WO2004097900A2 - Sintered grooved wick with particle web - Google Patents
Sintered grooved wick with particle web Download PDFInfo
- Publication number
- WO2004097900A2 WO2004097900A2 PCT/US2004/012933 US2004012933W WO2004097900A2 WO 2004097900 A2 WO2004097900 A2 WO 2004097900A2 US 2004012933 W US2004012933 W US 2004012933W WO 2004097900 A2 WO2004097900 A2 WO 2004097900A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wick
- heat pipe
- average particle
- grooved
- lands
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Definitions
- the present invention generally relates to the management of thermal energy generated by electronic systems, and more particularly to a heat pipe-related device and method for efficiently and cost effectively routing and controlling the thermal energy generated by various components of an electronic system.
- Heat pipes use successive evaporation and condensation of a working fluid to transport thermal energy from a heat source to a heat sink.
- Heat pipes can transport very large amounts of thermal energy in a vaporized working fluid, because most working fluids have a high heat of vaporization. Further, the thermal energy can be transported over relatively small temperature differences between the heat source and the heat sink.
- Heat pipes generally use capillary forces created by a porous wick to return condensed working fluid from a heat pipe condenser section (where transported thermal energy is given up at the heat sink) to an evaporator section (where the thermal energy to be transported is absorbed from the heat source).
- Heat spreader heat pipes can help improve heat rejection from integrated circuits.
- a heat spreader is a thin substrate that absorbs the thermal energy generated by, e.g., a semiconductor device, and spreads the energy over a large surface of a heat sink.
- Heat pipe wicks for cylindrical heat pipes are typically made by wrapping metal screening of felt metal around a cylindrically shaped mandrel, inserting the mandrel and wrapped wick inside the heat pipe container, and then removing the mandrel. Wicks have also been formed by depositing a metal powder onto the interior surfaces of the heat pipe, whether flat or cylindrical, and then sintering the powder to create a very large number of intersticial capillaries. Typical heat pipe wicks are particularly susceptible to developing hot spots where the liquid condensate being wicked back to the evaporator section boils away and impedes or blocks liquid movement. In many prior art heat pipes, this hot spot effect is substantially minimized by maintaining the average thickness of the wick within relatively close tolerances.
- Powder metal wick structures in prior art heat pipes have several well documented advantages over other heat pipe wick structures.
- One draw back to these wicks is their relatively low effective thermal conductivity compared their base metal, referred to in the art as their "delta-T".
- Traditional sintered powder metal wicks have a thermal conductivity that is typically an order of magnitude less than the base metal from which they are fabricated.
- the first mode occurs at lower heat fluxes, in which heat is conducted through the wick with the working fluid evaporating off of the wick surface.
- the second mode occurs at higher heat fluxes, in which the temperature gradient required to conduct the heat through the relatively low conductivity wick becomes large enough so that the liquid contained in the wick near the heat pipe enclosure wall becomes sufficiently superheated that boiling is initiated within the wick itself.
- vapor bubbles are formed at and near wall/wick interface and subsequently travel through the wick structure to the vapor space of the heat pipe.
- This second mode of heat transfer can be very efficient and results in a lower over all wick delta-T than the first, conduction mode. Unfortunately, the vapor bubbles exiting the wick displace liquid returning to the evaporator area leading to premature dry out of the evaporator portion of the wick.
- a wick structure should be thin enough that the conduction delta- T is sufficiently small to prevent boiling from initiating.
- Thin wicks have not been thought to have sufficient cross-sectional area to transport the large amounts of liquid required to dissipate any significant amount of power.
- the patent of G. Y. Eastman, U.S. Patent No. 4,274,479 concerns a heat pipe capillary wick structure that is fabricated from sintered metal, and formed with longitudinal grooves on its interior surface. The Eastman wick grooves provide longitudinal capillary pumping while the sintered wick provides a high capillary pressure to fill the grooves and assure effective circumferential distribution of the heat transfer liquid.
