WO2005017952B1 - Darkfield inspection system having a programmable light selection array - Google Patents

Darkfield inspection system having a programmable light selection array

Info

Publication number
WO2005017952B1
WO2005017952B1 PCT/US2004/011127 US2004011127W WO2005017952B1 WO 2005017952 B1 WO2005017952 B1 WO 2005017952B1 US 2004011127 W US2004011127 W US 2004011127W WO 2005017952 B1 WO2005017952 B1 WO 2005017952B1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
array
light
photosensor
tool
Prior art date
Application number
PCT/US2004/011127
Other languages
French (fr)
Other versions
WO2005017952A3 (en
WO2005017952A2 (en
Inventor
Christopher F Bevis
Paul J Sullivan
David W Shortt
George J Kren
Original Assignee
Kla Tencor Tech Corp
Christopher F Bevis
Paul J Sullivan
David W Shortt
George J Kren
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp, Christopher F Bevis, Paul J Sullivan, David W Shortt, George J Kren filed Critical Kla Tencor Tech Corp
Priority to JP2004569998A priority Critical patent/JP4825423B2/en
Publication of WO2005017952A2 publication Critical patent/WO2005017952A2/en
Publication of WO2005017952A3 publication Critical patent/WO2005017952A3/en
Publication of WO2005017952B1 publication Critical patent/WO2005017952B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection

Abstract

An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

Claims

AMENDED CLAIMS [received by the International Bureau on 26 August 2005 (26.08.2005) ; original claims 1-10 and 53-64 cancelled ; claims 11-52 renumbered 1-42 (5 pages)]We claim:
1. A surface inspection apparatus comprising: an illumination source for directing a light beam onto a workpiece to generate scattered light that includes light scattered from defects of the workpiece and light scattered in accordance with the ordinary scattering pattern of the workpiece; a programmable light selection array positioned to receive light scattered from the workpiece and direct the light onto a first photodetector array; the first photodetector array is positioned to receive the light from the programmable light selection array and capable of translating the light into an associated electrical signal; circuitry for receiving the associated electrical signal and determining which portion of the light scattered from the workpiece comprises the ordinary scattering pattern of the workpiece; the programmable light selection array further selectively directs the light scattered from defects of the workpiece onto a photosensor where it is translated into an associated defect signal; and processing circuitry for receiving the defect signal and using it to conduct surface analysis of the workpiece.
2. The tool of Claim 11 wherein the programmable light selection array comprises an array of reflector elements that are selectively enabled to direct the light scattered from the workpiece onto the photosensor.
3. The tool of Claim 12 wherein array of reflector elements comprises an array of MEMS reflector elements.
4. The tool of Claim 12 wherein selected reflector elements of the array of reflector elements are actuated so that light scattered from the defects in the workpiece is selectively directed onto the photosensor and so that the light scattered by the non- defect containing portions of the workpiece is not directed onto the photosensor.
5. The tool of Claim 11 wherein the first photodetector array comprises at least two photodetector arrays and wherein the photosensor comprises at least two photosensors.
6. The tool of Claim 11 wherein the workpiece comprises an un-patterned surface. 30
7. The tool of Claim 16 wherein the un-patterned surface comprises a semiconductor wafer.
8. The tool of Claim 16 wherein the un-patterned surface comprises a semiconductor wafer having at least one un-patterned layer of material formed thereon.
9. The tool of Claim 16 wherein the workpiece comprises a semiconductor wafer having a surface formed by an epitaxial fabrication processes.
10. The tool of Claim 16 wherein the workpiece comprises a semiconductor wafer formed using silicon germanium material.
11. The apparatus of Claim 11 wherein the apparatus comprises a darkfield inspection tool.
12. The apparatus of Clam 11 wherein the photosensor comprises a discrete photosensor element.
13. The apparatus of Clam 22 wherein the photosensor comprises a plurality of discrete photosensor elements.
14. The tool of Claim 22 wherein the programmable light selection array comprises an array of reflector elements that are selectively enabled to direct the light scattered from the workpiece onto the photosensor.
15. The tool of Claim 24 wherein array of reflector elements comprises an array of
MEMS reflector elements.
16. The tool of Claim 24 wherein selected reflector elements of the array of reflector elements are actuated so that light scattered from the defects in the workpiece is selectively directed onto the photosensor and so that the light scattered by the non- defect containing portions of the workpiece is not directed onto the photosensor.
17. The apparatus of Claim 11 wherein the photosensor comprises a second photodetector array.
18. The tool of Claim 27 wherein the programmable light selection array comprises an array of reflector elements that are selectively enabled to direct the light scattered from the workpiece onto the photosensor.
19. The tool of Claim 28 wherein array of reflector elements comprises an array of MEMS reflector elements.
20. The tool of Claim 28 wherein selected reflector elements of the array of 31 reflector elements are actuated so that light scattered from the defects in the workpiece is selectively directed onto the photosensor and so that the light scattered by the non- defect containing portions of the workpiece is not directed onto the photosensor.
21. The apparatus of Clam 11 wherein the first photodetector array also operates as the photosensor.
22. The tool of Claim 11 wherein the programmable light selection array comprises an array of reflector elements that are selectively enabled to direct the light scattered from the workpiece onto the photosensor.
23. The tool of Claim 32 wherein array of reflector elements comprises an array of MEMS reflector elements.
24. The tool of Claim 32 wherein selected reflector elements of the array of reflector elements are actuated so that light scattered from the defects in the workpiece is selectively directed onto the photosensor and so that the light scattered by the non- defect containing portions of the workpiece is not directed onto the photosensor.
25. The tool of Claim 31 wherein the programmable light selection array comprises an array of filter elements that are selectively activated and deactivated to enable the light scattered from the workpiece to pass through the array of filter elements thereby directing the light scattered from the defects of the workpiece onto the photosensor.
26. The tool of Claim 35 wherein array of filter elements comprises an array of LCD filter elements.
27. The tool of Claim 35 wherein array of filter elements comprises an array of selectively activatable polarizer elements that can filter by polarization.
28. An surface inspection apparatus comprising: an illumination source for directing a light beam onto a workpiece; a programmable light selection array positioned to receive light scattered from the workpiece, the programmable light selection array for directing said light onto to a photodetector element and also capable of selectively directing selected portions of the light onto to a photosensor element; the photodetector element being positioned such that it receives light from the programmable light selection array and translates said received light into an associated electrical signal; processing circuitry for receiving and analyzing the associated electrical signal from the first photodetector element and thereby determining an ordinary scattering portion of the of the light scattered from the workpiece that is associated with an ordinary scattering pattern of the workpiece and determining a defect portion of the light scattered from the workpiece that is associated with defects of the workpiece; control circuitry for activating and deactivating light selection elements of the programmable light selection array so that said selected portions of the light comprising the defect portion of the light scattered from the workpiece are selectively directed onto the photosensor element that translates said defect portion into a defect electrical signal; defect analysis circuitry for receiving and analyzing the defect electrical signal from the photosensor element to characterize defects the workpiece.
29. The tool of Claim 38 wherein the workpiece comprises an un-patterned surface.
30. The tool of Claim 39 wherein the un-patterned surface comprises a semiconductor wafer.
31. The tool of Claim 39 wherein the un-patterned surface comprises a semiconductor wafer having at least one un-patterned layer of material formed thereon.
32. The tool of Claim 39 wherein the workpiece comprises a semiconductor wafer having a surface formed by epitaxial fabrication processes.
33. The tool of Claim 39 wherein the workpiece comprises a semiconductor wafer formed using silicon germanium material.
34. The apparatus of Claim 38 wherein the photodetector element operates as the photosensor element.
35. The apparatus of Claim 44 wherein the programmable light selection array comprises a filter array comprising a plurality of filter elements; and wherein the control circuitry selectively activates and deactivates the filter elements such that the defect portion of the light is selectively directed onto the photosensor element and such that the ordinary scattering portion of the light is substantially blocked from the photosensor element.
36. The apparatus of Claim 44 wherein the programmable light selection array comprises a reflector array comprising a plurality of reflector elements; and
33 wherein the control circuitry selectively actuates the reflector elements so that the defect portion of the light is selectively reflected onto the photosensor element and so that ordinary scattering portion of the light scattered from the workpiece is selectively reflected away from the photosensor element such that substantially all of the ordinary scattering portion of the light is not detected by the photosensor element.
37. The apparatus of Claim 38 wherein the photodetector element and the photosensor element are each comprised of different detector elements.
38. The apparatus of Claim 47 wherein the photodetector element comprises a photodetector array comprising a plurality of photo-sensitive detector elements and wherein the photosensor element comprises a single discrete photo-sensitive detector device.
39. The apparatus of Claim 48 wherein the single discrete photo-sensitive detector device that comprises the photosensor elements is selected from among the group of devices consisting of a photo-multiplier tube, a photodiode, and avalanche photodiode.
40. The apparatus of Claim 48 wherein the programmable light selection array comprises a reflector array comprising a plurality of reflector elements; and wherein the control circuitry selectively actuates the reflector elements to selectively direct the defect portion of the light scattered from the workpiece onto the photosensor element.
41. The apparatus of Claim 50 wherein the wherein the control circuitry selectively actuates the reflector elements to selectively direct the ordinary scattering pattern of the light scattered from the workpiece onto the photodetector array.
42. The apparatus of Claim 38 wherein the processing circuitry, the control circuitry, and the defect analysis circuitry are incorporated into a single electronic circuit element.
34
PCT/US2004/011127 2003-07-23 2004-04-09 Darkfield inspection system having a programmable light selection array WO2005017952A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004569998A JP4825423B2 (en) 2003-07-23 2004-04-09 Dark field inspection system with programmable light selection array

