WO2005044721A1 - Mems devices with unreleased thin film components - Google Patents

Mems devices with unreleased thin film components Download PDF

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Publication number
WO2005044721A1
WO2005044721A1 PCT/US2004/035820 US2004035820W WO2005044721A1 WO 2005044721 A1 WO2005044721 A1 WO 2005044721A1 US 2004035820 W US2004035820 W US 2004035820W WO 2005044721 A1 WO2005044721 A1 WO 2005044721A1
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WO
WIPO (PCT)
Prior art keywords
microelectromechanical systems
systems device
mechanical film
sacrificial
unreleased
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Application number
PCT/US2004/035820
Other languages
French (fr)
Other versions
WO2005044721A8 (en
Inventor
Mark W. Miles
Original Assignee
Idc, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc, Llc filed Critical Idc, Llc
Priority to JP2006538251A priority Critical patent/JP2007510554A/en
Publication of WO2005044721A1 publication Critical patent/WO2005044721A1/en
Publication of WO2005044721A8 publication Critical patent/WO2005044721A8/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Definitions

  • This invention relates generally to fabrication processes for microelectromechanical systems (MEMS) devices and more specifically to the manufacture of interferometric modulators (iMoDs).
  • MEMS microelectromechanical systems
  • iMoDs interferometric modulators
  • An interferometric modulator is a class of MEMS (microelectromechanical) systems devices which have been described and documented in a variety of patents including U.S. Patent Nos. 5,835,255, 5,986,796, 6,040,937, 6,055,090, and U.S. Pending Patent Application Nos. 09/966,843, 09/974,544, 10/082,397, 10/084,893, and 10/078,282, herein incorporated by reference.
  • One process for fabricating MEMS devices falls under the label of "surface micromachining” and comprises a sequence of deposition and etch steps that are repeated until a final step or release step. Such a process can often start with some kind of raw material in the form of films or thin film precursors which are deposited beforehand. These precursors may represent a definable component, which can be manufactured in high volumes in dedicated facilities. A more detailed description of this component is provided in Patent Application No. 10/606,001 herein incorporated by reference.
  • Surface micromachining includes monolithic semiconductor-like fabrication processes. Specifically, surface micromachining comprises a sequence of steps that combine film deposition, photolithography, and etching using a variety of techniques.
  • Precursor films can be used as a starting point for the sequence which eventually results in a MEM!S device with mechanical structures that can move. More detail on these processes is described in Patent Application No. 10/074,562 filed on February 12, 2002 and herein incorporated by reference. [0005] During shipping of the MEMS device, movement of the mechanical structures can occur and may result in damage to the MEMS device.
  • the invention provides a method of making a microelectromechanical systems device.
  • the method comprises fabricating a sacrificial layer and a mechanical film of the microelectromechanical systems device.
  • the method further comprises inhibiting at least some movement of the mechanical film with the sacrificial layer.
  • the method further comprises transporting at least the sacrificial layer and the mechanical film of the microelectromechanical systems device.
  • the invention provides a microelectromechanical systems device.
  • the device comprises at least one unreleased mechanical film.
  • the device further comprises a sacrificial component configured to inhibit at least some movement of the unreleased mechanical film during transport of the microelectromechanical systems device.
  • the unreleased mechanical film is configured to be moveable after removal of the sacrificial component.
  • Figure 1 shows a block diagram for a fully integrated MEMS processing facility as illustrated in the prior art.
  • Figure 2 shows block diagram for a fully integrated MEMS processing facility incorporating precursor film deposition, structure processing, and backend processing.
  • Figure 3 shows a block diagram for a non-integrated MEMS processing facility incorporating structure processing and backend processing.
  • Figure 4 shows a MEMS device which has been fabricated to the point of being ready to release.
  • Figure 5 shows a MEMS device which has been released.
  • a MEMS device including a moveable component is fabricated, and the movement of the moveable component is inhibited using a sacrificial material, so that damage to the moveable component during shipping is at least reduced.
  • the sacrificial material is deposited during fabrication of the MEMS device, and the sacrificial material is removed during a release step after shipping. Removal of the sacrificial material may be by a chemical or related etch process, and results in the freeing of the moveable component.
  • embodiments of the present invention disclose fabricating a MEMS device to the point of release but not beyond, and represent a component that may be readily manufactured in a high-volume dedicated facility. This component may then be conveniently removed to another factory where the release step and subsequent processing and packaging steps can be performed.