- Eastman describes grooved structures generally as having "lands” and "grooves or channels".
- the lands are the material between the grooves or channels.
- the sides of the lands define the width of the grooves.
- the land height is also the groove depth.
- Eastman also states that the prior art consists of grooved structures in which the lands are solid material, integral with the easing wall, and the grooves are made by various machining, chemical milling or extrusion processes.
- Eastman suggests that in order to optimize heat pipe performance, his lands and grooves must be sufficient in size to maintain a continuous layer of fluid within a relatively thick band of sintered powder connecting the lands and grooves such that a reservoir of working fluid exists at the bottom of each groove.
- the present invention provides a grooved sintered wick for a heat pipe comprising a plurality of individual particles which together yield an average particle diameter.
- the grooved sintered wick further includes at least two lands that are in fluid communication with one another through a particle layer disposed between at least two lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters.
- vapor bubbles are not formed at a wall/wick interface to subsequently travel through the wick structure to the vapor space of the heat pipe. This mode of heat transfer is very efficient and results in a lower over all wick delta-T.
- a heat pipe comprising an enclosure having an internal surface and a working fluid that is disposed within the enclosure.
- a grooved wick is disposed on at least a portion of the internal surface that includes a plurality of individual particles having an average diameter.
- the grooved wick includes at least two lands that are in fluid communication with one another through a particle layer disposed between the at least two lands that comprises less than about six average particle diameters.
- a method for making a heat pipe wick on an inside surface of a heat pipe container is also presented where a mandrel having a grooved contour is positioned within a portion of a heat pipe container.
- a slurry of metal particles is provided having an average particle diameter and that are suspended in a viscous binder. At least part of the inside surface of the container is then coated with the slurry so that the slurry conforms to the grooved contour of the mandrel and forms a layer of slurry between adjacent grooves that comprises no more than about six average particle diameters.
- the slurry is dried to form a green wick, and then heat treated to yield a final composition of the heat pipe wick.
- FIG. 1 is a perspective view of a heat pipe heat spreader formed in accordance with the present invention
- FIG. 2 is a cross-sectional view of the heat pipe heat spreader shown in Fig. 1 , as taken along lines 2-2 in Fig. 1 ;
- Fig. 3 is a perspective view of a container used to form the heat pipe heat spreader shown in Figs. 1 and 2;
- FIG. 4 is a perspective, broken-way view of a mandrel used to form a grooved wick in accordance with the present invention
- Fig. 5 is an end view of the mandrel shown in Fig. 4;
- Fig. 6 is a broken-way, enlarged view of a portion of the bottom wall of a container shown in Figs. 1 and 2; and
- Fig. 7 is a significantly enlarged view of a portion of the groove-wick disposed at the bottom of the heat pipe heat spreader in Figs. 1 and 2, showing an extremely thin wick structure disposed between individual lands of the wick.
- the present invention comprises a heat pipe heat spreader 2 that is sized and shaped to transfer and spread the thermal energy generated by at least one thermal energy source, e.g., a semiconductor device (not shown), that is thermally engaged with a portion of heat pipe heat spreader 2.
- Heat pipe heat spreader 2 comprises an evaporator section 5, a condenser section 7, and a sintered and grooved wick 9.
- heat pipe heat spreader 2 may be formed as a planar, rectangular structure, it may also be convenient for heat pipe heat spreader 2 to comprise a circular or rectangular tubular structure.
- a vapor chamber is defined between a bottom wall 15 and a top wall (not shown), and extends transversely and longitudinally throughout heat pipe heat spreader 2.
- Posts 18 may be included to maintain structural integrity.
- bottom wall 15 and a top wall comprise substantially uniform thickness sheets of a thermally conductive material, e.g., copper, steel, aluminum, or any of their respective alloys, and are spaced-apart by about 2.0 (mm) to about 4.0 (mm) so as to form the void space within heat pipe heat spreader 2 that defines a vapor chamber.
