WO2005050706A3 - Die design with integrated assembly aid - Google Patents

Die design with integrated assembly aid Download PDF

Info

Publication number
WO2005050706A3
WO2005050706A3 PCT/US2004/037953 US2004037953W WO2005050706A3 WO 2005050706 A3 WO2005050706 A3 WO 2005050706A3 US 2004037953 W US2004037953 W US 2004037953W WO 2005050706 A3 WO2005050706 A3 WO 2005050706A3
Authority
WO
WIPO (PCT)
Prior art keywords
micro
array
holes
assembly aid
probe
Prior art date
Application number
PCT/US2004/037953
Other languages
French (fr)
Other versions
WO2005050706A2 (en
Inventor
Alexander Brandorff
Original Assignee
Wentworth Lab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wentworth Lab Inc filed Critical Wentworth Lab Inc
Priority to CN200480033430A priority Critical patent/CN100595598C/en
Priority to JP2006539943A priority patent/JP4732360B2/en
Priority to EP04810930.0A priority patent/EP1692529A4/en
Priority to KR1020067011744A priority patent/KR101147032B1/en
Publication of WO2005050706A2 publication Critical patent/WO2005050706A2/en
Publication of WO2005050706A3 publication Critical patent/WO2005050706A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Abstract

An upper die portion (36) of a die head for a aligning probe pins (14) in first array of first micro-holes (18) formed in lower die portion (12) of the die head, which generally includes a spacer portion (38), a support frame (40), and first and second assembly aid films (42) and (44), respectively. Spacer portion (38) is adapted to contact lower die portion (12). First assembly aid film (42) is typically positioned between second surface (48) and support frame (40) and includes a second array of second micro-holes (50) adapted to receive probe pins (14). Second assembly aid film (44) generally is in contact or close proximity to first assembly aid film (42) and has a third array of third micro-holes (52) adapted to receive prove pins (14). Second array of second micro-holes (50) and third array of third micro-holes (52) are patterned to align with one another but are both offset with first array of first micro-holes (18) by approximately the lateral distance between probe tip (20) and probe head (28).
PCT/US2004/037953 2003-11-14 2004-11-12 Die design with integrated assembly aid WO2005050706A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200480033430A CN100595598C (en) 2003-11-14 2004-11-12 Die design with integrated assembly aid
JP2006539943A JP4732360B2 (en) 2003-11-14 2004-11-12 Die design with assembly aids
EP04810930.0A EP1692529A4 (en) 2003-11-14 2004-11-12 Die design with integrated assembly aid
KR1020067011744A KR101147032B1 (en) 2003-11-14 2004-11-12 Die design with integrated assembly aid

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51996603P 2003-11-14 2003-11-14
US60/519,966 2003-11-14

Publications (2)

Publication Number Publication Date
WO2005050706A2 WO2005050706A2 (en) 2005-06-02
WO2005050706A3 true WO2005050706A3 (en) 2005-12-29

Family

ID=34619404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/037953 WO2005050706A2 (en) 2003-11-14 2004-11-12 Die design with integrated assembly aid

Country Status (9)