  • One advantage of the present invention is that it allows entities that wish to fabricate MEMS devices, or perform post-fabrication operations on the MEMS device after shipping to operate in their respective spaces with the benefit of a low technological barrier- to-entry and reduced capital outlay since integrated facilities that fabricate the MEMS device and also perform the post-fabrication release and processing steps represent a higher technological barrier and require more capital outlay than separate facilities.
  • Other advantages of the present invention will be apparent from the description below.
  • FIG. 1 represents a single factory, 100, which contains two sections of manufacture, 102, which generates the thin film precursor material, and 104, which performs the structure processing that results in a finished MEMS structure or structures.
  • Figure 2 is a more complete representation of the MEMS manufacturing chain.
  • integrated factory 200 includes section 202, for precursor processing, section 204, for structure processing, and section 206, for backend processing.
  • Backend processing generally refers to processes which interface a MEMS component to the outside world which can include device packaging, interconnection to external electronics and interfaces (i.e. drivers and touch screens for displays), interconnection to and integration with peripheral components (such as supplemental lighting for displays) and others. While these processes can be handled within a large integrated factory, they are often performed in dedicated facilities, which perform no other activities. For MEMS components and particularly for displays, this requires that there be a component which can be readily and easily transferred from the facility which defined it, the structure process section in this example, to the facility which will perform the backend process. [0015] Figure 3 illustrates this idea and its benefits conceptually.
  • reference numeral 300 indicates a factory which performs only the structural processing on precursor films which have been supplied to it from another facility.
  • FIG. 4 illustrates one kind of MEMS device, an iMoD, which resides at this point in the processing sequence.
  • reference numeral 400 indicates a substrate upon which optical thin films, 402, have been deposited and patterned.
  • Sacrificial film, 404 has been deposited and patterned and resides above optical films 402, and mechanical film, 406, resides on and is mechanically coupled to sacrificial film 404, and support posts 408.
  • the release step has occurred. Specifically, the sacrificial film has been removed leaving an airgap, 504, in its place. Support posts, 508, remain to mechanically couple the mechanical membrane, 506, to the substrate. However, the mechanical membrane is now free to move according to the function of its design.
  • This release step is the result of a chemical etch process which utilizes an etchant to convert the sacrificial material into a byproduct which can be easily extracted in the form of a gas or a liquid.
  • the device is ready to be packaged and interconnected as part of the backend process, though in some cases some backend processes may occur before release.
  • transferring the MEMS component from one facility to another in the unreleased state is the preferred state for at least several reasons.
  • the MEMS component is also more stable from a mechanical standpoint. Thus, it is more resistant to extremes in environment such as temperature and mechanical shock which may occur during transport.

Abstract

In one embodiment, the invention provides a MEMS device. The MEMS device comprises a plurality of functional components including at least one movable component; and a sacrificial component to at least reduce movement of the movable component during shipping of the microelectromechanical systems device, wherein the sacrificial component can be removed after shipping.

Description

MEMS DEVICES WITH UNRELEASED THIN FILM COMPONENTS
Background of the Invention Field of the Invention [0001] This invention relates generally to fabrication processes for microelectromechanical systems (MEMS) devices and more specifically to the manufacture of interferometric modulators (iMoDs). Background of the Invention [0002] An interferometric modulator is a class of MEMS (microelectromechanical) systems devices which have been described and documented in a variety of patents including U.S. Patent Nos. 5,835,255, 5,986,796, 6,040,937, 6,055,090, and U.S. Pending Patent Application Nos. 09/966,843, 09/974,544, 10/082,397, 10/084,893, and 10/078,282, herein incorporated by reference. [0003] One process for fabricating MEMS devices falls under the label of "surface micromachining" and comprises a sequence of deposition and etch steps that are repeated until a final step or release step. Such a process can often start with some kind of raw material in the form of films or thin film precursors which are deposited beforehand. These precursors may represent a definable component, which can be manufactured in high volumes in dedicated facilities. A more detailed description of this component is provided in Patent Application No. 10/606,001 herein incorporated by reference. [0004] Surface micromachining includes monolithic semiconductor-like fabrication processes. Specifically, surface micromachining comprises a sequence of steps that combine film deposition, photolithography, and etching using a variety of techniques. Precursor films can be used as a starting point for the sequence which eventually results in a MEM!S device with mechanical structures that can move. More detail on these processes is described in Patent Application No. 10/074,562 filed on February 12, 2002 and herein incorporated by reference. [0005] During shipping of the MEMS device, movement of the mechanical structures can occur and may result in damage to the MEMS device.
Summary of the Invention In one embodiment, the invention provides a method of making a microelectromechanical systems device. The method comprises fabricating a sacrificial layer and a mechanical film of the microelectromechanical systems device. The method further comprises inhibiting at least some movement of the mechanical film with the sacrificial layer. The method further comprises transporting at least the sacrificial layer and the mechanical film of the microelectromechanical systems device. In another embodiment, the invention provides a microelectromechanical systems device. The device comprises at least one unreleased mechanical film. The device further comprises a sacrificial component configured to inhibit at least some movement of the unreleased mechanical film during transport of the microelectromechanical systems device. The unreleased mechanical film is configured to be moveable after removal of the sacrificial component.
Brief Description of the Drawings [0006] Figure 1 shows a block diagram for a fully integrated MEMS processing facility as illustrated in the prior art. [0007] Figure 2 shows block diagram for a fully integrated MEMS processing facility incorporating precursor film deposition, structure processing, and backend processing. [0008] Figure 3 shows a block diagram for a non-integrated MEMS processing facility incorporating structure processing and backend processing. [0009] Figure 4 shows a MEMS device which has been fabricated to the point of being ready to release. [0010] Figure 5 shows a MEMS device which has been released.
Detailed Description of the Invention [0011] In the following detailed description of embodiments of the invention, numerous specific details are set forth such as examples of specific materials, machines, and methods in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that these specific details need not be employed to practice the present invention. In other instances, well known materials, machines, or methods have not been described in detail in order to avoid unnecessarily obscuring the present invention. [0012] Broadly, in accordance with one embodiment of the invention, a MEMS device including a moveable component is fabricated, and the movement of the moveable component is inhibited using a sacrificial material, so that damage to the moveable component during shipping is at least reduced. In one embodiment, the sacrificial material is deposited during fabrication of the MEMS device, and the sacrificial material is removed during a release step after shipping. Removal of the sacrificial material may be by a chemical or related etch process, and results in the freeing of the moveable component. Thus, embodiments of the present invention disclose fabricating a MEMS device to the point of release but not beyond, and represent a component that may be readily manufactured in a high-volume dedicated facility. This component may then be conveniently removed to another factory where the release step and subsequent processing and packaging steps can be performed. One advantage of the present invention is that it allows entities that wish to fabricate MEMS devices, or perform post-fabrication operations on the MEMS device after shipping to operate in their respective spaces with the benefit of a low technological barrier- to-entry and reduced capital outlay since integrated facilities that fabricate the MEMS device and also perform the post-fabrication release and processing steps represent a higher technological barrier and require more capital outlay than separate facilities. Other advantages of the present invention will be apparent from the description below. [0013] Patent Application No. 10/606,001 filed on June 24, 2003, describes a collection of deposited thin films, which can be used as precursor materials for the manufacture of iMoDs. Patent Application No.10/074,562 filed on February 12, 2002 and, herein incorporated by reference, describes a prototypical fabrication sequence or structure process for building interferometric modulators, which can utilize the aforementioned precursor materials. Figure 1 represents a single factory, 100, which contains two sections of manufacture, 102, which generates the thin film precursor material, and 104, which performs the structure processing that results in a finished MEMS structure or structures. [0014] Figure 2 is a more complete representation of the MEMS manufacturing chain. In Figure 2, integrated factory 200, includes section 202, for precursor processing, section 204, for structure processing, and section 206, for backend processing. Backend processing generally refers to processes which interface a MEMS component to the outside world which can include device packaging, interconnection to external electronics and interfaces (i.e. drivers and touch screens for displays), interconnection to and integration with peripheral components (such as supplemental lighting for displays) and others. While these processes can be handled within a large integrated factory, they are often performed in dedicated facilities, which perform no other activities. For MEMS components and particularly for displays, this requires that there be a component which can be readily and easily transferred from the facility which defined it, the structure process section in this example, to the facility which will perform the backend process. [0015] Figure 3 illustrates this idea and its benefits conceptually. In Figure 3, reference numeral 300 indicates a factory which performs only the structural processing on precursor films which have been supplied to it from another facility. It should be noted, of course, that if economics or other factors merit it this facility could perform both precursor processing and structural processing. In either case, economies of scale can be achieved by performing the structural processing or structural and precursor processing in a single facility 300. The resulting component can then be supplied to one or more backend processing facilities, 304, for further completion of the finished MEMS product. [0016] For the structures and processes described in the aforementioned applications, a convenient point within the structural process to transfer the work product to backend processing is just before the release step. Figure 4 illustrates one kind of MEMS device, an iMoD, which resides at this point in the processing sequence. Referring to Figure 4, reference numeral 400 indicates a substrate upon which optical thin films, 402, have been deposited and patterned. Sacrificial film, 404, has been deposited and patterned and resides above optical films 402, and mechanical film, 406, resides on and is mechanically coupled to sacrificial film 404, and support posts 408. [0017] In Figure 5, the release step has occurred. Specifically, the sacrificial film has been removed leaving an airgap, 504, in its place. Support posts, 508, remain to mechanically couple the mechanical membrane, 506, to the substrate. However, the mechanical membrane is now free to move according to the function of its design. This release step is the result of a chemical etch process which utilizes an etchant to convert the sacrificial material into a byproduct which can be easily extracted in the form of a gas or a liquid. It is at this point that the device is ready to be packaged and interconnected as part of the backend process, though in some cases some backend processes may occur before release. [0018] Regardless, transferring the MEMS component from one facility to another in the unreleased state is the preferred state for at least several reasons. First, no matter how well crafted the shipping containers are, there is always the possibility that the components to be shipped may be exposed to contaminants or other undesired particles or materials. Maintaining the component in the unreleased state minimizes the risk that such contaminants will be incorporated into the structure, and makes it easier to clean the component when it arrives at the backend facility. The MEMS component is also more stable from a mechanical standpoint. Thus, it is more resistant to extremes in environment such as temperature and mechanical shock which may occur during transport. Additionally, these components are more amenable to storage or stockpiling which might be beneficial under certain manufacturing scenarios or situations. Finally, the process tools required for performing the release step are relatively simple and inexpensive to acquire. Facilities and associated staff may, while expert in the tools and techniques required for backend processing may not be so facile with those that occur upstream in the structural processing section. Making the transfer at the unreleased stage lowers the technology and skill set barriers and speeds the manufacturing learning curves these teams have to deal with in preparing to manufacture iMoDs and other MEMS components. For components in the display arena, which usually involve large substrates with many displays, this component is referred to as a "ready-to-release-plate".

Claims

WHAT IS CLAIMED IS: 1. A method of making a microelectromechanical systems device, comprising: fabricating a sacrificial layer and a mechanical film of the microelectromechanical systems device; inhibiting at least some movement of the mechanical film with the sacrificial layer; and transporting at least the sacrificial layer and the mechanical film of the microelectromechanical systems device.
2. The method of Claim 1 further comprising releasing the mechanical film to form a moveable component.
3. The method of Claim 2 in which releasing comprises removing the sacrificial layer.
4. The method of Claim 3 in which releasing comprises exposing the sacrificial layer to an etchant.
5. The method of Claim 4 in which the etchant is a gas.
6. The method of Claim 1 in which the fabricating comprises depositing the mechanical film over the sacrificial layer.
7. The method of Claim 1 further comprising continuing to fabricate the microelectromechanical systems device.
8. The method of Claim 7 in which continuing to fabricate the microelectromechanical systems device comprises backend processing.
9. The method of Claim 1 in which transporting comprises moving the sacrificial layer and the mechanical film of the microelectromechanical systems device to a backend processing facility.
10. The method of Claim 1 in which the microelectromechanical systems device comprises an interferometric modulator.
11. An interferometric modulator made by the method of Claim 1.
12. A microelectromechanical systems device comprising: at least one unreleased mechanical film; and a sacrificial component configured to inhibit at least some movement of the unreleased mechanical film during transport of the microelectromechanical systems device, wherein the unreleased mechanical film is configured to be moveable after removal of the sacrificial component.
13. The microelectromechanical systems device of Claim 12, wherein the sacrificial component is removed after the microelectromechanical systems device is transported from a first manufacturing facility to a second manufacturing facility.
14. The microelectromechanical systems device of Claim 13 in which the sacrificial film is removable by exposure to an etchant.
15. The microelectromechanical systems device of Claim 14 in which the etchant is a gas.
16. The microelectromechanical systems device of Claim 13 comprising an interferometric modulator.
17. The microelectromechanical systems device of Claim 12, wherein the mechanical film comprises a membrane.
PCT/US2004/035820 2003-11-03 2004-10-28 Mems devices with unreleased thin film components WO2005044721A1 (en)

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US10/700,641 US7012726B1 (en) 2003-11-03 2003-11-03 MEMS devices with unreleased thin film components
US10/700,641 2003-11-03

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JP (1) JP2007510554A (en)
KR (2) KR20120039735A (en)
CN (1) CN1874957A (en)
TW (1) TWI357984B (en)
WO (1) WO2005044721A1 (en)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7764950B2 (en) * 2002-05-24 2010-07-27 Kodiak Networks, Inc. Advanced voice services architecture framework
US7417782B2 (en) * 2005-02-23 2008-08-26 Pixtronix, Incorporated Methods and apparatus for spatial light modulation
TW570896B (en) 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
WO2006014929A1 (en) * 2004-07-29 2006-02-09 Idc, Llc System and method for micro-electromechanical operating of an interferometric modulator
US20060076634A1 (en) 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US20060076631A1 (en) * 2004-09-27 2006-04-13 Lauren Palmateer Method and system for providing MEMS device package with secondary seal
US7259449B2 (en) 2004-09-27 2007-08-21 Idc, Llc Method and system for sealing a substrate
US9229222B2 (en) 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US7616368B2 (en) * 2005-02-23 2009-11-10 Pixtronix, Inc. Light concentrating reflective display methods and apparatus
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US7742016B2 (en) * 2005-02-23 2010-06-22 Pixtronix, Incorporated Display methods and apparatus
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US7755582B2 (en) * 2005-02-23 2010-07-13 Pixtronix, Incorporated Display methods and apparatus
US7304786B2 (en) * 2005-02-23 2007-12-04 Pixtronix, Inc. Methods and apparatus for bi-stable actuation of displays
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US7746529B2 (en) 2005-02-23 2010-06-29 Pixtronix, Inc. MEMS display apparatus
US7675665B2 (en) 2005-02-23 2010-03-09 Pixtronix, Incorporated Methods and apparatus for actuating displays
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
KR20080040715A (en) * 2005-07-22 2008-05-08 콸콤 인코포레이티드 Support structure for mems device and methods therefor
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
US7561334B2 (en) * 2005-12-20 2009-07-14 Qualcomm Mems Technologies, Inc. Method and apparatus for reducing back-glass deflection in an interferometric modulator display device
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7382515B2 (en) * 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7547568B2 (en) * 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
US7450295B2 (en) * 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
EP1979268A2 (en) * 2006-04-13 2008-10-15 Qualcomm Mems Technologies, Inc. Packaging a mems device using a frame
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7876489B2 (en) 2006-06-05 2011-01-25 Pixtronix, Inc. Display apparatus with optical cavities
EP2029473A2 (en) * 2006-06-21 2009-03-04 Qualcomm Incorporated Method for packaging an optical mems device
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
EP2080045A1 (en) 2006-10-20 2009-07-22 Pixtronix Inc. Light guides and backlight systems incorporating light redirectors at varying densities
US7706042B2 (en) * 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
US7852546B2 (en) 2007-10-19 2010-12-14 Pixtronix, Inc. Spacers for maintaining display apparatus alignment
US7733552B2 (en) * 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) * 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7569488B2 (en) * 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
KR20100061731A (en) * 2007-09-14 2010-06-08 퀄컴 엠이엠스 테크놀로지스, 인크. Etching processes used in mems production
US8248560B2 (en) 2008-04-18 2012-08-21 Pixtronix, Inc. Light guides and backlight systems incorporating prismatic structures and light redirectors
US7851239B2 (en) * 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US20100020382A1 (en) * 2008-07-22 2010-01-28 Qualcomm Mems Technologies, Inc. Spacer for mems device
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
US7864403B2 (en) * 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
FI124072B (en) 2009-05-29 2014-03-14 Valtion Teknillinen Micromechanical Fabry-Perot Adjustable Interferometer, Intermediate, and Method of Manufacture
US8379392B2 (en) * 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
CN104916258B (en) 2010-02-02 2018-02-16 追踪有限公司 For controlling the circuit of display device
CN102834763B (en) 2010-02-02 2015-07-22 皮克斯特罗尼克斯公司 Methods for manufacturing cold seal fluid-filled display apparatus
EP2558776B1 (en) 2010-04-16 2022-09-14 Azumo, Inc. Front illumination device comprising a film-based lightguide
CA2796519A1 (en) 2010-04-16 2011-10-20 Flex Lighting Ii, Llc Illumination device comprising a film-based lightguide
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001014248A2 (en) * 1999-08-24 2001-03-01 Knowles Electronics, Llc Assembly process for delicate silicon structures
US20030152872A1 (en) * 2002-02-12 2003-08-14 Miles Mark W. Method for fabricating a structure for a microelectromechanical systems (MEMS) device

Family Cites Families (110)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2534846A (en) 1946-06-20 1950-12-19 Emi Ltd Color filter
DE1288651B (en) 1963-06-28 1969-02-06 Siemens Ag Arrangement of electrical dipoles for wavelengths below 1 mm and method for producing such an arrangement
FR1603131A (en) 1968-07-05 1971-03-22
US3813265A (en) 1970-02-16 1974-05-28 A Marks Electro-optical dipolar material
US3653741A (en) 1970-02-16 1972-04-04 Alvin M Marks Electro-optical dipolar material
DE2336930A1 (en) 1973-07-20 1975-02-06 Battelle Institut E V INFRARED MODULATOR (II.)
