WO2004095897A2 - Electrical contact - Google Patents
Electrical contact Download PDFInfo
- Publication number
- WO2004095897A2 WO2004095897A2 PCT/US2004/000751 US2004000751W WO2004095897A2 WO 2004095897 A2 WO2004095897 A2 WO 2004095897A2 US 2004000751 W US2004000751 W US 2004000751W WO 2004095897 A2 WO2004095897 A2 WO 2004095897A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical contact
- wires
- annealed
- mesh
- unitary
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/3025—Electromagnetic shielding
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/543,480 US20060141832A1 (en) | 2003-03-24 | 2004-01-14 | Electrical contact |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45707603P | 2003-03-24 | 2003-03-24 | |
US60/457,076 | 2003-03-24 | ||
US45725803P | 2003-03-25 | 2003-03-25 | |
US60/457,258 | 2003-03-25 | ||
US46214303P | 2003-04-08 | 2003-04-08 | |
US60/462,143 | 2003-04-08 | ||
US10/736,280 | 2003-12-15 | ||
US10/736,280 US7040902B2 (en) | 2003-03-24 | 2003-12-15 | Electrical contact |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004095897A2 true WO2004095897A2 (en) | 2004-11-04 |
WO2004095897A3 WO2004095897A3 (en) | 2005-08-11 |
Family
ID=32996388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/000751 WO2004095897A2 (en) | 2003-03-24 | 2004-01-14 | Electrical contact |
Country Status (2)
Country | Link |
---|---|
US (7) | US7040902B2 (en) |
WO (1) | WO2004095897A2 (en) |
Families Citing this family (98)
Publication number | Priority date | Publication date | Assignee | Title |
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US7297003B2 (en) * | 2003-07-16 | 2007-11-20 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
JP2006194620A (en) * | 2005-01-11 | 2006-07-27 | Tokyo Electron Ltd | Probe card and contact structure for inspection |
US7790987B2 (en) * | 2005-04-27 | 2010-09-07 | Sony Computer Entertainment Inc. | Methods and apparatus for interconnecting a ball grid array to a printed circuit board |
WO2007008654A2 (en) * | 2005-07-13 | 2007-01-18 | Amphenol Corporation | Formed cylindrical lga contact |
US7168958B1 (en) * | 2005-08-25 | 2007-01-30 | International Business Machines Corporation | Wadded-wire LGA contact with parallel solid conductor |
JP2007115771A (en) * | 2005-10-18 | 2007-05-10 | Nec System Technologies Ltd | Lsi pin |
US7402051B1 (en) * | 2005-11-10 | 2008-07-22 | Antares Advanced Test Technologies, Inc. | Interconnect assembly for testing integrated circuit packages |
US7331795B2 (en) * | 2006-01-13 | 2008-02-19 | Raytheon Company | Spring probe-compliant pin connector |
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DE102006013927B4 (en) * | 2006-03-21 | 2008-11-20 | Siemens Ag | Connecting element for an electrical shielding arrangement |
US7358603B2 (en) * | 2006-08-10 | 2008-04-15 | Che-Yu Li & Company, Llc | High density electronic packages |
US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
US7914351B2 (en) * | 2007-04-13 | 2011-03-29 | Bal Seal Engineering | Electrical connectors with improved electrical contact performance |
US7384271B1 (en) * | 2007-06-14 | 2008-06-10 | Itt Manufacturing Enterprises, Inc. | Compressive cloverleaf contactor |
CN201112693Y (en) * | 2007-10-12 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | Electric connector terminal |
US8093970B2 (en) * | 2007-10-12 | 2012-01-10 | Montara Technologies LLC | Braided electrical contact element based relay |
MY151561A (en) * | 2007-12-06 | 2014-06-13 | Test Tooling Solutions M Sdn Bhd | Eco contactor |
KR101460839B1 (en) * | 2008-01-17 | 2014-11-11 | 암페놀 코포레이션 | Interposer assembly and method |
US7614907B2 (en) * | 2008-02-12 | 2009-11-10 | Chaojiong Zhang | Contact terminal with self-adjusting contact surface |
WO2010014688A2 (en) * | 2008-07-30 | 2010-02-04 | Bal Seal Engineering | Canted coil multi-metallic wire |
KR101106506B1 (en) * | 2008-08-07 | 2012-01-20 | 박상량 | Plate folding coil spring, pogo pin using plate folding coil spring and the manufacturing methods thereof |
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Also Published As
Publication number | Publication date |
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US20050164534A1 (en) | 2005-07-28 |
US20060141815A1 (en) | 2006-06-29 |
US20040192080A1 (en) | 2004-09-30 |
US20060189176A1 (en) | 2006-08-24 |
US20060211276A1 (en) | 2006-09-21 |
WO2004095897A3 (en) | 2005-08-11 |
US20050191906A1 (en) | 2005-09-01 |
US7040902B2 (en) | 2006-05-09 |
US20060141832A1 (en) | 2006-06-29 |
US7029289B2 (en) | 2006-04-18 |
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