WO2005050706A2 - Die design with integrated assembly aid - Google Patents
Die design with integrated assembly aid Download PDFInfo
- Publication number
- WO2005050706A2 WO2005050706A2 PCT/US2004/037953 US2004037953W WO2005050706A2 WO 2005050706 A2 WO2005050706 A2 WO 2005050706A2 US 2004037953 W US2004037953 W US 2004037953W WO 2005050706 A2 WO2005050706 A2 WO 2005050706A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- assembly aid
- micro
- holes
- array
- aid film
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims abstract description 128
- 125000006850 spacer group Chemical group 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims description 21
- 238000003491 array Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000005553 drilling Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 229920004943 Delrin® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04810930.0A EP1692529A4 (en) | 2003-11-14 | 2004-11-12 | Die design with integrated assembly aid |
JP2006539943A JP4732360B2 (en) | 2003-11-14 | 2004-11-12 | Die design with assembly aids |
CN200480033430A CN100595598C (en) | 2003-11-14 | 2004-11-12 | Die design with integrated assembly aid |
KR1020067011744A KR101147032B1 (en) | 2003-11-14 | 2004-11-12 | Die design with integrated assembly aid |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51996603P | 2003-11-14 | 2003-11-14 | |
US60/519,966 | 2003-11-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005050706A2 true WO2005050706A2 (en) | 2005-06-02 |
WO2005050706A3 WO2005050706A3 (en) | 2005-12-29 |
Family
ID=34619404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/037953 WO2005050706A2 (en) | 2003-11-14 | 2004-11-12 | Die design with integrated assembly aid |
Country Status (9)
Country | Link |
---|---|
US (2) | US7282936B2 (en) |
EP (1) | EP1692529A4 (en) |
JP (1) | JP4732360B2 (en) |
KR (1) | KR101147032B1 (en) |
CN (1) | CN100595598C (en) |
CR (1) | CR8438A (en) |
MY (1) | MY137372A (en) |
TW (1) | TWI375798B (en) |
WO (1) | WO2005050706A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101191800B (en) * | 2006-11-27 | 2012-01-04 | 精炼金属股份有限公司 | Contacting device for contacting detection piece and method for contacting detection piece |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7609512B2 (en) * | 2001-11-19 | 2009-10-27 | Otter Products, Llc | Protective enclosure for electronic device |
US7649372B2 (en) * | 2003-11-14 | 2010-01-19 | Wentworth Laboratories, Inc. | Die design with integrated assembly aid |
TWI261933B (en) * | 2005-11-21 | 2006-09-11 | Mjc Probe Inc | Method for batch production process of micro-hole guide plate of vertical probe card |
US7554348B2 (en) * | 2007-06-29 | 2009-06-30 | Wentworth Laboratories, Inc. | Multi-offset die head |
US8664969B2 (en) * | 2009-09-11 | 2014-03-04 | Probelogic, Inc. | Methods and apparatus for implementing electrical connectivity for electronic circuit testing |
US8217674B2 (en) * | 2010-02-08 | 2012-07-10 | Texas Instruments Incorporated | Systems and methods to test integrated circuits |
CN102346201B (en) * | 2010-07-26 | 2015-06-17 | 旺矽科技股份有限公司 | Probe head of vertical probe card and method for manufacturing compound plate of probe head |
TWI435083B (en) * | 2010-07-27 | 2014-04-21 | Mpi Corp | Combination probe head for vertical probe card and its assembly alignment method |
KR101818549B1 (en) * | 2010-12-09 | 2018-01-15 | 웬트워쓰 라보라토리즈, 인크. | Probe card assemblies and probe pins including carbon nanotubes |
CN103245807B (en) * | 2012-02-06 | 2015-11-25 | 景美科技股份有限公司 | Probe unit structure and preparation method thereof |
KR101366036B1 (en) | 2012-11-02 | 2014-02-28 | (주) 루켄테크놀러지스 | Vertical type probe card |
JP6112890B2 (en) * | 2013-02-07 | 2017-04-12 | 日置電機株式会社 | Probe unit, board inspection apparatus, and probe unit assembling method |
ITMI20130561A1 (en) * | 2013-04-09 | 2014-10-10 | Technoprobe Spa | HEAD OF MEASUREMENT OF ELECTRONIC DEVICES |
KR101437774B1 (en) | 2013-04-17 | 2014-09-11 | 송지은 | Advanced Probe Head |
