked package | |
WO2003075348A3 (en) | Stacked die semiconductor device | |
TW200608540A (en) | Stacked packaging methods and structures | |
EP1667228A3 (en) | Semiconductor light emitting device and method of manufacturing the same | |
WO2004111659A3 (en) | Methods and apparatus for packaging integrated circuit devices | |
AU2001243498A1 (en) | Encapsulated display device | |
WO2002091489A3 (en) | Surface mount light emitting device package and fabrication method | |
EP1324383A3 (en) | Semiconductor device and method for manufacturing the same | |
EP2261949A3 (en) | LED having vertical structure and method for fabricating the same | |
AU2003299748A1 (en) | Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices | |
EP2557139A3 (en) | Light emitting device including semiconductor nanocrystals | |
WO2003085737A3 (en) | Method and apparatus for stacking multiple die in a flip chip semiconductor package | |
WO2004010510A8 (en) | Trench cut light emitting diodes and methods of fabricating same | |
EP1670072A4 (en) | Illuminating device | |
WO2005057672A3 (en) | Surface mount light emitting chip package | |
WO2002003474A3 (en) | N-type nitride semiconductor laminate and semiconductor device using same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |