WO2005022663A1 - Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu - Google Patents
Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu Download PDFInfo
- Publication number
- WO2005022663A1 WO2005022663A1 PCT/DE2004/001816 DE2004001816W WO2005022663A1 WO 2005022663 A1 WO2005022663 A1 WO 2005022663A1 DE 2004001816 W DE2004001816 W DE 2004001816W WO 2005022663 A1 WO2005022663 A1 WO 2005022663A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- electrode
- conductor track
- laser
- organic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
Definitions
- the invention relates to an organic electronic component with high-resolution structuring, in particular an organic field-effect transistor (OFET) with a small source-drain distance, and a manufacturing process suitable for this purpose.
- OFET organic field-effect transistor
- the switching frequency and / or the switching speed of integrated digital circuits is influenced not least by the channel length "1". There has therefore been no lack of attempts to keep this channel length as short as possible, that is to say to create a chip for an organic electronic component with structuring that is as high-resolution as possible.
- Organic electronic components are known, in particular OFETs with high-resolution structuring and a small source-drain distance “l ⁇ . So far, however, these have been produced in complex process steps that are associated with high costs. These process steps are uneconomical and regularly include photolithography, with depressions being produced photolithographically in a lower layer or in the substrate, so that a conductor track with the required capacitance can be formed. These depressions are trough-shaped and have no sharp contours. The bottom of these depressions remains unchanged.
- DE 10061297.0 discloses a high-resolution printing method which can be used on an industrial scale and in which the conductor tracks are introduced into depressions, but this has the disadvantage that the depressions which are produced by pressing on an embossing stamp do not have any steep and sharp wall surfaces have drawn edges, but are more trough-shaped and without sharp contours. As a result of these smooth transitions, the material introduced into the depression not only fills the depression accurately, but blurs around the depression and thus leads to leakage currents. As a result, the smeared material cannot be wiped off without wiping most of the material out of the recess.
- the object of the invention is to create a large-scale and inexpensive to produce electronic component made of predominantly organic material, in particular an OFET with a high-resolution structure and a small source-drain distance.
- the object and object of the invention is to achieve an electronic component made of predominantly organic material, comprising a substrate, at least one conductor track and / or electrode, the at least one conductor track and / or electrode being made of conductive material and applied to a support surface whose surface is modified and / or roughened by laser treatment.
- the invention also relates to an organic electronic component in which at least one conductor track and / or an electrode is arranged in a depression in a lower layer, the depression being produced by means of a laser, that is to say that it has steep walls, sharp contours and has a rough floor surface.
- the invention is a method for producing an organic electronic device, a lower layer and / or the substrate with a laser is sawn in which ⁇ for the production of a conductor track and / or an electrode, so that at least one recess and / or a modified area in a lower layer and / or the Substrate can be found, the recess has steep walls, sharp contours and a rough surface on the floor.
- the distance "1" between two electrodes or between an electrode and a conductor track is less than 20 ⁇ m. This corresponds to a high resolution of the structuring, which is particularly preferably even less than 10 ⁇ m, in particular even less ⁇ . Leakage currents between the conductor tracks and / or electrodes are avoided by the invention and therefore the distance "1" between them can be minimized.
- excess conductive material is mechanically removed in a process step following the application of the material and / or the filling of the depressions with this material, that is to say, for example, wiped off without conductive material from the roughened area and / or from it the recess with the roughened bottom would be removed to a noticeable extent.
- the application of the conductive material and / or the filling of the depressions can be carried out according to various techniques: it can be vapor-deposited, sputtered, sprayed, squeegee, injected, coated, printed or otherwise applied and / or filled in according to the invention.
- the lower layer and / or the substrate is treated with a pulsed laser, for example with pulse lengths of a few 10 ns. A few pulses can be sufficient.