Country Link
US (2) US7282936B2 (en)
EP (1) EP1692529A4 (en)
JP (1) JP4732360B2 (en)
KR (1) KR101147032B1 (en)
CN (1) CN100595598C (en)
CR (1) CR8438A (en)
MY (1) MY137372A (en)
TW (1) TWI375798B (en)
WO (1) WO2005050706A2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7609512B2 (en) * 2001-11-19 2009-10-27 Otter Products, Llc Protective enclosure for electronic device
US7649372B2 (en) * 2003-11-14 2010-01-19 Wentworth Laboratories, Inc. Die design with integrated assembly aid
TWI261933B (en) * 2005-11-21 2006-09-11 Mjc Probe Inc Method for batch production process of micro-hole guide plate of vertical probe card
DE202007016398U1 (en) * 2006-11-27 2008-02-21 Feinmetall Gmbh Contacting device for contacting an electrical DUT to be tested
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
US8664969B2 (en) * 2009-09-11 2014-03-04 Probelogic, Inc. Methods and apparatus for implementing electrical connectivity for electronic circuit testing
US8217674B2 (en) * 2010-02-08 2012-07-10 Texas Instruments Incorporated Systems and methods to test integrated circuits
CN102346201B (en) * 2010-07-26 2015-06-17 旺矽科技股份有限公司 Probe head of vertical probe card and method for manufacturing compound plate of probe head
TWI435083B (en) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
US9267968B2 (en) * 2010-12-09 2016-02-23 Wentworth Laboratories, Inc. Probe card assemblies and probe pins including carbon nanotubes
CN103245807B (en) * 2012-02-06 2015-11-25 景美科技股份有限公司 Probe unit structure and preparation method thereof
KR101366036B1 (en) 2012-11-02 2014-02-28 (주) 루켄테크놀러지스 Vertical type probe card
JP6112890B2 (en) * 2013-02-07 2017-04-12 日置電機株式会社 Probe unit, board inspection apparatus, and probe unit assembling method
ITMI20130561A1 (en) * 2013-04-09 2014-10-10 Technoprobe Spa HEAD OF MEASUREMENT OF ELECTRONIC DEVICES
KR101437774B1 (en) 2013-04-17 2014-09-11 송지은 Advanced Probe Head
KR101476683B1 (en) * 2013-05-08 2014-12-26 (주) 루켄테크놀러지스 Vertical film type probe card
TWI521212B (en) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
WO2016087369A2 (en) * 2014-12-04 2016-06-09 Technoprobe S.P.A. Testing head comprising vertical probes
US9535091B2 (en) * 2015-03-16 2017-01-03 Taiwan Semiconductor Manufacturing Co., Ltd. Probe head, probe card assembly using the same, and manufacturing method thereof
JP2018179721A (en) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス Electrical connection device
TWI640783B (en) * 2017-09-15 2018-11-11 中華精測科技股份有限公司 Probe card device and round probe
IT202000028838A1 (en) * 2020-11-27 2022-05-27 Technoprobe Spa LARGE MEASUREMENT CARD FOR TESTING ELECTRONIC DEVICES AND RELATED MANUFACTURING METHOD
WO2023188243A1 (en) * 2022-03-31 2023-10-05 日本電子材料株式会社 Probe passing method and probe

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6404211B2 (en) * 1999-02-11 2002-06-11 International Business Machines Corporation Metal buckling beam probe

