WO2004096491A3 - Apparatus and method of securing a workpiece during high-pressure processing - Google Patents

Apparatus and method of securing a workpiece during high-pressure processing Download PDF

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Publication number
WO2004096491A3
WO2004096491A3 PCT/US2004/013132 US2004013132W WO2004096491A3 WO 2004096491 A3 WO2004096491 A3 WO 2004096491A3 US 2004013132 W US2004013132 W US 2004013132W WO 2004096491 A3 WO2004096491 A3 WO 2004096491A3
Authority
WO
WIPO (PCT)
Prior art keywords
securing
pressure processing
during high
workpiece during
elements
Prior art date
Application number
PCT/US2004/013132
Other languages
French (fr)
Other versions
WO2004096491A2 (en
Inventor
Kenji Yokomizo
Original Assignee
Supercritical Systems Inc
Kenji Yokomizo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Supercritical Systems Inc, Kenji Yokomizo filed Critical Supercritical Systems Inc
Publication of WO2004096491A2 publication Critical patent/WO2004096491A2/en
Publication of WO2004096491A3 publication Critical patent/WO2004096491A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

An apparatus for performing high-pressure processing of a workpiece (130) having a top face and a bottom face. The apparatus comprises a processing chamber (101) defined by an upper segment having an upper plate (101A) with top elements (125A-C) and a lower segment with lower plate (101B) and lower elements (120A-C), the upper elements and lower elements defining a workpiece holder (129) for securing the workpiece within the processing chamber (101) so that a substantial portion of the top face and the bottom face is exposed to a processing material introduced into the processing chamber (101).
PCT/US2004/013132 2003-04-28 2004-04-27 Apparatus and method of securing a workpiece during high-pressure processing WO2004096491A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/425,701 2003-04-28
US10/425,701 US7270137B2 (en) 2003-04-28 2003-04-28 Apparatus and method of securing a workpiece during high-pressure processing

Publications (2)

Publication Number Publication Date
WO2004096491A2 WO2004096491A2 (en) 2004-11-11
WO2004096491A3 true WO2004096491A3 (en) 2006-07-06

Family

ID=33299526

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/013132 WO2004096491A2 (en) 2003-04-28 2004-04-27 Apparatus and method of securing a workpiece during high-pressure processing

Country Status (3)

Country Link
US (1) US7270137B2 (en)
TW (1) TWI243077B (en)
WO (1) WO2004096491A2 (en)

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US7513262B2 (en) * 2002-09-30 2009-04-07 Lam Research Corporation Substrate meniscus interface and methods for operation
KR100829923B1 (en) * 2006-08-30 2008-05-16 세메스 주식회사 Spin head and method using the same for treating substrate
US9484229B2 (en) 2011-11-14 2016-11-01 Lam Research Ag Device and method for processing wafer-shaped articles
KR102358561B1 (en) * 2017-06-08 2022-02-04 삼성전자주식회사 Substrate processing apparatus and apparatus for manufacturing integrated circuit device

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Also Published As

Publication number Publication date
US20040211447A1 (en) 2004-10-28
US7270137B2 (en) 2007-09-18
WO2004096491A2 (en) 2004-11-11
TWI243077B (en) 2005-11-11
TW200503851A (en) 2005-02-01

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