- the modified and / or roughened areas and / or depressions produced by laser structuring is characterized by the fact that the contact surface for the conductive material was treated with laser. This distinguishes modified areas and / or depressions that These are generated by the areas and / or depressions which have not been treated or, for example, by embossing, where in the latter the superfluous conductive material which is distributed around the depression cannot be wiped off without great losses.
- the excess material is simply removed on the areas of the lower layer and / or the substrate which have not been changed by laser, for example mechanically (by Wipe with cloths and / or a rubber roller) and the structuring is complete.
- the work function is not matched to the semiconductor, e.g. a poorly conductive layer can be applied, the excess of which can also be removed using a mechanical method.
- the combination of these two conductive layers as an electrode or as a conductor track now has great conductivity and has the appropriate work function.
- the structuring of the lowermost (lower) conductive layer (layers) can take place immediately after its application, it can also take place simultaneously with the structuring of the upper layers.
- the structuring of the lower layers can also be carried out after the structuring of the upper conductive layers (e.g. an upper already structured layer can serve as an etching resistor).
- conductive material should not be restricted in any way here, since very different types of conductive materials have already been successfully used at this point.
- a metal, an alloy, a metal paste or an organic conductive compound can be evaporated, sputtered on or knife-coated or applied in some other way. The only thing that matters is that the introduced conductive material adheres to the surface roughened by the laser.
- Silver, gold, aluminum, copper etc. and any mixtures or alloys of these components are mentioned as preferred metals, which can be applied in gaseous, liquid, ink or metal paste (metal particles in a liquid medium) and also as a solid.
- Preferred organic materials which can also be combined with a lower conductive layer, for example made of metal, are PANI, PEDOT and carbon black.
- Modified is used here for areas of a lower layer or a substrate that have been changed by laser treatment.
- Pictures A to C show a substrate and / or a lower layer which are treated by a method according to the invention:
- AI, BI and CI show a cleaned substrate or a cleaned lower layer. This is first modified by laser treatment so that an area with a modified and / or roughened surface and / or a recess is created ( Figures A2, B2 and C2). It is also possible that the existing roughness of the surface is removed by the treatment with laser and the modified area is accordingly has a lower roughness than that not modified by laser treatment.
- the roughness of the modified areas is greater than that of the unmodified areas.
- a further conductive layer for example made of organic material or functional polymer, is applied to the still unstructured, highly conductive, for example metallic layer (Y). This can now be removed mechanically (B5). If the highly conductive layer is not mechanically removed (patterned) may be, is selected a different type (eg chemical) method after the 'Process Step B5, to pattern the highly conductive layer.
- the highly conductive layer (x) is covered at the "modified" or roughened areas and cannot be removed here (B5).
- the chemical structuring eg an etching process
- the combination of the highly conductive (for example metallic) and the conductive (for example polymer) layer is present in structured form in (B6).
- a further conductive layer is also applied to C4 and then both conductive layers are mechanically structured (C5).
- the process according to the invention can be used to produce conductive structures which: - consist of several layers (different conductivity) to ensure, for example, the appropriate work function.
- Circuit size can be minimized, which also reduces costs to the same extent.
- the substrate is drawn between several rollers, for example in the roll-to-roll process.
- depressions and / or modified or roughened areas in the substrate or a lower layer are then produced with a laser, for example an excimer laser, through a mask.
- a laser for example an excimer laser
- the excimer laser may be equipped with optical lens systems so that the depressions / areas are not necessarily imaged in the same size as the mask specifies.
- any conductive material that may be present between the depressions / areas is, for example, an absorbent roll in the roll-to-roll Procedure removed.
- the roller rotates more slowly than the other rollers, so that wiping is effective.
- organic material or “functional material” or “(functional) polymer” here encompasses all types of organic, organometallic and / or organic-inorganic plastics (hybrids), in particular those which are described in English e.g. be called “plastics". These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon). A limitation in the dogmatic sense to organic material as carbon-containing material is therefore not provided, but is also due to the widespread use of e.g. Silicones thought. Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but the use of "small molecules” is also entirely possible.