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230848B2 (en) 1973-10-09 1977-08-11
JPS5065232A (en) 1973-10-09 1975-06-02
US4027935A (en) 1976-06-21 1977-06-07 International Business Machines Corporation Contact for an electrical contactor assembly
JPS57101769A (en) * 1980-10-30 1982-06-24 Everett Charles Inc Translation apparatus and test mount apparatus and manufacture of translation apparatus
EP0078339B1 (en) 1981-10-30 1986-07-30 Ibm Deutschland Gmbh Test apparatus for testing runs of a circuit board with at least one test head comprising a plurality of flexible contacts
US4451327A (en) 1982-12-17 1984-05-29 Psi Star, Inc. Process and structure for etching copper
US4466859A (en) 1983-05-25 1984-08-21 Psi Star, Inc. Process for etching copper
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US6043563A (en) 1997-05-06 2000-03-28 Formfactor, Inc. Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US4747907A (en) 1986-10-29 1988-05-31 International Business Machines Corporation Metal etching process with etch rate enhancement
US4980638A (en) 1989-05-26 1990-12-25 Dermon John A Microcircuit probe and method for manufacturing same
JPH0362546A (en) 1989-07-31 1991-03-18 Toshiba Corp Scanning probe and manufacture thereof
US5415559A (en) * 1992-05-18 1995-05-16 Japan Aviation Electronics Industry, Ltd. Electrical connector having a plurality of contact pin springs
JPH0650991A (en) * 1992-07-31 1994-02-25 Toho Denshi Kk Probe apparatus
JPH06249878A (en) 1993-03-01 1994-09-09 Kobe Steel Ltd Probe unit and manufacture thereof
US5326428A (en) 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
US6023103A (en) 1994-11-15 2000-02-08 Formfactor, Inc. Chip-scale carrier for semiconductor devices including mounted spring contacts
US5508144A (en) 1993-11-19 1996-04-16 At&T Corp. Process for fabricating a device
US5493230A (en) 1994-02-25 1996-02-20 Everett Charles Technologies, Inc. Retention of test probes in translator fixtures
US5416429A (en) 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
US5495667A (en) 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
US6150186A (en) 1995-05-26 2000-11-21 Formfactor, Inc. Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
KR0150334B1 (en) * 1995-08-17 1998-12-01 남재우 Probe card having vertical needle
KR970053345A (en) * 1995-12-30 1997-07-31 김광호 Carrier Transfer Device
US5883520A (en) * 1996-06-14 1999-03-16 Star Technology Group, Inc. Retention of test probes in translator fixtures
JP2972595B2 (en) * 1996-09-25 1999-11-08 日本電気ファクトリエンジニアリング株式会社 Probe card
US5959461A (en) 1997-07-14 1999-09-28 Wentworth Laboratories, Inc. Probe station adapter for backside emission inspection
WO1999004273A1 (en) 1997-07-15 1999-01-28 Wentworth Laboratories, Inc. Probe station with multiple adjustable probe supports
JPH11125646A (en) 1997-10-21 1999-05-11 Mitsubishi Electric Corp Vertical needle type probe card, and its manufacture and exchange method for defective probe of the same
ATE260470T1 (en) * 1997-11-05 2004-03-15 Feinmetall Gmbh TEST HEAD FOR MICROSTRUCTURES WITH INTERFACE
JPH11160356A (en) 1997-11-25 1999-06-18 Matsushita Electric Ind Co Ltd Probe card for wafer collective measurement and inspection and ceramic multilayer interconnection board as well as their manufacture
SE518084C2 (en) * 1998-01-23 2002-08-20 Ericsson Telefon Ab L M Processes and devices related to functions or functional devices and methods for controlling the process flow between functions
US5952843A (en) 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6194127B1 (en) 1998-05-27 2001-02-27 Mcdonnell Douglas Corporation Resistive sheet patterning process and product thereof
JPH11344509A (en) * 1998-05-29 1999-12-14 Hiroshi Katagawa Probe card and probe pin
US6503231B1 (en) 1998-06-10 2003-01-07 Georgia Tech Research Corporation Microneedle device for transport of molecules across tissue
US6303262B1 (en) 1998-06-18 2001-10-16 Mitsubishi Paper Mills Ltd. Photomask material, photomask and methods for the production thereof
JP3443011B2 (en) * 1998-08-20 2003-09-02 シャープ株式会社 Film carrier tape and test method therefor
US6124723A (en) 1998-08-31 2000-09-26 Wentworth Laboratories, Inc. Probe holder for low voltage, low current measurements in a water probe station
US6160412A (en) 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
SG75186A1 (en) * 1998-11-30 2000-09-19 Advantest Corp Method for producing contact structures
US6163162A (en) 1999-01-11 2000-12-19 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6255602B1 (en) 1999-03-15 2001-07-03 Wentworth Laboratories, Inc. Multiple layer electrical interface
US6330744B1 (en) 1999-07-12 2001-12-18 Pjc Technologies, Inc. Customized electrical test probe head using uniform probe assemblies
JP2001099863A (en) * 1999-10-01 2001-04-13 Japan Electronic Materials Corp Probe and probe card using the same
US6363605B1 (en) 1999-11-03 2002-04-02 Yi-Chi Shih Method for fabricating a plurality of non-symmetrical waveguide probes
FR2802346B1 (en) 1999-12-13 2002-02-08 Upsys Probe Technology Sas HIGH INTERCONNECTION DENSITY TEST CONNECTOR, IN PARTICULAR FOR VERIFYING INTEGRATED CIRCUITS
US6633175B1 (en) 2000-03-06 2003-10-14 Wenworth Laboratories, Inc. Temperature compensated vertical pin probing device
JP3486841B2 (en) 2000-08-09 2004-01-13 日本電子材料株式会社 Vertical probe card
US6448506B1 (en) 2000-12-28 2002-09-10 Amkor Technology, Inc. Semiconductor package and circuit board for making the package
US6564454B1 (en) 2000-12-28 2003-05-20 Amkor Technology, Inc. Method of making and stacking a semiconductor package
EP1356307B1 (en) * 2001-01-31 2006-11-22 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
US6573734B2 (en) 2001-05-08 2003-06-03 The Board Of Trustees Of The University Of Illinois Integrated thin film liquid conductivity sensor
US6906540B2 (en) * 2001-09-20 2005-06-14 Wentworth Laboratories, Inc. Method for chemically etching photo-defined micro electrical contacts
JP2003234359A (en) * 2002-02-08 2003-08-22 Hitachi Ltd Method of manufacturing semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6404211B2 (en) * 1999-02-11 2002-06-11 International Business Machines Corporation Metal buckling beam probe

