WO2005048663A3 - Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards - Google Patents

Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards

Info

Publication number
WO2005048663A3
WO2005048663A3 PCT/US2004/031434 US2004031434W WO2005048663A3 WO 2005048663 A3 WO2005048663 A3 WO 2005048663A3 US 2004031434 W US2004031434 W US 2004031434W WO 2005048663 A3 WO2005048663 A3 WO 2005048663A3
Authority
WO
WIPO (PCT)
Prior art keywords
manufacture
printed circuit
circuit boards
improved methods
copper surfaces
Prior art date
Application number
PCT/US2004/031434
Other languages
French (fr)
Other versions
WO2005048663A2 (en
Inventor
Ying Ding
Ronald N Redline
Richard C Retallick
Mark Wojtaszek
Original Assignee
Macdermid Acumen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Acumen Inc filed Critical Macdermid Acumen Inc
Publication of WO2005048663A2 publication Critical patent/WO2005048663A2/en
Publication of WO2005048663A3 publication Critical patent/WO2005048663A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Detergent Compositions (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).
PCT/US2004/031434 2003-11-10 2004-09-24 Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards WO2005048663A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/705,026 2003-11-10
US10/705,026 US7063800B2 (en) 2003-11-10 2003-11-10 Methods of cleaning copper surfaces in the manufacture of printed circuit boards

Publications (2)

Publication Number Publication Date
WO2005048663A2 WO2005048663A2 (en) 2005-05-26
WO2005048663A3 true WO2005048663A3 (en) 2005-09-22

Family

ID=34552258

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/031434 WO2005048663A2 (en) 2003-11-10 2004-09-24 Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards

Country Status (3)

Country Link
US (1) US7063800B2 (en)
TW (1) TWI254086B (en)
WO (1) WO2005048663A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7976723B2 (en) * 2007-05-17 2011-07-12 International Business Machines Corporation Method for kinetically controlled etching of copper
ES2399477T3 (en) 2007-12-13 2013-04-01 Akzo Nobel N.V. Stabilized hydrogen peroxide solutions
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US8728246B2 (en) * 2010-01-26 2014-05-20 Westinghouse Electric Company, Llc Method and composition for removing deposits
IL204422A0 (en) * 2010-03-11 2010-12-30 J G Systems Inc METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
CN113201737A (en) * 2021-04-29 2021-08-03 深圳市贝加电子材料有限公司 Speed-reducing additive for sulfuric acid-persulfate system microetching agent
CN114807942B (en) * 2022-03-07 2024-02-13 上海富柏化工有限公司 Sodium persulfate microetching additive and application thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020081847A1 (en) * 2000-12-20 2002-06-27 Lg. Philips Lcd Co., Ltd. Etchant and array substrate having copper lines etched by the etchant
US6417147B2 (en) * 2000-02-29 2002-07-09 Showa Denko K.K. Cleaning agent composition, method for cleaning and use thereof
US6579153B2 (en) * 2000-01-12 2003-06-17 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
US20030180377A1 (en) * 2002-02-12 2003-09-25 Ramirez Jose A. Enhanced activity hydrogen peroxide disinfectant

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401509A (en) * 1982-09-07 1983-08-30 Fmc Corporation Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4631117A (en) * 1985-05-06 1986-12-23 Olin Hunt Specialty Products Inc. Electroless plating process
US4684560A (en) * 1985-11-29 1987-08-04 Olin Hunt Specialty Products, Inc. Printed wiring board having carbon black-coated through holes
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4622108A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products, Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4622107A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4718993A (en) * 1987-05-29 1988-01-12 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4874477A (en) * 1989-04-21 1989-10-17 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5110355A (en) * 1990-03-26 1992-05-05 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
US4994153A (en) * 1990-06-28 1991-02-19 Olin Corporation Process for preparing nonconductive substrates
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
US6710259B2 (en) * 1993-05-17 2004-03-23 Electrochemicals, Inc. Printed wiring boards and methods for making them
JP4063475B2 (en) * 1999-11-10 2008-03-19 メック株式会社 Copper or copper alloy etchant
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6579153B2 (en) * 2000-01-12 2003-06-17 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
US6417147B2 (en) * 2000-02-29 2002-07-09 Showa Denko K.K. Cleaning agent composition, method for cleaning and use thereof
US20020081847A1 (en) * 2000-12-20 2002-06-27 Lg. Philips Lcd Co., Ltd. Etchant and array substrate having copper lines etched by the etchant
US20030180377A1 (en) * 2002-02-12 2003-09-25 Ramirez Jose A. Enhanced activity hydrogen peroxide disinfectant

Also Published As

Publication number Publication date
US7063800B2 (en) 2006-06-20
WO2005048663A2 (en) 2005-05-26
TWI254086B (en) 2006-05-01
US20050098538A1 (en) 2005-05-12
TW200516177A (en) 2005-05-16

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