- the word component "polymer” in the functional polymer is historically determined and therefore contains no information about the presence of an actually polymeric compound.
- the invention presents for the first time a method with which an organic electronic component such as an OFET, which can also include metallic components and layers, can be economically manufactured with high switching speed and high reliability. It has been shown that indentations and / or areas which are produced with a laser keep the application of conductive organic material differently than the conventional indentations / structuring and that, therefore, conductor paths of organic and metallic nature can be produced more quickly and better with this method than other methods.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/569,763 US7479670B2 (en) | 2003-08-25 | 2004-08-14 | Organic electronic component with high resolution structuring, and method of the production thereof |
JP2006524214A JP2007503712A (ja) | 2003-08-25 | 2004-08-14 | 高解像度構造を有する有機電子部品及びその生産方法 |
DE502004010430T DE502004010430D1 (de) | 2003-08-25 | 2004-08-14 | Isches bauteil mit hochaufgelöster strukturierung |
AT04762661T ATE450057T1 (de) | 2003-08-25 | 2004-08-14 | Herstellungsverfahren für ein organisches elektronisches bauteil mit hochaufgelöster strukturierung |
EP04762661A EP1658648B1 (de) | 2003-08-25 | 2004-08-14 | Herstellungsverfahren für ein organisches elektronisches bauteil mit hochaufgelöster strukturierung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10339036A DE10339036A1 (de) | 2003-08-25 | 2003-08-25 | Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu |
DE10339036.7 | 2003-08-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005022663A1 true WO2005022663A1 (de) | 2005-03-10 |
WO2005022663A8 WO2005022663A8 (de) | 2005-06-02 |
Family
ID=34223146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2004/001816 WO2005022663A1 (de) | 2003-08-25 | 2004-08-14 | Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu |
Country Status (7)
Country | Link |
---|---|
US (1) | US7479670B2 (de) |
EP (1) | EP1658648B1 (de) |
JP (1) | JP2007503712A (de) |
CN (1) | CN1853289A (de) |
AT (1) | ATE450057T1 (de) |
DE (2) | DE10339036A1 (de) |
WO (1) | WO2005022663A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT17082U1 (de) * | 2020-04-27 | 2021-05-15 | Zkw Group Gmbh | Verfahren zur befestigung eines elektronischen bauteils |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005031448A1 (de) | 2005-07-04 | 2007-01-11 | Polyic Gmbh & Co. Kg | Aktivierbare optische Schicht |
DE102010042503A1 (de) | 2010-10-15 | 2012-04-19 | Siemens Aktiengesellschaft | Lasersystem zur Bearbeitung von Oberflächen sowie entsprechendes Verfahren |
DE102017116540A1 (de) * | 2017-07-21 | 2019-01-24 | Osram Oled Gmbh | Organisches elektronisches Bauelement und Verfahren zur Herstellung eines organischen elektronischen Bauelements |
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- 2004-08-14 EP EP04762661A patent/EP1658648B1/de not_active Not-in-force
- 2004-08-14 US US10/569,763 patent/US7479670B2/en not_active Expired - Fee Related
- 2004-08-14 DE DE502004010430T patent/DE502004010430D1/de active Active
- 2004-08-14 CN CNA2004800265539A patent/CN1853289A/zh active Pending
- 2004-08-14 AT AT04762661T patent/ATE450057T1/de not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
EP1658648B1 (de) | 2009-11-25 |
DE502004010430D1 (de) | 2010-01-07 |
US7479670B2 (en) | 2009-01-20 |
ATE450057T1 (de) | 2009-12-15 |
CN1853289A (zh) | 2006-10-25 |
WO2005022663A8 (de) | 2005-06-02 |
US20070187671A1 (en) | 2007-08-16 |
EP1658648A1 (de) | 2006-05-24 |
DE10339036A1 (de) | 2005-03-31 |
JP2007503712A (ja) | 2007-02-22 |
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