WO2004107457A3 - Led inspection lamp, cluster led, and led with stabilizing agents - Google Patents

Led inspection lamp, cluster led, and led with stabilizing agents Download PDF

Info

Publication number
WO2004107457A3
WO2004107457A3 PCT/CA2004/000791 CA2004000791W WO2004107457A3 WO 2004107457 A3 WO2004107457 A3 WO 2004107457A3 CA 2004000791 W CA2004000791 W CA 2004000791W WO 2004107457 A3 WO2004107457 A3 WO 2004107457A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
epoxy
package
cluster
stabilizing agents
Prior art date
Application number
PCT/CA2004/000791
Other languages
French (fr)
Other versions
WO2004107457A2 (en
Inventor
Donald L Klipstein
George E Cranton
Jack Brass
Original Assignee
Brasscorp Ltd
Donald L Klipstein
George E Cranton
Jack Brass
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brasscorp Ltd, Donald L Klipstein, George E Cranton, Jack Brass filed Critical Brasscorp Ltd
Priority to CA002527717A priority Critical patent/CA2527717A1/en
Publication of WO2004107457A2 publication Critical patent/WO2004107457A2/en
Publication of WO2004107457A3 publication Critical patent/WO2004107457A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F21L4/027—Pocket lamps the light sources being a LED
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/006—Refractors for light sources applied to portable lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/08—Electric lighting devices with self-contained electric batteries or cells characterised by means for in situ recharging of the batteries or cells
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/06—Controlling the distribution of the light emitted by adjustment of elements by movement of refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/06—Controlling the distribution of the light emitted by adjustment of elements by movement of refractors
    • F21V14/065—Controlling the distribution of the light emitted by adjustment of elements by movement of refractors in portable lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/30—Combination of light sources of visible and non-visible spectrum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

LED inspection lamps and spot lights have a plurality of LED sources. For some, radiation passing through lenses is superimposed in target area at target distance. The LED sources may be a cluster LED having more than one semiconductor die. The LED package may have a domed forward surface forward of each semiconductor die for optical purposes. The domed surface may be designed to work either with or without additional optics. The LED package may be made of epoxy having additives to resist degradation of the epoxy by ultraviolet or visible violet radiation from the LED sources. The package may be made of a material other than epoxy, such as acrylic or another thermoplastic, or a casting resin. The package may have a first, ultraviolet-resistant material that surrounds the LED chip and that is surrounded by a second material which may be epoxy.
PCT/CA2004/000791 2003-05-30 2004-05-28 Led inspection lamp, cluster led, and led with stabilizing agents WO2004107457A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002527717A CA2527717A1 (en) 2003-05-30 2004-05-28 Led inspection lamp, cluster led, and led with stabilizing agents

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47428203P 2003-05-30 2003-05-30
US60/474,282 2003-05-30

Publications (2)

Publication Number Publication Date
WO2004107457A2 WO2004107457A2 (en) 2004-12-09
WO2004107457A3 true WO2004107457A3 (en) 2005-11-03

Family

ID=33490709

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2004/000791 WO2004107457A2 (en) 2003-05-30 2004-05-28 Led inspection lamp, cluster led, and led with stabilizing agents

Country Status (2)

Country Link
CA (1) CA2527717A1 (en)
WO (1) WO2004107457A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8066402B2 (en) 2006-12-24 2011-11-29 Brasscorp Limited LED lamps including LED work lights
US8388167B2 (en) 2003-07-07 2013-03-05 Brasscorp Limited LED lamps and LED driver circuits for the same
US9297509B2 (en) 2004-03-18 2016-03-29 Brasscorp Limited LED work light

