WO2004099793A3 - Device probing using a matching device - Google Patents

Device probing using a matching device Download PDF

Info

Publication number
WO2004099793A3
WO2004099793A3 PCT/US2004/013136 US2004013136W WO2004099793A3 WO 2004099793 A3 WO2004099793 A3 WO 2004099793A3 US 2004013136 W US2004013136 W US 2004013136W WO 2004099793 A3 WO2004099793 A3 WO 2004099793A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
chip
flip
terminals
printed circuit
Prior art date
Application number
PCT/US2004/013136
Other languages
French (fr)
Other versions
WO2004099793A2 (en
Inventor
Mark L Diorio
Original Assignee
Celerity Res Inc
Mark L Diorio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/428,572 external-priority patent/US6984996B2/en
Application filed by Celerity Res Inc, Mark L Diorio filed Critical Celerity Res Inc
Priority to EP04750841A priority Critical patent/EP1625406A4/en
Priority to JP2006513408A priority patent/JP2006525516A/en
Publication of WO2004099793A2 publication Critical patent/WO2004099793A2/en
Publication of WO2004099793A3 publication Critical patent/WO2004099793A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

A probing system or process for electrical testing of a device also conditions terminals such as solder balls on the device to improve uniformity of the heights of the terminals and improve the reliability of connections to an interconnect substrate in a flip-chip package or to a printed circuit board in a chip-on-board application. The system can employ a probe card that is a printed circuit board, an interconnect substrate substantially such as used in flip-chip packaging of the device, or a semiconductor die similar to the device. The probe card can be replaceable on a test head to allow for quick changes that reduce ATE downtime and accommodate device changes such as a die shrink. Probe tips on the probe card can be the contact pads or bumps that are the normal electrical contact structures of the interconnect substrates or semiconductor dies.
PCT/US2004/013136 2003-05-01 2004-04-27 Device probing using a matching device WO2004099793A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04750841A EP1625406A4 (en) 2003-05-01 2004-04-27 Device probing using a matching device
JP2006513408A JP2006525516A (en) 2003-05-01 2004-04-27 Probing devices that use matching devices

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/428,572 US6984996B2 (en) 2003-05-01 2003-05-01 Wafer probing that conditions devices for flip-chip bonding
US10/428,572 2003-05-01
US10/718,031 2003-11-19
US10/718,031 US7405581B2 (en) 2003-05-01 2003-11-19 Probing system uses a probe device including probe tips on a surface of a semiconductor die

Publications (2)

Publication Number Publication Date
WO2004099793A2 WO2004099793A2 (en) 2004-11-18
WO2004099793A3 true WO2004099793A3 (en) 2005-06-02

Family

ID=33436679

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/013136 WO2004099793A2 (en) 2003-05-01 2004-04-27 Device probing using a matching device

Country Status (4)

Country Link
EP (1) EP1625406A4 (en)
JP (1) JP2006525516A (en)
TW (1) TWI255520B (en)
WO (1) WO2004099793A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048971A (en) * 2005-08-10 2007-02-22 Seiko Epson Corp Method of manufacturing semiconductor device
WO2008119179A1 (en) * 2007-04-03 2008-10-09 Scanimetrics Inc. Testing of electronic circuits using an active probe integrated circuit
US8174793B2 (en) 2010-06-22 2012-05-08 Tdk Corporation Thin film magnetic head and magnetic disk device and electronic component
US9059240B2 (en) 2012-06-05 2015-06-16 International Business Machines Corporation Fixture for shaping a laminate substrate
US9048245B2 (en) 2012-06-05 2015-06-02 International Business Machines Corporation Method for shaping a laminate substrate
KR101922452B1 (en) 2013-02-26 2018-11-28 삼성전자 주식회사 Semiconductor test device and method for fabricating the same
IT201700017037A1 (en) 2017-02-15 2018-08-15 Technoprobe Spa Measurement board for high frequency applications
TWI667484B (en) * 2018-08-03 2019-08-01 矽品精密工業股份有限公司 Testing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055778A (en) * 1989-10-02 1991-10-08 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
US5604446A (en) * 1994-09-09 1997-02-18 Tokyo Electron Limited Probe apparatus
US5804983A (en) * 1993-12-22 1998-09-08 Tokyo Electron Limited Probe apparatus with tilt correction mechanisms
US6426639B2 (en) * 1997-10-06 2002-07-30 Micron Technology, Inc. Method and apparatus for capacitively testing a semiconductor die

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808474A (en) * 1994-11-30 1998-09-15 Lsi Logic Corporation Test socket for testing integrated circuit packages
US5909123A (en) * 1996-11-08 1999-06-01 W. L. Gore & Associates, Inc. Method for performing reliability screening and burn-in of semi-conductor wafers
US6028437A (en) * 1997-05-19 2000-02-22 Si Diamond Technology, Inc. Probe head assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055778A (en) * 1989-10-02 1991-10-08 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
US5804983A (en) * 1993-12-22 1998-09-08 Tokyo Electron Limited Probe apparatus with tilt correction mechanisms
US5604446A (en) * 1994-09-09 1997-02-18 Tokyo Electron Limited Probe apparatus
US6426639B2 (en) * 1997-10-06 2002-07-30 Micron Technology, Inc. Method and apparatus for capacitively testing a semiconductor die

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1625406A4 *

Also Published As

Publication number Publication date
JP2006525516A (en) 2006-11-09
WO2004099793A2 (en) 2004-11-18
TW200425374A (en) 2004-11-16
EP1625406A4 (en) 2006-07-12
TWI255520B (en) 2006-05-21
EP1625406A2 (en) 2006-02-15

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