WO2005045885A3 - Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems - Google Patents

Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems Download PDF

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Publication number
WO2005045885A3
WO2005045885A3 PCT/US2004/018892 US2004018892W WO2005045885A3 WO 2005045885 A3 WO2005045885 A3 WO 2005045885A3 US 2004018892 W US2004018892 W US 2004018892W WO 2005045885 A3 WO2005045885 A3 WO 2005045885A3
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WO
WIPO (PCT)
Prior art keywords
stiction
gas
mems
thin film
mechanical
Prior art date
Application number
PCT/US2004/018892
Other languages
French (fr)
Other versions
WO2005045885A2 (en
Inventor
Markus Lutz
Aaron Partridge
Original Assignee
Bosch Gmbh Robert
Markus Lutz
Aaron Partridge
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Markus Lutz, Aaron Partridge filed Critical Bosch Gmbh Robert
Priority to EP04755206A priority Critical patent/EP1683199A4/en
Priority to KR1020067000711A priority patent/KR101055029B1/en
Priority to JP2006537961A priority patent/JP5143426B2/en
Publication of WO2005045885A2 publication Critical patent/WO2005045885A2/en
Publication of WO2005045885A3 publication Critical patent/WO2005045885A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005—Anti-stiction coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic

Abstract

There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film or wafer encapsulated MEMS, and technique of fabricating or manufacturing a thin film or wafer encapsulated MEMS employing the antistiction techniques of the present invention. In one embodiment, after encapsulation of the MEMS, an anti-stiction channel is formed thereby providing 'access' to the chamber containing some or all of the active members or electrodes of the mechanical structures of the MEMS. Thereafter, an anti-stiction fluid (for example, gas or gas-vapor) is introduced into the chamber via the anti-stiction channel. The anti-stiction fluid may deposit on one, some or all of the active members or electrodes of the mechanical structures thereby providing an anti-stiction layer (for example, a monolayer coating or self-assembled monolayer) and/or out-gassing molecules on such members or electrodes. After introduction and/or application of the anti-stiction fluid, the anti-stiction channel may be sealed, capped, plugged and/or closed to define and control the mechanical damping environment within the chamber. In this regard, sealing, capping and/or closing the chamber establishes the environment within the chamber containing and/or housing the mechanical structures. This environment provides the predetermined, desired and/or selected mechanical damping of the mechanical structure as well as suitable hermeticity. The parameters (for example, pressure) of the final encapsulated fluid (for example, a gas or a gas vapor) in which the mechanical structures are to operate may be controlled, selected and/or designed to provide a desired and/or predetermined operating environment.
PCT/US2004/018892 2003-10-31 2004-06-15 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems WO2005045885A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04755206A EP1683199A4 (en) 2003-10-31 2004-06-15 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
KR1020067000711A KR101055029B1 (en) 2003-10-31 2004-06-15 Anti-stick technology for thin film and wafer-bonded encapsulated microelectromechanical systems
JP2006537961A JP5143426B2 (en) 2003-10-31 2004-06-15 Anti-stiction technology for encapsulated micro-electromechanical systems combining thin films and wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/698,258 US6930367B2 (en) 2003-10-31 2003-10-31 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
US10/698,258 2003-10-31

Publications (2)

Publication Number Publication Date
WO2005045885A2 WO2005045885A2 (en) 2005-05-19
WO2005045885A3 true WO2005045885A3 (en) 2007-05-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/018892 WO2005045885A2 (en) 2003-10-31 2004-06-15 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems

Country Status (5)

Country Link
US (3) US6930367B2 (en)
EP (1) EP1683199A4 (en)
JP (1) JP5143426B2 (en)
KR (1) KR101055029B1 (en)
WO (1) WO2005045885A2 (en)

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