WO2005015611A3 - Device for stabilising thin discs - Google Patents

Device for stabilising thin discs Download PDF

Info

Publication number
WO2005015611A3
WO2005015611A3 PCT/EP2004/051399 EP2004051399W WO2005015611A3 WO 2005015611 A3 WO2005015611 A3 WO 2005015611A3 EP 2004051399 W EP2004051399 W EP 2004051399W WO 2005015611 A3 WO2005015611 A3 WO 2005015611A3
Authority
WO
WIPO (PCT)
Prior art keywords
stabilising
thin
thin discs
discs
wafer
Prior art date
Application number
PCT/EP2004/051399
Other languages
German (de)
French (fr)
Other versions
WO2005015611A2 (en
Inventor
Gerhard Pucher
Martin Matschitsch
Herwig Feichter
Paul Ganitzer
Johann Hallegger
Original Assignee
Infineon Technologies Ag
Gerhard Pucher
Martin Matschitsch
Herwig Feichter
Paul Ganitzer
Johann Hallegger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Gerhard Pucher, Martin Matschitsch, Herwig Feichter, Paul Ganitzer, Johann Hallegger filed Critical Infineon Technologies Ag
Priority to EP04766154A priority Critical patent/EP1652228A2/en
Publication of WO2005015611A2 publication Critical patent/WO2005015611A2/en
Publication of WO2005015611A3 publication Critical patent/WO2005015611A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Abstract

The invention relates to a device for stabilising thin discs, in particular, for thin wafers (1), arranged on the circumference (2) of the thin wafer (1) as a support, the cross-section of which is formed from a profile (4) and the outer contour of which projects, at least slightly, over the thin wafer (1).
PCT/EP2004/051399 2003-08-08 2004-07-07 Device for stabilising thin discs WO2005015611A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04766154A EP1652228A2 (en) 2003-08-08 2004-07-07 Device for stabilising thin discs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10336478 2003-08-08
DE10336478.1 2003-08-08

Publications (2)

Publication Number Publication Date
WO2005015611A2 WO2005015611A2 (en) 2005-02-17
WO2005015611A3 true WO2005015611A3 (en) 2005-07-07

Family

ID=34129518

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/051399 WO2005015611A2 (en) 2003-08-08 2004-07-07 Device for stabilising thin discs

Country Status (2)

Country Link
EP (1) EP1652228A2 (en)
WO (1) WO2005015611A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03252153A (en) * 1990-02-28 1991-11-11 Nitto Denko Corp Holding member for semiconductor wafer
JPH10233429A (en) * 1997-02-19 1998-09-02 Nitto Denko Corp Device for pasting adhesive tape to substrate
US6140151A (en) * 1998-05-22 2000-10-31 Micron Technology, Inc. Semiconductor wafer processing method
US20010001078A1 (en) * 1998-10-01 2001-05-10 Masakazu Nakabayashi Method of producing semiconductor devices
US20020104622A1 (en) * 2001-02-06 2002-08-08 Bhola De Wafer demount gas distribution tool
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03252153A (en) * 1990-02-28 1991-11-11 Nitto Denko Corp Holding member for semiconductor wafer
JPH10233429A (en) * 1997-02-19 1998-09-02 Nitto Denko Corp Device for pasting adhesive tape to substrate
US6140151A (en) * 1998-05-22 2000-10-31 Micron Technology, Inc. Semiconductor wafer processing method
US20010001078A1 (en) * 1998-10-01 2001-05-10 Masakazu Nakabayashi Method of producing semiconductor devices
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device
US20020104622A1 (en) * 2001-02-06 2002-08-08 Bhola De Wafer demount gas distribution tool

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 048 (E - 1163) 6 February 1992 (1992-02-06) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *

Also Published As

Publication number Publication date
EP1652228A2 (en) 2006-05-03
WO2005015611A2 (en) 2005-02-17

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