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US48962103P 2003-07-23 2003-07-23
US60/489,621 2003-07-23
US10/714,257 US7002677B2 (en) 2003-07-23 2003-11-14 Darkfield inspection system having a programmable light selection array
US10/714,257 2003-11-14

Publications (3)

Publication Number Publication Date
WO2005017952A2 WO2005017952A2 (en) 2005-02-24
WO2005017952A3 WO2005017952A3 (en) 2005-09-09
WO2005017952B1 true WO2005017952B1 (en) 2005-10-27

Family

ID=34083562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011127 WO2005017952A2 (en) 2003-07-23 2004-04-09 Darkfield inspection system having a programmable light selection array

Country Status (3)

Country Link
US (2) US7002677B2 (en)
JP (3) JP4825423B2 (en)
WO (1) WO2005017952A2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6627863B2 (en) * 2000-12-15 2003-09-30 Mitutoyo Corporation System and methods to determine the settings of multiple light sources in a vision system
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection
US7505619B2 (en) * 2002-09-27 2009-03-17 Kla-Tencor Technologies Corporation System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface
DE50307761D1 (en) * 2003-04-03 2007-09-06 Erwin Pristner Device for detecting, determining and documenting damage, in particular deformations on painted surfaces caused by sudden events
JP4536337B2 (en) * 2003-06-10 2010-09-01 株式会社トプコン Surface inspection method and surface inspection apparatus
US7002677B2 (en) * 2003-07-23 2006-02-21 Kla-Tencor Technologies Corporation Darkfield inspection system having a programmable light selection array
US7184138B1 (en) * 2004-03-11 2007-02-27 Kla Tencor Technologies Corporation Spatial filter for sample inspection system
WO2005094390A2 (en) * 2004-03-30 2005-10-13 Phoseon Technology, Inc. Led array having array-based led detectors
TWI302756B (en) 2004-04-19 2008-11-01 Phoseon Technology Inc Imaging semiconductor structures using solid state illumination
US7327304B2 (en) * 2005-03-24 2008-02-05 Agilent Technologies, Inc. System and method for minimizing background noise in a microwave image using a programmable reflector array
WO2007046037A1 (en) * 2005-10-17 2007-04-26 Koninklijke Philips Electronics N.V. Integrated puf
US7651869B2 (en) * 2006-03-14 2010-01-26 Research International, Inc. Optical assay apparatus and methods
US7433033B2 (en) * 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
JP4928862B2 (en) 2006-08-04 2012-05-09 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus
US7664608B2 (en) * 2006-07-14 2010-02-16 Hitachi High-Technologies Corporation Defect inspection method and apparatus
US7535563B1 (en) * 2006-08-15 2009-05-19 Kla-Tencor Technologies Corporation Systems configured to inspect a specimen
JP4755054B2 (en) * 2006-09-01 2011-08-24 株式会社日立ハイテクノロジーズ Surface inspection method and surface inspection apparatus
US8264662B2 (en) * 2007-06-18 2012-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. In-line particle detection for immersion lithography
JP2009014510A (en) * 2007-07-04 2009-01-22 Hitachi High-Technologies Corp Inspection method and inspection apparatus
US7746459B2 (en) * 2007-08-10 2010-06-29 Kla-Tencor Technologies Corp. Systems configured to inspect a wafer
JP5341440B2 (en) 2008-09-10 2013-11-13 株式会社日立ハイテクノロジーズ Inspection device
US7623229B1 (en) 2008-10-07 2009-11-24 Kla-Tencor Corporation Systems and methods for inspecting wafers
JP5867736B2 (en) * 2011-02-04 2016-02-24 株式会社日立製作所 Optical filtering device, defect inspection method and apparatus
WO2012105055A1 (en) 2011-02-04 2012-08-09 株式会社日立製作所 Optical filtering method, device therefor, substrate-defect inspection method, and apparatus therefor
WO2016015987A1 (en) 2014-07-28 2016-02-04 Asml Netherlands B.V. Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method
JP2018065209A (en) * 2016-10-18 2018-04-26 株式会社荏原製作所 Surface-quality measuring device of polishing pad
US20230259037A1 (en) 2020-07-14 2023-08-17 Asml Netherlands B.V. A fluid handling system, method and lithographic apparatus
KR20230107799A (en) 2020-11-25 2023-07-18 에이에스엠엘 네델란즈 비.브이. Fluid handling systems, methods and lithographic apparatus
US20230333480A1 (en) 2020-12-23 2023-10-19 Asml Netherlands B.V. A fluid handling system, method and lithographic apparatus
KR20230169991A (en) 2021-04-15 2023-12-18 에이에스엠엘 네델란즈 비.브이. Fluid handling system, method, and lithography apparatus
WO2022268419A1 (en) 2021-06-25 2022-12-29 Asml Netherlands B.V. An inspection tool, method and lithographic apparatus
WO2024008367A1 (en) 2022-07-07 2024-01-11 Asml Netherlands B.V. A fluid handling system, method and lithographic apparatus
WO2024037801A1 (en) 2022-08-19 2024-02-22 Asml Netherlands B.V. A conditioning system, arrangement and method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682102B2 (en) * 1987-02-27 1994-10-19 三菱電機株式会社 Pattern defect inspection device and pattern defect inspection method
JPH0663982B2 (en) * 1987-12-11 1994-08-22 株式会社日立製作所 Foreign object detection method and apparatus
US5046847A (en) * 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
JP2002310932A (en) * 1991-12-11 2002-10-23 Hitachi Ltd Method and system of monitoring semiconductor device treatment device
US5659390A (en) * 1995-02-09 1997-08-19 Inspex, Inc. Method and apparatus for detecting particles on a surface of a semiconductor wafer having repetitive patterns
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6366352B1 (en) * 1999-06-10 2002-04-02 Applied Materials, Inc. Optical inspection method and apparatus utilizing a variable angle design
JP2002188999A (en) * 2000-12-21 2002-07-05 Hitachi Ltd Detector and method for detecting foreign matter and defect
JP4183492B2 (en) * 2002-11-27 2008-11-19 株式会社日立製作所 Defect inspection apparatus and defect inspection method
US7002677B2 (en) * 2003-07-23 2006-02-21 Kla-Tencor Technologies Corporation Darkfield inspection system having a programmable light selection array

