WO2005053167A3 - Method and apparatus for microwave interconnection - Google Patents

Method and apparatus for microwave interconnection Download PDF

Info

Publication number
WO2005053167A3
WO2005053167A3 PCT/US2004/035515 US2004035515W WO2005053167A3 WO 2005053167 A3 WO2005053167 A3 WO 2005053167A3 US 2004035515 W US2004035515 W US 2004035515W WO 2005053167 A3 WO2005053167 A3 WO 2005053167A3
Authority
WO
WIPO (PCT)
Prior art keywords
microwave
feedthrough pin
channel
chassis plate
module
Prior art date
Application number
PCT/US2004/035515
Other languages
French (fr)
Other versions
WO2005053167A2 (en
Inventor
William L Caplan
Nicholas S Hodgman
Thomas B Chamberlain
Michael S Morningstar
Original Assignee
Itt Mfg Enterprises Inc
William L Caplan
Nicholas S Hodgman
Thomas B Chamberlain
Michael S Morningstar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itt Mfg Enterprises Inc, William L Caplan, Nicholas S Hodgman, Thomas B Chamberlain, Michael S Morningstar filed Critical Itt Mfg Enterprises Inc
Publication of WO2005053167A2 publication Critical patent/WO2005053167A2/en
Publication of WO2005053167A3 publication Critical patent/WO2005053167A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints

Abstract

Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave module using a feedthrough pin mounted in the module. The feedthrough pin extends from the microwave module interior into a channel defined in the chassis plate and to a microstrip line on the opposite side of the plate. An electrically conductive gasket is placed about the feedthrough pin between the microwave module and chassis plate to reduce signal leakage and enhance ground continuity. An insulating sleeve is installed about the feedthrough pin in the chassis plate channel and provides a nominal clearance (e.g., 0.005 inches) within that channel to allow for manufacturing and assembly tolerances and to enable feedthrough impedance to be substantially insensitive to the position of the feedthrough pin and insulating sleeve within the channel.
PCT/US2004/035515 2003-11-14 2004-11-10 Method and apparatus for microwave interconnection WO2005053167A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/712,394 2003-11-14
US10/712,394 US6998944B2 (en) 2003-11-14 2003-11-14 Method and apparatus for microwave interconnection

Publications (2)

Publication Number Publication Date
WO2005053167A2 WO2005053167A2 (en) 2005-06-09
WO2005053167A3 true WO2005053167A3 (en) 2005-12-29

Family

ID=34573540

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/035515 WO2005053167A2 (en) 2003-11-14 2004-11-10 Method and apparatus for microwave interconnection

Country Status (2)

Country Link
US (1) US6998944B2 (en)
WO (1) WO2005053167A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692508B2 (en) * 2007-04-19 2010-04-06 Raytheon Company Spring loaded microwave interconnector
CN111342249B (en) * 2018-12-19 2023-03-14 康普技术有限责任公司 Connector for coaxial cable
CN114421189B (en) * 2021-12-14 2024-03-08 北京无线电计量测试研究所 Radio frequency insulation terminal 90-degree through-wall microstrip line connector and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311408A (en) * 1991-08-09 1994-05-10 Tandem Computers, Incorporated Electronic assembly with improved grounding and EMI shielding
US5619399A (en) * 1995-02-16 1997-04-08 Micromodule Systems, Inc. Multiple chip module mounting assembly and computer using same
US6028497A (en) * 1998-01-28 2000-02-22 Trw Inc. RF pin grid array
US6102709A (en) * 1999-03-31 2000-08-15 Raytheon Company Threaded double sided compressed wire bundle connector
US6166615A (en) * 1998-09-16 2000-12-26 Raytheon Company Blind mate non-crimp pin RF connector
US6878872B2 (en) * 2003-03-31 2005-04-12 Molex Incorporated Shielding cage with multiple module-receiving bays

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
NL77656C (en) * 1945-03-27
US2762991A (en) * 1954-07-06 1956-09-11 Hughes Aircraft Co Hermetically sealed coaxial connector
US3784726A (en) * 1971-05-20 1974-01-08 Hewlett Packard Co Microcircuit package assembly
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
US4782313A (en) * 1988-01-12 1988-11-01 General Electric Company Transmission line shorting switch
US4837529A (en) * 1988-03-24 1989-06-06 Honeywell, Inc. Millimeter wave microstrip to coaxial line side-launch transition
US5019829A (en) * 1989-02-08 1991-05-28 Heckman Douglas E Plug-in package for microwave integrated circuit having cover-mounted antenna
US4975065A (en) * 1989-09-26 1990-12-04 Avantek, Inc. Microwave circuit module connector
US5363075A (en) * 1992-12-03 1994-11-08 Hughes Aircraft Company Multiple layer microwave integrated circuit module connector assembly
US5453750A (en) * 1993-12-23 1995-09-26 Hughes Aircraft Company Coaxial microstrip-to-microstrip interconnection system
US5563562A (en) * 1995-03-24 1996-10-08 Itt Industries, Inc. RF feed-through connector
GB9506878D0 (en) * 1995-04-03 1995-05-24 Northern Telecom Ltd A coxial transaction arrangement
US5696474A (en) * 1995-12-22 1997-12-09 Watkins-Johnson Company High frequency hermetically sealed electrical feed through connector
US5633615A (en) * 1995-12-26 1997-05-27 Hughes Electronics Vertical right angle solderless interconnects from suspended stripline to three-wire lines on MIC substrates
US5797765A (en) * 1996-11-01 1998-08-25 Hewlett-Packard Company Coaxial connector for mounting on a circuit substrate
US5871513A (en) * 1997-04-30 1999-02-16 Medtronic Inc. Centerless ground feedthrough pin for an electrical power source in an implantable medical device
JP3476351B2 (en) * 1997-11-27 2003-12-10 シャープ株式会社 Low noise amplifier
US5963111A (en) * 1998-04-09 1999-10-05 Raytheon Company Orthogonal transition from coax to stripline for opposite sides of a stripline board
US5994975A (en) * 1998-04-28 1999-11-30 Trw Inc. Millimeter wave ceramic-metal feedthroughs
US6094115A (en) * 1999-02-12 2000-07-25 Raytheon Company Control impedance RF pin for extending compressible button interconnect contact distance
US6417747B1 (en) * 2001-08-23 2002-07-09 Raytheon Company Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311408A (en) * 1991-08-09 1994-05-10 Tandem Computers, Incorporated Electronic assembly with improved grounding and EMI shielding
US5619399A (en) * 1995-02-16 1997-04-08 Micromodule Systems, Inc. Multiple chip module mounting assembly and computer using same
US6028497A (en) * 1998-01-28 2000-02-22 Trw Inc. RF pin grid array
US6166615A (en) * 1998-09-16 2000-12-26 Raytheon Company Blind mate non-crimp pin RF connector
US6102709A (en) * 1999-03-31 2000-08-15 Raytheon Company Threaded double sided compressed wire bundle connector
US6878872B2 (en) * 2003-03-31 2005-04-12 Molex Incorporated Shielding cage with multiple module-receiving bays

Also Published As

Publication number Publication date
US6998944B2 (en) 2006-02-14
WO2005053167A2 (en) 2005-06-09
US20050104682A1 (en) 2005-05-19

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