KR101476683B1 (en) * | 2013-05-08 | 2014-12-26 | (주) 루켄테크놀러지스 | Vertical film type probe card |
TWI521212B (en) * | 2014-03-10 | 2016-02-11 | A method and a method of assembling a vertical probe device, and a vertical probe device | |
EP3227692A2 (en) * | 2014-12-04 | 2017-10-11 | Technoprobe S.p.A | Testing head comprising vertical probes |
US9535091B2 (en) * | 2015-03-16 | 2017-01-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probe head, probe card assembly using the same, and manufacturing method thereof |
JP2018179721A (en) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | Electrical connection device |
TWI640783B (en) * | 2017-09-15 | 2018-11-11 | 中華精測科技股份有限公司 | Probe card device and round probe |
IT202000028838A1 (en) * | 2020-11-27 | 2022-05-27 | Technoprobe Spa | LARGE MEASUREMENT CARD FOR TESTING ELECTRONIC DEVICES AND RELATED MANUFACTURING METHOD |
WO2023188243A1 (en) * | 2022-03-31 | 2023-10-05 | 日本電子材料株式会社 | Probe passing method and probe |
Citations (4)
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US4901013A (en) | 1988-08-19 | 1990-02-13 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus having a buckling beam probe assembly |
US5493230A (en) | 1994-02-25 | 1996-02-20 | Everett Charles Technologies, Inc. | Retention of test probes in translator fixtures |
US5883520A (en) | 1996-06-14 | 1999-03-16 | Star Technology Group, Inc. | Retention of test probes in translator fixtures |
US20020041189A1 (en) | 2000-08-09 | 2002-04-11 | Nihon Denshizairyo Kabushiki Kaisha | Vertical probe card |
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-
2004
- 2004-11-12 WO PCT/US2004/037953 patent/WO2005050706A2/en active Search and Examination
- 2004-11-12 EP EP04810930.0A patent/EP1692529A4/en not_active Withdrawn
- 2004-11-12 JP JP2006539943A patent/JP4732360B2/en not_active Expired - Fee Related
- 2004-11-12 US US10/987,039 patent/US7282936B2/en active Active
- 2004-11-12 CN CN200480033430A patent/CN100595598C/en active Active
- 2004-11-12 MY MYPI20044742A patent/MY137372A/en unknown
- 2004-11-12 KR KR1020067011744A patent/KR101147032B1/en not_active IP Right Cessation
- 2004-11-15 TW TW093134933A patent/TWI375798B/en active
-
2006
- 2006-06-07 CR CR8438A patent/CR8438A/en not_active Application Discontinuation
-
2007
- 2007-10-15 US US11/872,433 patent/US7388392B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4901013A (en) | 1988-08-19 | 1990-02-13 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus having a buckling beam probe assembly |
US5493230A (en) | 1994-02-25 | 1996-02-20 | Everett Charles Technologies, Inc. | Retention of test probes in translator fixtures |
US5883520A (en) | 1996-06-14 | 1999-03-16 | Star Technology Group, Inc. | Retention of test probes in translator fixtures |
US20020041189A1 (en) | 2000-08-09 | 2002-04-11 | Nihon Denshizairyo Kabushiki Kaisha | Vertical probe card |
Non-Patent Citations (1)
Title |
---|
See also references of EP1692529A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101191800B (en) * | 2006-11-27 | 2012-01-04 | 精炼金属股份有限公司 | Contacting device for contacting detection piece and method for contacting detection piece |
Also Published As
Publication number | Publication date |
---|---|
WO2005050706A3 (en) | 2005-12-29 |
TWI375798B (en) | 2012-11-01 |
CN1879025A (en) | 2006-12-13 |
US20050110510A1 (en) | 2005-05-26 |
EP1692529A4 (en) | 2014-03-26 |
US7282936B2 (en) | 2007-10-16 |
US7388392B2 (en) | 2008-06-17 |
KR101147032B1 (en) | 2012-05-22 |
CR8438A (en) | 2006-09-22 |
CN100595598C (en) | 2010-03-24 |
KR20060135665A (en) | 2006-12-29 |
MY137372A (en) | 2009-01-30 |
JP4732360B2 (en) | 2011-07-27 |
US20080084227A1 (en) | 2008-04-10 |
TW200530591A (en) | 2005-09-16 |
EP1692529A2 (en) | 2006-08-23 |
JP2007512516A (en) | 2007-05-17 |
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WWE | Wipo information: entry into national phase |
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