WO2004110698A3 - Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes - Google Patents
Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes Download PDFInfo
- Publication number
- WO2004110698A3 WO2004110698A3 PCT/US2004/017670 US2004017670W WO2004110698A3 WO 2004110698 A3 WO2004110698 A3 WO 2004110698A3 US 2004017670 W US2004017670 W US 2004017670W WO 2004110698 A3 WO2004110698 A3 WO 2004110698A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- reactor
- workpiece
- agitator
- systems
- methods
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04754300A EP1638732A4 (en) | 2003-06-06 | 2004-06-03 | Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes |
JP2006515180A JP2007527948A (en) | 2003-06-06 | 2004-06-04 | Method and system for processing microfeature workpieces using a flow stirrer and / or multiple electrodes |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47678603P | 2003-06-06 | 2003-06-06 | |
US60/476,786 | 2003-06-06 | ||
US48460403P | 2003-07-01 | 2003-07-01 | |
US48460303P | 2003-07-01 | 2003-07-01 | |
US60/484,604 | 2003-07-01 | ||
US60/484,603 | 2003-07-01 | ||
US10/733,807 US7393439B2 (en) | 2003-06-06 | 2003-12-11 | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US10/734,100 | 2003-12-11 | ||
US10/734,098 | 2003-12-11 | ||
US10/733,807 | 2003-12-11 | ||
US10/734,100 US7390382B2 (en) | 2003-07-01 | 2003-12-11 | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods |
US10/734,098 US7390383B2 (en) | 2003-07-01 | 2003-12-11 | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004110698A2 WO2004110698A2 (en) | 2004-12-23 |
WO2004110698A3 true WO2004110698A3 (en) | 2006-08-24 |
Family
ID=33556803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/017670 WO2004110698A2 (en) | 2003-06-06 | 2004-06-03 | Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1638732A4 (en) |
JP (1) | JP2007527948A (en) |
KR (1) | KR20060024792A (en) |
WO (1) | WO2004110698A2 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6747734B1 (en) | 2000-07-08 | 2004-06-08 | Semitool, Inc. | Apparatus and method for processing a microelectronic workpiece using metrology |
US7390383B2 (en) | 2003-07-01 | 2008-06-24 | Semitool, Inc. | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces |
DE112006003151T5 (en) * | 2005-11-23 | 2008-12-24 | Semitool, Inc., Kalispell | Apparatus and method for moving liquids in wet chemical processes of microstructure workpieces |
US7842173B2 (en) | 2007-01-29 | 2010-11-30 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microfeature wafers |
JP5038024B2 (en) * | 2007-06-06 | 2012-10-03 | 上村工業株式会社 | Work surface treatment system |
US8177944B2 (en) | 2007-12-04 | 2012-05-15 | Ebara Corporation | Plating apparatus and plating method |
JP5184308B2 (en) | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | Plating apparatus and plating method |
FR2966282B1 (en) * | 2010-10-18 | 2013-02-15 | Nexcis | CONTROL OF LAYER I-III-VI STOICHIOMETRY FOR PHOTOVOLTAIC APPLICATIONS FROM IMPROVED ELECTROLYSIS CONDITIONS. |
JP6100049B2 (en) * | 2013-03-25 | 2017-03-22 | 株式会社荏原製作所 | Plating equipment |
KR102194716B1 (en) * | 2014-03-06 | 2020-12-23 | 삼성전기주식회사 | Plating apparatus |
JP6411943B2 (en) * | 2014-05-26 | 2018-10-24 | 株式会社荏原製作所 | Substrate electrolytic treatment apparatus and paddle used for the substrate electrolytic treatment apparatus |
US10227706B2 (en) * | 2015-07-22 | 2019-03-12 | Applied Materials, Inc. | Electroplating apparatus with electrolyte agitation |
US10240248B2 (en) * | 2015-08-18 | 2019-03-26 | Applied Materials, Inc. | Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control |
JP6890528B2 (en) * | 2017-12-15 | 2021-06-18 | 株式会社荏原製作所 | Plating device with wave-dissipating member and wave-dissipating member that can be attached to the paddle |
JP6790016B2 (en) * | 2018-04-10 | 2020-11-25 | 上村工業株式会社 | Surface treatment equipment, surface treatment method and paddle |
GB201905138D0 (en) * | 2019-04-11 | 2019-05-29 | Spts Technologies Ltd | Apparatus and method for processing a substrate |
JP7399365B1 (en) | 2022-12-20 | 2023-12-15 | 株式会社荏原製作所 | Plating equipment and how it works |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652442A (en) * | 1967-12-26 | 1972-03-28 | Ibm | Electroplating cell including means to agitate the electrolyte in laminar flow |
US4749601A (en) * | 1985-04-25 | 1988-06-07 | Hillinger Brad O | Composite structure |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6214193B1 (en) * | 1998-06-10 | 2001-04-10 | Novellus Systems, Inc. | Electroplating process including pre-wetting and rinsing |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6379511B1 (en) * | 1999-09-23 | 2002-04-30 | International Business Machines Corporation | Paddle design for plating bath |
-
2004
- 2004-06-03 WO PCT/US2004/017670 patent/WO2004110698A2/en active Application Filing
- 2004-06-03 KR KR1020057023444A patent/KR20060024792A/en not_active Application Discontinuation
- 2004-06-03 EP EP04754300A patent/EP1638732A4/en not_active Withdrawn
- 2004-06-04 JP JP2006515180A patent/JP2007527948A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3652442A (en) * | 1967-12-26 | 1972-03-28 | Ibm | Electroplating cell including means to agitate the electrolyte in laminar flow |
US4749601A (en) * | 1985-04-25 | 1988-06-07 | Hillinger Brad O | Composite structure |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US6214193B1 (en) * | 1998-06-10 | 2001-04-10 | Novellus Systems, Inc. | Electroplating process including pre-wetting and rinsing |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
Non-Patent Citations (1)
Title |
---|
TACKEN R. A. ET AL.: "Applications of Magnetoelectrolysis", JOURNAL OF APPLIED ELECTROCHEMISTRY, vol. 25, 1995, pages 1 - 5, XP008082905 * |
Also Published As
Publication number | Publication date |
---|---|
KR20060024792A (en) | 2006-03-17 |
JP2007527948A (en) | 2007-10-04 |
EP1638732A2 (en) | 2006-03-29 |
WO2004110698A2 (en) | 2004-12-23 |
EP1638732A4 (en) | 2007-06-06 |
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