Also Published As

Publication number Publication date
TWI375798B (en) 2012-11-01
US7282936B2 (en) 2007-10-16
EP1692529A4 (en) 2014-03-26
US20050110510A1 (en) 2005-05-26
US20080084227A1 (en) 2008-04-10
US7388392B2 (en) 2008-06-17
JP4732360B2 (en) 2011-07-27
EP1692529A2 (en) 2006-08-23
CN100595598C (en) 2010-03-24
CR8438A (en) 2006-09-22
KR20060135665A (en) 2006-12-29
MY137372A (en) 2009-01-30
KR101147032B1 (en) 2012-05-22
WO2005050706A2 (en) 2005-06-02
TW200530591A (en) 2005-09-16
JP2007512516A (en) 2007-05-17
CN1879025A (en) 2006-12-13

Similar Documents

Publication Publication Date Title
WO2005050706A3 (en) Die design with integrated assembly aid
USD479140S1 (en) Electronic scale
EP1731963A3 (en) Mold, pattern forming method, and pattern forming apparatus
USD567246S1 (en) Buttons for a computing device
WO2007070004A3 (en) Methods for making micro needles and applications thereof
DE60016273D1 (en) AN ARRANGEMENT OF CAPACITIVE, MICROMECHANICAL ULTRASONIC TRANSDUCER ELEMENTS WITH CONTACT BY THE CARRIER SUBSTRATE
TW200711545A (en) A method of manufacturing a MEMS element
EP1737054A3 (en) Piezoelectric transducer
WO2008014107A3 (en) User interface substrate for handset device
EP1670079A3 (en) Method of forming a conductive pattern of a thin film transistor
CA2404183A1 (en) Non-contact tester for integrated circuits
AU2001280980A1 (en) Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography
TW200631064A (en) Semiconductor device
WO2009006186A3 (en) Multi-offset die head
EP1396891A3 (en) Semiconductor device and optical device using the same
CA2435421A1 (en) Method for making an article comprising a sheet and at least an element directly mounted thereon
SG170619A1 (en) Decal transfer microfabrication
TW200510832A (en) Display unit using interferometric modulation and manufacturing method thereof
EP1571353A3 (en) Connection part between a panel and a support
DE602007009893D1 (en) Multi-axis force sensor chip
WO2007078686A3 (en) Method of polishing a semiconductor-on-insulator structure
WO2007100713A3 (en) Approach for fabricating cantilever probes
WO2009057620A1 (en) Pressure sensor and method for manufacturing the same
USD514996S1 (en) Automobile instrument gage face
EP1378691A3 (en) Sealing device and sliding member

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200480033430.8

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006539943

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: CR2006-008438

Country of ref document: CR

REEP Request for entry into the european phase

Ref document number: 2004810930

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2004810930

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020067011744

Country of ref document: KR

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWP Wipo information: published in national office

Ref document number: 2004810930

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020067011744

Country of ref document: KR