US4099854A (en) 1976-10-12 1978-07-11 The Unites States Of America As Represented By The Secretary Of The Navy Optical notch filter utilizing electric dipole resonance absorption
US4389096A (en) 1977-12-27 1983-06-21 Matsushita Electric Industrial Co., Ltd. Image display apparatus of liquid crystal valve projection type
US4445050A (en) 1981-12-15 1984-04-24 Marks Alvin M Device for conversion of light power to electric power
US4663083A (en) 1978-05-26 1987-05-05 Marks Alvin M Electro-optical dipole suspension with reflective-absorptive-transmissive characteristics
US4228437A (en) 1979-06-26 1980-10-14 The United States Of America As Represented By The Secretary Of The Navy Wideband polarization-transforming electromagnetic mirror
NL8001281A (en) 1980-03-04 1981-10-01 Philips Nv DISPLAY DEVICE.
US4377324A (en) 1980-08-04 1983-03-22 Honeywell Inc. Graded index Fabry-Perot optical filter device
US4441791A (en) 1980-09-02 1984-04-10 Texas Instruments Incorporated Deformable mirror light modulator
FR2506026A1 (en) 1981-05-18 1982-11-19 Radant Etudes METHOD AND DEVICE FOR ANALYZING A HYPERFREQUENCY ELECTROMAGNETIC WAVE RADIATION BEAM
NL8103377A (en) 1981-07-16 1983-02-16 Philips Nv DISPLAY DEVICE.
US4571603A (en) 1981-11-03 1986-02-18 Texas Instruments Incorporated Deformable mirror electrostatic printer
NL8200354A (en) 1982-02-01 1983-09-01 Philips Nv PASSIVE DISPLAY.
US4500171A (en) 1982-06-02 1985-02-19 Texas Instruments Incorporated Process for plastic LCD fill hole sealing
US4482213A (en) 1982-11-23 1984-11-13 Texas Instruments Incorporated Perimeter seal reinforcement holes for plastic LCDs
US4566935A (en) 1984-07-31 1986-01-28 Texas Instruments Incorporated Spatial light modulator and method
US4710732A (en) 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US4662746A (en) 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
US4596992A (en) 1984-08-31 1986-06-24 Texas Instruments Incorporated Linear spatial light modulator and printer
US4615595A (en) 1984-10-10 1986-10-07 Texas Instruments Incorporated Frame addressed spatial light modulator
US5172262A (en) 1985-10-30 1992-12-15 Texas Instruments Incorporated Spatial light modulator and method
JPS62190748A (en) * 1986-02-17 1987-08-20 Nissan Motor Co Ltd Assembly method of semiconductor acceleration sensor
GB8610129D0 (en) 1986-04-25 1986-05-29 Secr Defence Electro-optical device
US4748366A (en) 1986-09-02 1988-05-31 Taylor George W Novel uses of piezoelectric materials for creating optical effects
US4786128A (en) 1986-12-02 1988-11-22 Quantum Diagnostics, Ltd. Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction
US4956619A (en) 1988-02-19 1990-09-11 Texas Instruments Incorporated Spatial light modulator
JPH01301180A (en) * 1988-05-30 1989-12-05 Mitsubishi Electric Corp Assembling method for semiconductor acceleration sensor
US4856863A (en) 1988-06-22 1989-08-15 Texas Instruments Incorporated Optical fiber interconnection network including spatial light modulator
US5028939A (en) 1988-08-23 1991-07-02 Texas Instruments Incorporated Spatial light modulator system
US4982184A (en) 1989-01-03 1991-01-01 General Electric Company Electrocrystallochromic display and element
US5272473A (en) 1989-02-27 1993-12-21 Texas Instruments Incorporated Reduced-speckle display system
US5214419A (en) 1989-02-27 1993-05-25 Texas Instruments Incorporated Planarized true three dimensional display
US5079544A (en) 1989-02-27 1992-01-07 Texas Instruments Incorporated Standard independent digitized video system
US5170156A (en) 1989-02-27 1992-12-08 Texas Instruments Incorporated Multi-frequency two dimensional display system
US5162787A (en) 1989-02-27 1992-11-10 Texas Instruments Incorporated Apparatus and method for digitized video system utilizing a moving display surface
US5446479A (en) 1989-02-27 1995-08-29 Texas Instruments Incorporated Multi-dimensional array video processor system
KR100202246B1 (en) 1989-02-27 1999-06-15 윌리엄 비. 켐플러 Apparatus and method for digital video system