- the top wall of heat pipe heat spreader 2 is often substantially planar, and is complementary in shape to bottom wall 15.
- evaporator section 5 will be associated with bottom wall 15 and condenser section 7 will be associated with those portions of heat pipe heat spreader 2 that do not comprise a grooved wick, e.g. a top wall or side walls.
- Bottom wall 15 preferably comprises a substantially planer outer surface
- a vapor chamber is created within heat pipe heat spreader 2 by the attachment of bottom wall 15 and a top wall, along their common edges which are then hermetically sealed at their joining interface 40.
- a two-phase vaporizable liquid e.g., water, ammonia or freon not shown
- Heat pipe heat spreader 2 is completed by drawing a partial vacuum within the vapor chamber after injecting the working fluid just prior to final hermetic sealing of the common edges of bottom wall 15 and the top wall.
- heat pipe heat spreader 2 may be made of copper or copper silicon carbide with water, ammonia, or freon generally chosen as the two- phase vaporizable liquid.
- each land 42 is formed as an inverted, substantially "V"-shaped or pyramidal protrusion having sloped side walls 44a, 44b, and is spaced-apart from adjacent lands.
- Grooves 37 separate lands 42 and are arranged in substantially parallel, longitudinally (or transversely) oriented rows that extend at least through evaporator section 5. The terminal portions of grooves 37, adjacent to peripheral edge wall 23, may be unbounded by further porous structures.
- a relatively thin layer of sintered powder 30 is deposited upon inner surface 22 of bottom wall 15 so as to form a groove-wick 45 at the bottom of each groove 37 and between spaced- apart lands 42.
- Sintered powder 30 may be selected from any of the materials having high thermal conductivity and that are suitable for fabrication into porous structures, e.g., carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, beryllium oxide, or the like, and may comprise either substantially spherical, arbitrary or regular polygonal, or filament-shaped particles of varying cross-sectional shape.
- groove-wick 45 comprises an average thickness of about one to six average copper particle diameters (approximately .005 millimeters to .5 millimeters, preferably, • in the range from about .05 millimeters to about .25 millimeters) when deposited over substantially all of inner surface 22 of bottom wall 15, and between sloped side walls 44a, 44b of lands 42.
- other wick materials such as, aluminum-silicon- carbide or copper-silicon-carbide may be used with similar effect.
- groove-wick 45 is formed so as to be thin enough that the conduction delta-T is small enough to prevent boiling from initiating at the interface between inner surface 22 of bottom wall 15 and the sintered powder forming the wick.
- Groove-wick 45 is an extremely thin wick structure that is fed by spaced lands 42 which provide the required cross-sectional area to maintain effective working fluid flow.
- groove-wick 45 comprises an optimum design when it comprises the largest possible (limited by capillary limitations) flat area between lands 42. This area should have a thickness of, e.g., only one to six copper powder particles.
- the thinner groove-wick 45 is, the better performance within realistic fabrication constraints, as long as the surface area of inner surface 22 has at least one layer of copper particles.