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002351635A1 (en) 2001-12-31 2003-07-30 Brasscorp Limited Led inspection lamp and led spot light
JP2006267768A (en) 2005-03-25 2006-10-05 Fuji Photo Film Co Ltd Photographing device and light projecting module
WO2007028397A2 (en) * 2005-09-09 2007-03-15 Wiseled Aps A torch
EP1870022B1 (en) 2006-06-22 2016-05-11 W & H Dentalwerk Bürmoos GmbH Medical handle with a lighting device and method of manufacturing
CN101408281A (en) * 2008-10-31 2009-04-15 杭州艾欧易迪光能科技有限公司 LED lighting lamp
US8308318B2 (en) 2009-05-01 2012-11-13 Lighting Science Group Corporation Sustainable outdoor lighting system
CN102540721B (en) * 2010-12-23 2015-06-24 比亚迪股份有限公司 Photoresist composition and method for preparing fluorescent layer on surface of light emitting diode (LED)
DE202016005026U1 (en) 2016-08-19 2016-10-14 Sata Gmbh & Co. Kg Daylight hand lamp for testing painted surfaces, in particular as part of paint repair work on motor vehicles
DE102016009956A1 (en) 2016-08-19 2018-02-22 Sata Gmbh & Co. Kg Tempering device and assembly method of a tempering device for heating and / or cooling of gases or gas mixtures, in particular for use in the field of respiratory protection
DE202016005025U1 (en) 2016-08-19 2016-10-14 Sata Gmbh & Co. Kg Daylight hand lamp for testing painted surfaces, in particular as part of paint repair work on motor vehicles
US11181251B1 (en) * 2020-10-19 2021-11-23 Xiamen Leedarson Lighting Co., Ltd Lighting apparatus

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61158606A (en) * 1984-12-28 1986-07-18 株式会社小糸製作所 Lighting apparatus
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
EP0523927A2 (en) * 1991-07-17 1993-01-20 Precision Solar Controls Inc LED lamp including refractive lens element
US5289082A (en) * 1990-09-07 1994-02-22 Kabushiki Kaisha Toshiba LED lamp
WO2002042795A1 (en) * 2000-11-27 2002-05-30 Picciano, Dante, J. Detection lamp equipped with light-emitting diode
GB2373368A (en) * 2001-03-12 2002-09-18 Arima Optoelectronics Corp White light emitting LED devices
WO2002075440A1 (en) * 2001-03-21 2002-09-26 Screen Technology Limited Photoluminescent liquid crystal display
US20030007345A1 (en) * 2001-07-05 2003-01-09 Spectronics Corporation Pen size LED inspection lamp for detecting fluorescent material
EP1285938A1 (en) * 2001-08-23 2003-02-26 General Electric Company Epoxy resin encapsulation compositions
WO2003025458A1 (en) * 2001-09-17 2003-03-27 Gelcore Llc Variable optics spot module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61158606A (en) * 1984-12-28 1986-07-18 株式会社小糸製作所 Lighting apparatus
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US5289082A (en) * 1990-09-07 1994-02-22 Kabushiki Kaisha Toshiba LED lamp
EP0523927A2 (en) * 1991-07-17 1993-01-20 Precision Solar Controls Inc LED lamp including refractive lens element
WO2002042795A1 (en) * 2000-11-27 2002-05-30 Picciano, Dante, J. Detection lamp equipped with light-emitting diode
GB2373368A (en) * 2001-03-12 2002-09-18 Arima Optoelectronics Corp White light emitting LED devices
WO2002075440A1 (en) * 2001-03-21 2002-09-26 Screen Technology Limited Photoluminescent liquid crystal display
US20030007345A1 (en) * 2001-07-05 2003-01-09 Spectronics Corporation Pen size LED inspection lamp for detecting fluorescent material
EP1285938A1 (en) * 2001-08-23 2003-02-26 General Electric Company Epoxy resin encapsulation compositions
WO2003025458A1 (en) * 2001-09-17 2003-03-27 Gelcore Llc Variable optics spot module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8388167B2 (en) 2003-07-07 2013-03-05 Brasscorp Limited LED lamps and LED driver circuits for the same
US9297509B2 (en) 2004-03-18 2016-03-29 Brasscorp Limited LED work light
US8066402B2 (en) 2006-12-24 2011-11-29 Brasscorp Limited LED lamps including LED work lights

Also Published As

Publication number Publication date
CA2527717A1 (en) 2004-12-09
WO2004107457A2 (en) 2004-12-09

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