US5206629A (en) 1989-02-27 1993-04-27 Texas Instruments Incorporated Spatial light modulator and memory for digitized video display
US5214420A (en) 1989-02-27 1993-05-25 Texas Instruments Incorporated Spatial light modulator projection system with random polarity light
US5192946A (en) 1989-02-27 1993-03-09 Texas Instruments Incorporated Digitized color video display system
US5287096A (en) 1989-02-27 1994-02-15 Texas Instruments Incorporated Variable luminosity display system
DE3925859C2 (en) 1989-08-04 1999-03-11 Stahl R Blasformtechnik Blow molding machine
US5022745A (en) 1989-09-07 1991-06-11 Massachusetts Institute Of Technology Electrostatically deformable single crystal dielectrically coated mirror
US4954789A (en) 1989-09-28 1990-09-04 Texas Instruments Incorporated Spatial light modulator
US5381253A (en) 1991-11-14 1995-01-10 Board Of Regents Of University Of Colorado Chiral smectic liquid crystal optical modulators having variable retardation
US5124834A (en) 1989-11-16 1992-06-23 General Electric Company Transferrable, self-supporting pellicle for elastomer light valve displays and method for making the same
US5037173A (en) 1989-11-22 1991-08-06 Texas Instruments Incorporated Optical interconnection network
US5500635A (en) 1990-02-20 1996-03-19 Mott; Jonathan C. Products incorporating piezoelectric material
CH682523A5 (en) 1990-04-20 1993-09-30 Suisse Electronique Microtech A modulation matrix addressed light.
GB9012099D0 (en) 1990-05-31 1990-07-18 Kodak Ltd Optical article for multicolour imaging
US5216537A (en) 1990-06-29 1993-06-01 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5099353A (en) 1990-06-29 1992-03-24 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5083857A (en) 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
US5018256A (en) 1990-06-29 1991-05-28 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5142405A (en) 1990-06-29 1992-08-25 Texas Instruments Incorporated Bistable dmd addressing circuit and method
EP0467048B1 (en) 1990-06-29 1995-09-20 Texas Instruments Incorporated Field-updated deformable mirror device
US5153771A (en) 1990-07-18 1992-10-06 Northrop Corporation Coherent light modulation and detector
US5192395A (en) 1990-10-12 1993-03-09 Texas Instruments Incorporated Method of making a digital flexure beam accelerometer
US5044736A (en) 1990-11-06 1991-09-03 Motorola, Inc. Configurable optical filter or display
US5331454A (en) 1990-11-13 1994-07-19 Texas Instruments Incorporated Low reset voltage process for DMD
US5233459A (en) 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
CA2063744C (en) 1991-04-01 2002-10-08 Paul M. Urbanus Digital micromirror device architecture and timing for use in a pulse-width modulated display system
US5226099A (en) 1991-04-26 1993-07-06 Texas Instruments Incorporated Digital micromirror shutter device
US5179274A (en) 1991-07-12 1993-01-12 Texas Instruments Incorporated Method for controlling operation of optical systems and devices
US5168406A (en) 1991-07-31 1992-12-01 Texas Instruments Incorporated Color deformable mirror device and method for manufacture
US5254980A (en) 1991-09-06 1993-10-19 Texas Instruments Incorporated DMD display system controller
CA2081753C (en) 1991-11-22 2002-08-06 Jeffrey B. Sampsell Dmd scanner
US5233385A (en) 1991-12-18 1993-08-03 Texas Instruments Incorporated White light enhanced color field sequential projection
US5233456A (en) 1991-12-20 1993-08-03 Texas Instruments Incorporated Resonant mirror and method of manufacture
US5296950A (en) 1992-01-31 1994-03-22 Texas Instruments Incorporated Optical signal free-space conversion board
US5231532A (en) 1992-02-05 1993-07-27 Texas Instruments Incorporated Switchable resonant filter for optical radiation
EP0562424B1 (en) 1992-03-25 1997-05-28 Texas Instruments Incorporated Embedded optical calibration system
US5312513A (en) 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators
WO1993021663A1 (en) 1992-04-08 1993-10-28 Georgia Tech Research Corporation Process for lift-off of thin film materials from a growth substrate
