WO2005027728A3 - Method for creating trenches in silicon wafers using a router - Google Patents

Method for creating trenches in silicon wafers using a router Download PDF

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Publication number
WO2005027728A3
WO2005027728A3 PCT/US2004/030536 US2004030536W WO2005027728A3 WO 2005027728 A3 WO2005027728 A3 WO 2005027728A3 US 2004030536 W US2004030536 W US 2004030536W WO 2005027728 A3 WO2005027728 A3 WO 2005027728A3
Authority
WO
WIPO (PCT)
Prior art keywords
trenches
router
wafer
bevel
holes
Prior art date
Application number
PCT/US2004/030536
Other languages
French (fr)
Other versions
WO2005027728A2 (en
Inventor
Vadim M Daskal
Joseph F Keenan
James J Hughes
Original Assignee
Becton Dickinson Co
Vadim M Daskal
Joseph F Keenan
James J Hughes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Becton Dickinson Co, Vadim M Daskal, Joseph F Keenan, James J Hughes filed Critical Becton Dickinson Co
Priority to JP2006527066A priority Critical patent/JP2007514457A/en
Priority to EP04784405A priority patent/EP1662970A2/en
Publication of WO2005027728A2 publication Critical patent/WO2005027728A2/en
Publication of WO2005027728A3 publication Critical patent/WO2005027728A3/en

Links

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/32Surgical cutting instruments
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/32Surgical cutting instruments
    • A61B17/3209Incision instruments
    • A61B17/3211Surgical scalpels, knives; Accessories therefor
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00Surgical instruments, devices or methods, e.g. tourniquets
    • A61B2017/00526Methods of manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26BHAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54Razor-blades
    • B26B21/58Razor-blades characterised by the material

Abstract

A method for manufacturing blades for surgical and other uses from either a crystalline or polycrystalline material, preferably in the form of a wafer, comprises mounting the wafer material, drilling through-holes to define the starting locations of the trenches, inserting a spinning router into said holes, and machining trenches into the wafer material. After the trenches are formed, the wafers are placed in an isotropic etchant solution, in which layers of material are removed uniformly, producing single or double bevel blades, with each bevel having one or more facets. Nearly any bevel angle can be machined. The resulting radii of the blade edges is 5-500 nm, the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.
PCT/US2004/030536 2003-09-17 2004-09-17 Method for creating trenches in silicon wafers using a router WO2005027728A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006527066A JP2007514457A (en) 2003-09-17 2004-09-17 System and method for creating straight and non-linear grooves using routers in silicon and other crystalline materials
EP04784405A EP1662970A2 (en) 2003-09-17 2004-09-17 System and method for creating linear and non-linear trenches in silicon and other crystalline materials with a router

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50345803P 2003-09-17 2003-09-17
US60/503,458 2003-09-17

Publications (2)

Publication Number Publication Date
WO2005027728A2 WO2005027728A2 (en) 2005-03-31
WO2005027728A3 true WO2005027728A3 (en) 2009-04-09

Family

ID=34375355

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/030536 WO2005027728A2 (en) 2003-09-17 2004-09-17 Method for creating trenches in silicon wafers using a router

Country Status (4)

Country Link
US (1) US7785485B2 (en)
EP (1) EP1662970A2 (en)
JP (1) JP2007514457A (en)
WO (1) WO2005027728A2 (en)

Cited By (1)

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CN104384721A (en) * 2014-10-21 2015-03-04 廊坊西波尔钻石技术有限公司 Chamfer processing method of PDC (Polycrystalline Diamond Compact)

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JP4918229B2 (en) * 2005-05-31 2012-04-18 信越半導体株式会社 Manufacturing method of bonded wafer
WO2011158617A1 (en) * 2010-06-14 2011-12-22 三菱電機株式会社 Laser processing device and laser processing method
US8647966B2 (en) * 2011-06-09 2014-02-11 National Semiconductor Corporation Method and apparatus for dicing die attach film on a semiconductor wafer
JP2013158799A (en) * 2012-02-06 2013-08-19 Disco Corp Laser processing apparatus and laser processing method
US10869715B2 (en) * 2014-04-29 2020-12-22 Covidien Lp Double bevel blade tip profile for use in cutting of tissue
US20160013363A1 (en) 2014-07-08 2016-01-14 Epistar Corporation Light-emitting element and the manufacturing method thereof
US11230025B2 (en) * 2015-11-13 2022-01-25 The Gillette Company Llc Razor blade
US11654588B2 (en) 2016-08-15 2023-05-23 The Gillette Company Llc Razor blades

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