- This thin wick area takes advantage of the enhanced evaporative surface area of the groove-wick layer, by limiting the thickness of groove-wick 45 to no more than a few powder particles. This structure has been found to circumvent the thermal conduction limitations associated with the prior art.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04750725A EP1620691A4 (en) | 2003-04-24 | 2004-04-26 | Sintered grooved wick with particle web |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/422,878 | 2003-04-24 | ||
US10/422,878 US6945317B2 (en) | 2003-04-24 | 2003-04-24 | Sintered grooved wick with particle web |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004097900A2 true WO2004097900A2 (en) | 2004-11-11 |
WO2004097900A3 WO2004097900A3 (en) | 2005-05-26 |
Family
ID=33298985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/012933 WO2004097900A2 (en) | 2003-04-24 | 2004-04-26 | Sintered grooved wick with particle web |
Country Status (4)
Country | Link |
---|---|
US (2) | US6945317B2 (en) |
EP (1) | EP1620691A4 (en) |
CN (1) | CN1798949A (en) |
WO (1) | WO2004097900A2 (en) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6994152B2 (en) * | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
US7983042B2 (en) * | 2004-06-15 | 2011-07-19 | Raytheon Company | Thermal management system and method for thin membrane type antennas |
US7002247B2 (en) * | 2004-06-18 | 2006-02-21 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
US7713849B2 (en) * | 2004-08-20 | 2010-05-11 | Illuminex Corporation | Metallic nanowire arrays and methods for making and using same |
KR100564638B1 (en) * | 2004-11-02 | 2006-03-29 | 삼성전자주식회사 | Flexible heat pipe |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
US7149086B2 (en) * | 2004-12-10 | 2006-12-12 | Intel Corporation | Systems to cool multiple electrical components |
US7246655B2 (en) * | 2004-12-17 | 2007-07-24 | Fujikura Ltd. | Heat transfer device |
US20080236795A1 (en) * | 2007-03-26 | 2008-10-02 | Seung Mun You | Low-profile heat-spreading liquid chamber using boiling |
US7457126B2 (en) * | 2005-06-27 | 2008-11-25 | Intel Corporation | Optical transponder with active heat transfer |
TWI317414B (en) * | 2005-10-21 | 2009-11-21 | Foxconn Tech Co Ltd | Sintered heat pipe and method for manufacturing the same |
NL1031206C2 (en) * | 2006-02-22 | 2007-08-24 | Thales Nederland Bv | Flat heat pipe for cooling purposes. |
US20080029249A1 (en) * | 2006-08-01 | 2008-02-07 | Inventec Corporation | Supporting column having porous structure |
US8482921B2 (en) | 2006-10-23 | 2013-07-09 | Teledyne Scientific & Imaging, Llc. | Heat spreader with high heat flux and high thermal conductivity |
JP2008269353A (en) * | 2007-04-20 | 2008-11-06 | Toshiba Corp | Electronic equipment |
US8356410B2 (en) * | 2007-06-13 | 2013-01-22 | The Boeing Company | Heat pipe dissipating system and method |
US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
US20090211095A1 (en) * | 2008-02-21 | 2009-08-27 | Wen-Chun Zheng | Microgrooves as Wick Structures in Heat Pipes and Method for Fabricating the Same |
KR100952422B1 (en) * | 2008-06-11 | 2010-04-14 | 한국전자통신연구원 | The heat transfer device with functions of power generation |
US20100078151A1 (en) * | 2008-09-30 | 2010-04-01 | Osram Sylvania Inc. | Ceramic heat pipe with porous ceramic wick |
JP2010121867A (en) * | 2008-11-20 | 2010-06-03 | Sony Corp | Heat transport device, electronic equipment and method of manufacturing the heat transport device |
TWI414740B (en) * | 2008-12-12 | 2013-11-11 | Foxconn Tech Co Ltd | Plate-type heat pipe and a method for manufacturing the same |
US20100175856A1 (en) * | 2009-01-12 | 2010-07-15 | Meyer Iv George Anthony | Vapor chamber with wick structure of different thickness and die for forming the same |