Also Published As

Publication number Publication date
JP5878198B2 (en) 2016-03-08
JP2014132275A (en) 2014-07-17
US7199874B2 (en) 2007-04-03
WO2005017952A3 (en) 2005-09-09
US20060082767A1 (en) 2006-04-20
US20050018179A1 (en) 2005-01-27
US7002677B2 (en) 2006-02-21
JP2008519245A (en) 2008-06-05
JP2011221041A (en) 2011-11-04
JP4825423B2 (en) 2011-11-30
WO2005017952A2 (en) 2005-02-24

Similar Documents

Publication Publication Date Title
WO2005017952B1 (en) Darkfield inspection system having a programmable light selection array
US10254235B2 (en) Defect inspecting method and defect inspecting apparatus
KR102215122B1 (en) In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
KR100710721B1 (en) An apparatus and method for inspecting mark defects and method for manufacturing a photomask
JP5349742B2 (en) Surface inspection method and surface inspection apparatus
JP2002188999A (en) Detector and method for detecting foreign matter and defect
WO2010058680A1 (en) Silicon wafer defect inspection device
WO2012143753A1 (en) Apparatus for illuminating substrates in order to image micro cracks, pinholes and inclusions in monocrystalline and polycrystalline substrates and method therefore
KR20070001301A (en) Method of inspecting defects of a wafer and apparatus for performing the same
JP2002257747A (en) Device for inspecting defect
JP2002267571A (en) Inspection device for optical characteristic
JP2010190740A (en) Substrate inspection device, method, and program
JP3505655B2 (en) Glass container inspection equipment
JP2830430B2 (en) Foreign matter inspection device
JP2010117323A (en) Surface inspection apparatus
JPH06180293A (en) Foreign matter inspection apparatus
KR101777152B1 (en) Apparatus for inspection of defect and inspecting method of defect using it
KR101594224B1 (en) Surface condition insepecting method of planar substrate and surface condition inspecting device of planar substrate using the same
JPH11194097A (en) Foreign material inspection apparatus
JPH05188004A (en) Foreign matter detecting device
JPH04159551A (en) Foreign matter inspecting device
KR20030050746A (en) Apparatus for inspecting backside of semiconductor wafer
KR20190030488A (en) Apparatus for inspecting material property
KR19980039352A (en) Wafer mounting detector for semiconductor manufacturing process
JP2003004663A (en) Surface inspection apparatus

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2004569998

Country of ref document: JP

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
B Later publication of amended claims

Effective date: 20050826

122 Ep: pct application non-entry in european phase