US5311360A (en) 1992-04-28 1994-05-10 The Board Of Trustees Of The Leland Stanford, Junior University Method and apparatus for modulating a light beam
US5327286A (en) 1992-08-31 1994-07-05 Texas Instruments Incorporated Real time optical correlation system
US5325116A (en) 1992-09-18 1994-06-28 Texas Instruments Incorporated Device for writing to and reading from optical storage media
US5461411A (en) 1993-03-29 1995-10-24 Texas Instruments Incorporated Process and architecture for digital micromirror printer
JPH06350105A (en) * 1993-06-07 1994-12-22 Nec Corp Micromachine and its manufacture
US5489952A (en) 1993-07-14 1996-02-06 Texas Instruments Incorporated Method and device for multi-format television
US5365283A (en) 1993-07-19 1994-11-15 Texas Instruments Incorporated Color phase control for projection display using spatial light modulator
JP3537161B2 (en) * 1993-08-27 2004-06-14 オリンパス株式会社 Manufacturing method of three-dimensional structure
US5457493A (en) 1993-09-15 1995-10-10 Texas Instruments Incorporated Digital micro-mirror based image simulation system
JPH0798326A (en) * 1993-09-28 1995-04-11 Mazda Motor Corp Semiconductor sensor and manufacture thereof
US5497197A (en) 1993-11-04 1996-03-05 Texas Instruments Incorporated System and method for packaging data into video processor
US5459602A (en) 1993-10-29 1995-10-17 Texas Instruments Micro-mechanical optical shutter
US5452024A (en) 1993-11-01 1995-09-19 Texas Instruments Incorporated DMD display system
US5448314A (en) 1994-01-07 1995-09-05 Texas Instruments Method and apparatus for sequential color imaging
JP3612723B2 (en) * 1994-01-18 2005-01-19 株式会社デンソー Manufacturing method of semiconductor dynamic quantity sensor
US5500761A (en) 1994-01-27 1996-03-19 At&T Corp. Micromechanical modulator
US5444566A (en) 1994-03-07 1995-08-22 Texas Instruments Incorporated Optimized electronic operation of digital micromirror devices
US5497172A (en) 1994-06-13 1996-03-05 Texas Instruments Incorporated Pulse width modulation for spatial light modulator with split reset addressing
US5454906A (en) 1994-06-21 1995-10-03 Texas Instruments Inc. Method of providing sacrificial spacer for micro-mechanical devices
US5499062A (en) 1994-06-23 1996-03-12 Texas Instruments Incorporated Multiplexed memory timing with block reset and secondary memory
JPH0818069A (en) * 1994-06-28 1996-01-19 Nissan Motor Co Ltd Manufacture of minute device
JPH1096744A (en) * 1996-09-20 1998-04-14 Zexel Corp Manufacture of capacitance type acceleration sensor
JP4111288B2 (en) * 1998-07-09 2008-07-02 Ｔｄｋ株式会社 Wavelength selective photodetector
WO2003007049A1 (en) * 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
JP2002246307A (en) * 2000-12-12 2002-08-30 Canon Inc System and method for exposure
US6756317B2 (en) * 2001-04-23 2004-06-29 Memx, Inc. Method for making a microstructure by surface micromachining
US6600587B2 (en) * 2001-04-23 2003-07-29 Memx, Inc. Surface micromachined optical system with reinforced mirror microstructure
JP4168757B2 (en) * 2002-02-01 2008-10-22 松下電器産業株式会社 filter
JP3558066B2 (en) * 2002-02-19 2004-08-25 ソニー株式会社 MEMS element and its manufacturing method, light modulation element, GLV device and its manufacturing method, and laser display
US6574033B1 (en) * 2002-02-27 2003-06-03 Iridigm Display Corporation Microelectromechanical systems device and method for fabricating same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001014248A2 (en) * 1999-08-24 2001-03-01 Knowles Electronics, Llc Assembly process for delicate silicon structures
US20030152872A1 (en) * 2002-02-12 2003-08-14 Miles Mark W. Method for fabricating a structure for a microelectromechanical systems (MEMS) device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SRIDHARAN B ET AL: "POST-PACKAGING RELEASE A NEW CONCEPT FOR SURFACE- MICROMACHINED DEVICES", TECHNICAL DIGEST, IEEE SOLID-STATE SENSOR & ACTUATOR WORKSHOP, NEW YORK, NY, US, 8 November 1998 (1998-11-08), pages 225 - 228, XP000992464 *

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