TW201038900A (en) * | 2009-04-21 | 2010-11-01 | Yeh Chiang Technology Corp | Sintered heat pipe |
US8208259B1 (en) * | 2009-05-08 | 2012-06-26 | Augmentix Corporation | System, apparatus and method for cooling electronic components |
CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Uniform-temperature panel and manufacturing method thereof |
WO2011006101A2 (en) * | 2009-07-10 | 2011-01-13 | Coolsilicon Llc | Devices and methods providing for intra-die cooling structure reservoirs |
CN101988811B (en) * | 2009-08-05 | 2013-07-03 | 富准精密工业(深圳)有限公司 | Flat plate heat pipe and manufacturing method thereof |
TW201113494A (en) * | 2009-10-08 | 2011-04-16 | Ying-Tung Chen | Heat dissipation structure and manufacturing method thereof |
CN102042778B (en) * | 2009-10-22 | 2013-06-05 | 富准精密工业(深圳)有限公司 | Flat plate type heat tube |
US20110108020A1 (en) * | 2009-11-11 | 2011-05-12 | Mcenerney Bryan William | Ballast member for reducing active volume of a vessel |
TW201124068A (en) * | 2009-12-29 | 2011-07-01 | Ying-Tong Chen | Heat dissipating unit having antioxidant nano-film and its method of depositing antioxidant nano-film. |
US8811014B2 (en) * | 2011-12-29 | 2014-08-19 | General Electric Company | Heat exchange assembly and methods of assembling same |
US9146059B2 (en) * | 2012-05-16 | 2015-09-29 | The United States Of America, As Represented By The Secretary Of The Navy | Temperature actuated capillary valve for loop heat pipe system |
KR101888910B1 (en) * | 2012-08-03 | 2018-08-20 | 삼성전자주식회사 | Display apparatus |
DE102012016442A1 (en) * | 2012-08-18 | 2014-02-20 | Audi Ag | heat exchangers |
CN102878845A (en) * | 2012-09-18 | 2013-01-16 | 华南理工大学 | Inner groove porous strengthened boiling micro-channel structure, manufacture method and application |
KR20150028701A (en) * | 2013-09-05 | 2015-03-16 | (주) 씨쓰리 | Heat exchanger apparatus and method of producing the same |
CN203934263U (en) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | There is the heat abstractor of capillary member |
US20180320984A1 (en) * | 2017-05-08 | 2018-11-08 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
US11397057B2 (en) * | 2014-09-26 | 2022-07-26 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
US9952000B1 (en) | 2015-04-15 | 2018-04-24 | Advanced Cooling Technologies, Inc. | Constant conductance heat pipe assembly for high heat flux |
US10215500B2 (en) | 2015-05-22 | 2019-02-26 | Micron Technology, Inc. | Semiconductor device assembly with vapor chamber |
US10502498B2 (en) * | 2015-07-20 | 2019-12-10 | Delta Electronics, Inc. | Slim vapor chamber |
US10663231B2 (en) * | 2016-06-08 | 2020-05-26 | Delta Electronics, Inc. | Manufacturing method of heat conducting device |
US10782014B2 (en) | 2016-11-11 | 2020-09-22 | Habib Technologies LLC | Plasmonic energy conversion device for vapor generation |
WO2018198372A1 (en) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | Vapor chamber |
FR3083036A1 (en) * | 2018-06-21 | 2019-12-27 | Valeo Systemes Thermiques | COOLING DEVICE OF AN ELECTRIC MOTOR FOR A MOTOR VEHICLE |
US10849217B2 (en) * | 2018-07-02 | 2020-11-24 | Aptiv Technologies Limited | Electrical-circuit assembly with heat-sink |
KR102641742B1 (en) * | 2018-09-20 | 2024-02-29 | 삼성전자주식회사 | Heat dissipation device formed of non-metallic material and electronic device including the same |
CN111414056A (en) * | 2019-01-08 | 2020-07-14 | 达纳加拿大公司 | Ultra-thin two-phase heat exchanger with structured wicking |
US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
US11324143B2 (en) | 2019-12-30 | 2022-05-03 | GM Cruise Holdings, LLC | Embedded and immersed heat pipes in automated driving system computers |
US11324144B2 (en) * | 2019-12-30 | 2022-05-03 | GM Cruise Holdings, LLC | Embedded and immersed vapor chambers in automated driving system computers |
