WO2005015611A3 - Device for stabilising thin discs - Google Patents
Device for stabilising thin discs Download PDFInfo
- Publication number
- WO2005015611A3 WO2005015611A3 PCT/EP2004/051399 EP2004051399W WO2005015611A3 WO 2005015611 A3 WO2005015611 A3 WO 2005015611A3 EP 2004051399 W EP2004051399 W EP 2004051399W WO 2005015611 A3 WO2005015611 A3 WO 2005015611A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stabilising
- thin
- thin discs
- discs
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04766154A EP1652228A2 (en) | 2003-08-08 | 2004-07-07 | Device for stabilising thin discs |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10336478 | 2003-08-08 | ||
DE10336478.1 | 2003-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005015611A2 WO2005015611A2 (en) | 2005-02-17 |
WO2005015611A3 true WO2005015611A3 (en) | 2005-07-07 |
Family
ID=34129518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/051399 WO2005015611A2 (en) | 2003-08-08 | 2004-07-07 | Device for stabilising thin discs |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1652228A2 (en) |
WO (1) | WO2005015611A2 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03252153A (en) * | 1990-02-28 | 1991-11-11 | Nitto Denko Corp | Holding member for semiconductor wafer |
JPH10233429A (en) * | 1997-02-19 | 1998-09-02 | Nitto Denko Corp | Device for pasting adhesive tape to substrate |
US6140151A (en) * | 1998-05-22 | 2000-10-31 | Micron Technology, Inc. | Semiconductor wafer processing method |
US20010001078A1 (en) * | 1998-10-01 | 2001-05-10 | Masakazu Nakabayashi | Method of producing semiconductor devices |
US20020104622A1 (en) * | 2001-02-06 | 2002-08-08 | Bhola De | Wafer demount gas distribution tool |
US6541989B1 (en) * | 2000-09-29 | 2003-04-01 | Motorola, Inc. | Testing device for semiconductor components and a method of using the device |
-
2004
- 2004-07-07 WO PCT/EP2004/051399 patent/WO2005015611A2/en active Search and Examination
- 2004-07-07 EP EP04766154A patent/EP1652228A2/en not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03252153A (en) * | 1990-02-28 | 1991-11-11 | Nitto Denko Corp | Holding member for semiconductor wafer |
JPH10233429A (en) * | 1997-02-19 | 1998-09-02 | Nitto Denko Corp | Device for pasting adhesive tape to substrate |
US6140151A (en) * | 1998-05-22 | 2000-10-31 | Micron Technology, Inc. | Semiconductor wafer processing method |
US20010001078A1 (en) * | 1998-10-01 | 2001-05-10 | Masakazu Nakabayashi | Method of producing semiconductor devices |
US6541989B1 (en) * | 2000-09-29 | 2003-04-01 | Motorola, Inc. | Testing device for semiconductor components and a method of using the device |
US20020104622A1 (en) * | 2001-02-06 | 2002-08-08 | Bhola De | Wafer demount gas distribution tool |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 048 (E - 1163) 6 February 1992 (1992-02-06) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) * |
Also Published As
Publication number | Publication date |
---|---|
EP1652228A2 (en) | 2006-05-03 |
WO2005015611A2 (en) | 2005-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2003246348A1 (en) | Method for dividing semiconductor wafer | |
AU2003248339A1 (en) | Method for dividing semiconductor wafer | |
AU2002311863A1 (en) | Silicon fixtures useful for high temperature wafer processing | |
WO2002062527A8 (en) | Abrasive article suitable for modifying a semiconductor wafer | |
AU2003275541A1 (en) | Silicon carbide semiconductor device and its manufacturing method | |
EP1693896B8 (en) | Silicon carbide semiconductor device and its manufacturing method | |
AU2001290171A1 (en) | High pressure processing chamber for semiconductor substrate | |
TW200509391A (en) | A device having multiple silicide types and a method for its fabrication | |
EP1542269A4 (en) | High-resistance silicon wafer and process for producing the same | |
AU2003218285A1 (en) | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements | |
AU2003235902A1 (en) | Semiconductor substrate manufacturing method and semiconductor device manufacturing method, and semiconductor substrate and semiconductor device manufactured by the methods | |
AU2003207287A1 (en) | Nitride semiconductor device having support substrate and its manufacturing method | |
AU2003226168A1 (en) | Fluorochemical treatment for silicon articles | |
AU2003269499A1 (en) | Semiconductor apparatus and fabrication method of the same | |
WO2002074293A3 (en) | Methods for restoring cognitive function following systemic stress | |
WO2004051708A3 (en) | Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer | |
AU2003257717A1 (en) | Nitride semiconductor led and fabrication method thereof | |
AU2002309506A1 (en) | Semiconductor wafer lifting device and methods for implementing the same | |
EP1670044A4 (en) | Production method for silicon epitaxial wafer, and silicon epitaxial wafer | |
SG110190A1 (en) | Method for improving the critical dimension uniformity of patterned features on wafers | |
AU2003202492A1 (en) | Semiconductor wafer protective member and semiconductor wafer grinding method | |
AU2003257718A1 (en) | Nitride semiconductor and fabrication method thereof | |
AU2002334841A1 (en) | High pressure processing chamber for multiple semiconductor substrates | |
AU2003237767A1 (en) | Single wafer fabrication of integrated micro-fluidic system | |
AU2002252637A1 (en) | High pressure processing chamber for semiconductor substrate including flow enhancing features |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2004766154 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2004766154 Country of ref document: EP |
|
DPEN | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101) |