WO2005044721A8 - Mems devices with unreleased thin film components - Google Patents

Mems devices with unreleased thin film components

Info

Publication number
WO2005044721A8
WO2005044721A8 PCT/US2004/035820 US2004035820W WO2005044721A8 WO 2005044721 A8 WO2005044721 A8 WO 2005044721A8 US 2004035820 W US2004035820 W US 2004035820W WO 2005044721 A8 WO2005044721 A8 WO 2005044721A8
Authority
WO
WIPO (PCT)
Prior art keywords
unreleased
thin film
mems devices
film components
component
Prior art date
Application number
PCT/US2004/035820
Other languages
French (fr)
Other versions
WO2005044721A1 (en
Inventor
Mark W Miles
Original Assignee
Idc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc filed Critical Idc Llc
Priority to JP2006538251A priority Critical patent/JP2007510554A/en
Publication of WO2005044721A1 publication Critical patent/WO2005044721A1/en
Publication of WO2005044721A8 publication Critical patent/WO2005044721A8/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865Multistep processes for the separation of wafers into individual elements
    • B81C1/00896Temporary protection during separation into individual elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

In one embodiment, the invention provides a MEMS device. The MEMS device comprises a plurality of functional components including at least one movable component; and a sacrificial component to at least reduce movement of the movable component during shipping of the microelectromechanical systems device, wherein the sacrificial component can be removed after shipping.
PCT/US2004/035820 2003-11-03 2004-10-28 Mems devices with unreleased thin film components WO2005044721A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006538251A JP2007510554A (en) 2003-11-03 2004-10-28 MEMS device with unreleased thin film portion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/700,641 US7012726B1 (en) 2003-11-03 2003-11-03 MEMS devices with unreleased thin film components
US10/700,641 2003-11-03

Publications (2)

Publication Number Publication Date
WO2005044721A1 WO2005044721A1 (en) 2005-05-19
WO2005044721A8 true WO2005044721A8 (en) 2005-06-23

Family

ID=34573303

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/035820 WO2005044721A1 (en) 2003-11-03 2004-10-28 Mems devices with unreleased thin film components

Country Status (6)

Country Link
US (1) US7012726B1 (en)
JP (1) JP2007510554A (en)
KR (2) KR20120039735A (en)
CN (1) CN1874957A (en)
TW (1) TWI357984B (en)
WO (1) WO2005044721A1 (en)

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Also Published As

Publication number Publication date
TW200523575A (en) 2005-07-16
KR20060100400A (en) 2006-09-20
WO2005044721A1 (en) 2005-05-19
CN1874957A (en) 2006-12-06
US7012726B1 (en) 2006-03-14
TWI357984B (en) 2012-02-11
JP2007510554A (en) 2007-04-26
KR20120039735A (en) 2012-04-25

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