JP2021131214A (en) * | 2020-02-21 | 2021-09-09 | 日本電産株式会社 | Heat conducting member and manufacturing method therefor |
US20210364238A1 (en) * | 2020-05-21 | 2021-11-25 | Acer Incorporated | Vapor chamber structure |
US20210389055A1 (en) * | 2020-06-15 | 2021-12-16 | Asia Vital Components Co., Ltd. | Compound wick structure of vapor chamber |
US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
AT524235B1 (en) * | 2020-10-09 | 2022-04-15 | Miba Sinter Austria Gmbh | heat transport device |
Family Cites Families (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3635103A (en) * | 1968-12-24 | 1972-01-18 | Siai Marchetti Spa | Planetary reduction gearing |
US3613778A (en) | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3537514A (en) | 1969-03-12 | 1970-11-03 | Teledyne Inc | Heat pipe for low thermal conductivity working fluids |
US3681843A (en) | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
US3675711A (en) | 1970-04-08 | 1972-07-11 | Singer Co | Thermal shield |
US3598180A (en) * | 1970-07-06 | 1971-08-10 | Robert David Moore Jr | Heat transfer surface structure |
US3788388A (en) | 1971-02-19 | 1974-01-29 | Q Dot Corp | Heat exchange system |
US3786388A (en) * | 1971-05-27 | 1974-01-15 | K Sato | Fuse-type circuit breaker |
DE2502138C3 (en) | 1975-01-21 | 1978-10-12 | Rowenta-Werke Gmbh, 6050 Offenbach | Gas lighter burner |
GB1484831A (en) | 1975-03-17 | 1977-09-08 | Hughes Aircraft Co | Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components |
US4046190A (en) | 1975-05-22 | 1977-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flat-plate heat pipe |
US4042346A (en) * | 1975-12-24 | 1977-08-16 | Norton Company | Diamond or cubic boron nitride grinding wheel with resin core |
FR2371633A1 (en) | 1976-11-19 | 1978-06-16 | Dupont S T | LIQUEFIED GAS APPLIANCE, ESPECIALLY GAS LIGHTER FOR SMOKERS |
US4231423A (en) | 1977-12-09 | 1980-11-04 | Grumman Aerospace Corporation | Heat pipe panel and method of fabrication |
US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
DE2854298C3 (en) | 1978-12-15 | 1981-06-04 | Anschuetz & Co Gmbh, 2300 Kiel | Lubricant circuit for the bearing of a rotating shaft |
US4327752A (en) | 1979-12-05 | 1982-05-04 | Braun, Aktiengesellschaft | Rotary ignition system for a catalytically heated curling device |
DE3072058D1 (en) | 1980-09-30 | 1988-01-21 | Braun Ag | Hair curling apparatus |
US4366526A (en) | 1980-10-03 | 1982-12-28 | Grumman Aerospace Corporation | Heat-pipe cooled electronic circuit card |
US4382448A (en) | 1981-07-10 | 1983-05-10 | Braun Aktiengesellschaft | Electrical ignition system for a catalytically heated curling device |
US4641404A (en) | 1981-10-05 | 1987-02-10 | Seydel Scott O | Porous warp sizing apparatus |
US4489777A (en) | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4503483A (en) | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
US5148440A (en) | 1983-11-25 | 1992-09-15 | The United States Of America As Represented By The United States Department Of Energy | Wick for metal vapor laser |
US4616699A (en) | 1984-01-05 | 1986-10-14 | Mcdonnell Douglas Corporation | Wick-fin heat pipe |
US4557413A (en) | 1984-04-11 | 1985-12-10 | Mcdonnell Douglas | Heat pipe fabrication |
US4819716A (en) * | 1984-08-06 | 1989-04-11 | Beachboard Stephen A | Advanced zone damper system |
US4777561A (en) | 1985-03-26 | 1988-10-11 | Hughes Aircraft Company | Electronic module with self-activated heat pipe |
US4865729A (en) | 1985-11-04 | 1989-09-12 | Sepragen Corporation | Radial thin layer chromatography |
FR2595052B1 (en) | 1986-03-03 | 1990-06-01 | Armines | METHOD AND DEVICE FOR RAPID VAPORIZATION OF A LIQUID |
US4697205A (en) | 1986-03-13 | 1987-09-29 | Thermacore, Inc. | Heat pipe |
