WO2005048663A3 - Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards - Google Patents
Improved methods of cleaning copper surfaces in the manufacture of printed circuit boardsInfo
- Publication number
- WO2005048663A3 WO2005048663A3 PCT/US2004/031434 US2004031434W WO2005048663A3 WO 2005048663 A3 WO2005048663 A3 WO 2005048663A3 US 2004031434 W US2004031434 W US 2004031434W WO 2005048663 A3 WO2005048663 A3 WO 2005048663A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- manufacture
- printed circuit
- circuit boards
- improved methods
- copper surfaces
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/705,026 | 2003-11-10 | ||
US10/705,026 US7063800B2 (en) | 2003-11-10 | 2003-11-10 | Methods of cleaning copper surfaces in the manufacture of printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005048663A2 WO2005048663A2 (en) | 2005-05-26 |
WO2005048663A3 true WO2005048663A3 (en) | 2005-09-22 |
Family
ID=34552258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/031434 WO2005048663A2 (en) | 2003-11-10 | 2004-09-24 | Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards |
Country Status (3)
Country | Link |
---|---|
US (1) | US7063800B2 (en) |
TW (1) | TWI254086B (en) |
WO (1) | WO2005048663A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7976723B2 (en) * | 2007-05-17 | 2011-07-12 | International Business Machines Corporation | Method for kinetically controlled etching of copper |
ES2399477T3 (en) | 2007-12-13 | 2013-04-01 | Akzo Nobel N.V. | Stabilized hydrogen peroxide solutions |
US8518281B2 (en) * | 2008-06-03 | 2013-08-27 | Kesheng Feng | Acid-resistance promoting composition |
US8728246B2 (en) * | 2010-01-26 | 2014-05-20 | Westinghouse Electric Company, Llc | Method and composition for removing deposits |
IL204422A0 (en) * | 2010-03-11 | 2010-12-30 | J G Systems Inc | METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn |
US20130186764A1 (en) * | 2012-01-19 | 2013-07-25 | Kesheng Feng | Low Etch Process for Direct Metallization |
CN113201737A (en) * | 2021-04-29 | 2021-08-03 | 深圳市贝加电子材料有限公司 | Speed-reducing additive for sulfuric acid-persulfate system microetching agent |
CN114807942B (en) * | 2022-03-07 | 2024-02-13 | 上海富柏化工有限公司 | Sodium persulfate microetching additive and application thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020081847A1 (en) * | 2000-12-20 | 2002-06-27 | Lg. Philips Lcd Co., Ltd. | Etchant and array substrate having copper lines etched by the etchant |
US6417147B2 (en) * | 2000-02-29 | 2002-07-09 | Showa Denko K.K. | Cleaning agent composition, method for cleaning and use thereof |
US6579153B2 (en) * | 2000-01-12 | 2003-06-17 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
US20030180377A1 (en) * | 2002-02-12 | 2003-09-25 | Ramirez Jose A. | Enhanced activity hydrogen peroxide disinfectant |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
US4631117A (en) * | 1985-05-06 | 1986-12-23 | Olin Hunt Specialty Products Inc. | Electroless plating process |
US4684560A (en) * | 1985-11-29 | 1987-08-04 | Olin Hunt Specialty Products, Inc. | Printed wiring board having carbon black-coated through holes |
US4724005A (en) * | 1985-11-29 | 1988-02-09 | Olin Hunt Specialty Products Inc. | Liquid carbon black dispersion |
US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4622107A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4718993A (en) * | 1987-05-29 | 1988-01-12 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4874477A (en) * | 1989-04-21 | 1989-10-17 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US4897164A (en) * | 1989-04-24 | 1990-01-30 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
US5110355A (en) * | 1990-03-26 | 1992-05-05 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
US4964959A (en) * | 1990-04-12 | 1990-10-23 | Olin Hunt Specialty Products Inc. | Process for preparing a nonconductive substrate for electroplating |
US5106537A (en) * | 1990-04-12 | 1992-04-21 | Olin Hunt Sub Iii Corp. | Liquid dispersion for enhancing the electroplating of a non-conductive surface |
US5143592A (en) * | 1990-06-01 | 1992-09-01 | Olin Corporation | Process for preparing nonconductive substrates |
US4994153A (en) * | 1990-06-28 | 1991-02-19 | Olin Corporation | Process for preparing nonconductive substrates |
US5139642A (en) * | 1991-05-01 | 1992-08-18 | Olin Corporation | Process for preparing a nonconductive substrate for electroplating |
US6710259B2 (en) * | 1993-05-17 | 2004-03-23 | Electrochemicals, Inc. | Printed wiring boards and methods for making them |
JP4063475B2 (en) * | 1999-11-10 | 2008-03-19 | メック株式会社 | Copper or copper alloy etchant |
US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
-
2003
- 2003-11-10 US US10/705,026 patent/US7063800B2/en not_active Expired - Lifetime
-
2004
- 2004-09-24 WO PCT/US2004/031434 patent/WO2005048663A2/en active Application Filing
- 2004-10-06 TW TW093130192A patent/TWI254086B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6579153B2 (en) * | 2000-01-12 | 2003-06-17 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
US6417147B2 (en) * | 2000-02-29 | 2002-07-09 | Showa Denko K.K. | Cleaning agent composition, method for cleaning and use thereof |
US20020081847A1 (en) * | 2000-12-20 | 2002-06-27 | Lg. Philips Lcd Co., Ltd. | Etchant and array substrate having copper lines etched by the etchant |
US20030180377A1 (en) * | 2002-02-12 | 2003-09-25 | Ramirez Jose A. | Enhanced activity hydrogen peroxide disinfectant |
Also Published As
Publication number | Publication date |
---|---|
US7063800B2 (en) | 2006-06-20 |
WO2005048663A2 (en) | 2005-05-26 |
TWI254086B (en) | 2006-05-01 |
US20050098538A1 (en) | 2005-05-12 |
TW200516177A (en) | 2005-05-16 |
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