WO2005055310A3 - Process for packaging components, and packaged components - Google Patents

Process for packaging components, and packaged components Download PDF

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Publication number
WO2005055310A3
WO2005055310A3 PCT/EP2004/012917 EP2004012917W WO2005055310A3 WO 2005055310 A3 WO2005055310 A3 WO 2005055310A3 EP 2004012917 W EP2004012917 W EP 2004012917W WO 2005055310 A3 WO2005055310 A3 WO 2005055310A3
Authority
WO
WIPO (PCT)
Prior art keywords
regions
connection
components
body regions
packaged
Prior art date
Application number
PCT/EP2004/012917
Other languages
French (fr)
Other versions
WO2005055310A2 (en
Inventor
Juergen Leib
Original Assignee
Schott Ag
Juergen Leib
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Ag, Juergen Leib filed Critical Schott Ag
Priority to DE602004026112T priority Critical patent/DE602004026112D1/en
Priority to EP04797893A priority patent/EP1700337B1/en
Priority to US10/580,284 priority patent/US7700397B2/en
Priority to JP2006541821A priority patent/JP5329758B2/en
Priority to AT04797893T priority patent/ATE461525T1/en
Publication of WO2005055310A2 publication Critical patent/WO2005055310A2/en
Publication of WO2005055310A3 publication Critical patent/WO2005055310A3/en
Priority to IL175341A priority patent/IL175341A/en
Priority to US12/753,514 priority patent/US8309384B2/en

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Abstract

The invention relates to a wafer level packaging process and to a component packaged in this way. It is an object of the invention to provide a process of this type which ensures a high yield, is also suitable for optical and/or micro­mechanical components and achieves improved thermo-mechanical decoupling of the connections from the functional regions. According to the process of the invention, the base substrate is divided into body regions and connection regions, the body regions in each case extending over the functional regions and the connection regions being offset with respect to the contact-connection recesses. The component is then thinned in the body regions or the connection regions until it has different thicknesses in the body regions and the connection regions, before the wafer assembly is diced into chips.
PCT/EP2004/012917 2003-12-03 2004-11-15 Process for packaging components, and packaged components WO2005055310A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE602004026112T DE602004026112D1 (en) 2003-12-03 2004-11-15 Process for encapsulating components and encapsulated components
EP04797893A EP1700337B1 (en) 2003-12-03 2004-11-15 Process for packaging components and packaged components
US10/580,284 US7700397B2 (en) 2003-12-03 2004-11-15 Process for packaging components, and packaged components
JP2006541821A JP5329758B2 (en) 2003-12-03 2004-11-15 The process of packaging components, and the packaged components
AT04797893T ATE461525T1 (en) 2003-12-03 2004-11-15 PROCESS FOR CAPSULATING COMPONENTS AND ENCAPSULATED COMPONENTS
IL175341A IL175341A (en) 2003-12-03 2006-05-01 Process for packaging components and packaged components
US12/753,514 US8309384B2 (en) 2003-12-03 2010-04-02 Process for packaging components, and packaged components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10356885A DE10356885B4 (en) 2003-12-03 2003-12-03 Method of housing components and housed component
DE10356885.9 2003-12-03

Related Child Applications (2)

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US10/580,284 A-371-Of-International US7700397B2 (en) 2003-12-03 2004-11-15 Process for packaging components, and packaged components
US12/753,514 Continuation US8309384B2 (en) 2003-12-03 2010-04-02 Process for packaging components, and packaged components

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WO2005055310A2 WO2005055310A2 (en) 2005-06-16
WO2005055310A3 true WO2005055310A3 (en) 2005-11-03

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US (2) US7700397B2 (en)
EP (1) EP1700337B1 (en)
JP (2) JP5329758B2 (en)
KR (1) KR20060126636A (en)
CN (1) CN1890789A (en)
AT (1) ATE461525T1 (en)
DE (2) DE10356885B4 (en)
IL (1) IL175341A (en)
TW (1) TW200524066A (en)
WO (1) WO2005055310A2 (en)

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DE10356885B4 (en) 2005-11-03
JP2007513507A (en) 2007-05-24
KR20060126636A (en) 2006-12-08
US8309384B2 (en) 2012-11-13
JP5329758B2 (en) 2013-10-30
US20080038868A1 (en) 2008-02-14
EP1700337A2 (en) 2006-09-13
US20100187669A1 (en) 2010-07-29
US7700397B2 (en) 2010-04-20
ATE461525T1 (en) 2010-04-15
WO2005055310A2 (en) 2005-06-16
CN1890789A (en) 2007-01-03
IL175341A0 (en) 2006-09-05
JP2012156551A (en) 2012-08-16
DE10356885A1 (en) 2005-07-07
DE602004026112D1 (en) 2010-04-29
IL175341A (en) 2010-06-30
TW200524066A (en) 2005-07-16
EP1700337B1 (en) 2010-03-17

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