US4765396A (en) | 1986-12-16 | 1988-08-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polymeric heat pipe wick |
US4960202A (en) | 1987-01-14 | 1990-10-02 | Ingersoll-Rand Company | Friction control for bearing surface of roller |
US4819719A (en) | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
US4912548A (en) | 1987-01-28 | 1990-03-27 | National Semiconductor Corporation | Use of a heat pipe integrated with the IC package for improving thermal performance |
DE3862511D1 (en) | 1987-04-28 | 1991-05-29 | Sig Schweiz Industrieges | SEALING JAW FOR PACKING MACHINES. |
JPH063354B2 (en) | 1987-06-23 | 1994-01-12 | アクトロニクス株式会社 | Loop type thin tube heat pipe |
US4830097A (en) | 1987-07-15 | 1989-05-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Space vehicle thermal rejection system |
US4807697A (en) | 1988-02-18 | 1989-02-28 | Thermacore, Inc. | External artery heat pipe |
US4929414A (en) | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
US4885129A (en) | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
USH971H (en) | 1988-10-24 | 1991-10-01 | The United States Of America As Represented By The Secretary Of The Air Force | Regidized porous material and method |
US5101560A (en) | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US4982274A (en) | 1988-12-14 | 1991-01-01 | The Furukawa Electric Co., Ltd. | Heat pipe type cooling apparatus for semiconductor |
US4931905A (en) | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
US4883116A (en) | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
US4880052A (en) | 1989-02-27 | 1989-11-14 | Thermacore, Inc. | Heat pipe cooling plate |
US5059496A (en) | 1989-03-23 | 1991-10-22 | Globe-Union Inc. | Nickel-hydrogen battery with oxygen and electrolyte management features |
US5242644A (en) | 1990-02-20 | 1993-09-07 | The Procter & Gamble Company | Process for making capillary channel structures and extrusion die for use therein |
DK0516730T4 (en) | 1990-02-20 | 2001-01-08 | Procter & Gamble | Open capillary canal structures, improved method of making capillary canal structures, and extrusion mold for use |
US5160252A (en) | 1990-06-07 | 1992-11-03 | Edwards Thomas C | Rotary vane machines with anti-friction positive bi-axial vane motion controls |
US5711816A (en) | 1990-07-06 | 1998-01-27 | Advanced Technolgy Materials, Inc. | Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same |
US5219020A (en) | 1990-11-22 | 1993-06-15 | Actronics Kabushiki Kaisha | Structure of micro-heat pipe |
US5076352A (en) | 1991-02-08 | 1991-12-31 | Thermacore, Inc. | High permeability heat pipe wick structure |
US5333470A (en) | 1991-05-09 | 1994-08-02 | Heat Pipe Technology, Inc. | Booster heat pipe for air-conditioning systems |
US5103897A (en) | 1991-06-05 | 1992-04-14 | Martin Marietta Corporation | Flowrate controller for hybrid capillary/mechanical two-phase thermal loops |
EP0529837B1 (en) | 1991-08-26 | 1996-05-29 | Sun Microsystems, Inc. | Method and apparatus for cooling multi-chip modules using integral heatpipe technology |
JPH0563385A (en) | 1991-08-30 | 1993-03-12 | Hitachi Ltd | Electronic apparatus and computer provided with heat pipe |
US5253702A (en) | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
US5349237A (en) | 1992-03-20 | 1994-09-20 | Vlsi Technology, Inc. | Integrated circuit package including a heat pipe |
JPH0629683A (en) | 1992-03-31 | 1994-02-04 | Furukawa Electric Co Ltd:The | Heat pipe type heat dissipation unit for electronic apparatus |
US5283715A (en) | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5408128A (en) | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
US5522455A (en) | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
US5549394A (en) | 1994-11-10 | 1996-08-27 | Hycomp, Inc. | Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein |
JP3164518B2 (en) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | Flat heat pipe |
US5769154A (en) | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US6056044A (en) | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
US5642776A (en) * | 1996-02-27 | 1997-07-01 | Thermacore, Inc. | Electrically insulated envelope heat pipe |
JP2806357B2 (en) | 1996-04-18 | 1998-09-30 | 日本電気株式会社 | Stack module |
US6041211A (en) | 1996-06-06 | 2000-03-21 | W. L. Gore & Associates, Inc. | Cleaning assembly for critical image surfaces in printer devices and method of using same |
US6167948B1 (en) | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
DE19805930A1 (en) | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Cooling arrangement for electrical component with heat convection line |
US5826645A (en) | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US5880524A (en) | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
US5847925A (en) | 1997-08-12 | 1998-12-08 | Compaq Computer Corporation | System and method for transferring heat between movable portions of a computer |
US5950710A (en) | 1997-11-21 | 1999-09-14 | Continocean Tech Inc. | Overheat regulating system for vehicle passenger compartment |
US6303081B1 (en) | 1998-03-30 | 2001-10-16 | Orasure Technologies, Inc. | Device for collection and assay of oral fluids |
US6055157A (en) | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
US6148906A (en) | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6227287B1 (en) | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
TW493058B (en) | 1998-07-02 | 2002-07-01 | Showa Denko Kk | The remains of non condensing gas in heat pipe, the detecting method of non-remains, and the manufacturing method of pipes |
US6239350B1 (en) | 1998-09-28 | 2001-05-29 | Advanced Modular Power Systems | Internal self heat piping AMTEC cell |
JP2000124374A (en) | 1998-10-21 | 2000-04-28 | Furukawa Electric Co Ltd:The | Plate type heat pipe and cooling structure using the same |
US6154364A (en) | 1998-11-19 | 2000-11-28 | Delco Electronics Corp. | Circuit board assembly with IC device mounted thereto |
US6169852B1 (en) | 1999-04-20 | 2001-01-02 | The Hong Kong University Of Science & Technology | Rapid vapor generator |
US6302192B1 (en) | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6293333B1 (en) | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6418017B1 (en) | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6382309B1 (en) | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
US6651735B2 (en) * | 2001-05-15 | 2003-11-25 | Samsung Electronics Co., Ltd. | Evaporator of CPL cooling apparatus having fine wick structure |
US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6388882B1 (en) | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
US20030136550A1 (en) * | 2002-01-24 | 2003-07-24 | Global Win Technology | Heat sink adapted for dissipating heat from a semiconductor device |
-
2003
- 2003-04-24 US US10/422,878 patent/US6945317B2/en not_active Expired - Lifetime
-
2004
- 2004-04-26 EP EP04750725A patent/EP1620691A4/en not_active Withdrawn
- 2004-04-26 CN CN200480015179.2A patent/CN1798949A/en active Pending
- 2004-04-26 WO PCT/US2004/012933 patent/WO2004097900A2/en active Application Filing
-
2005
- 2005-05-13 US US11/128,454 patent/US7013958B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
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See references of EP1620691A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP1620691A4 (en) | 2007-12-26 |
US20040211549A1 (en) | 2004-10-28 |
US7013958B2 (en) | 2006-03-21 |
US20050236143A1 (en) | 2005-10-27 |
US6945317B2 (en) | 2005-09-20 |
WO2004097900A3 (en) | 2005-05-26 |
CN1798949A (en) | 2006-07-05 |
EP1620691A2 (en) | 2006-02-01 |
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