WO2004095696A3 - Temperature compensation for silicon mems resonator - Google Patents
Temperature compensation for silicon mems resonator Download PDFInfo
- Publication number
- WO2004095696A3 WO2004095696A3 PCT/US2004/009881 US2004009881W WO2004095696A3 WO 2004095696 A3 WO2004095696 A3 WO 2004095696A3 US 2004009881 W US2004009881 W US 2004009881W WO 2004095696 A3 WO2004095696 A3 WO 2004095696A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature compensation
- mems resonator
- silicon mems
- compressive
- tensile strain
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000002131 composite material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02433—Means for compensation or elimination of undesired effects
- H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02393—Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor
- H03H9/02417—Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor involving adjustment of the transducing gap
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2457—Clamped-free beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0118—Cantilevers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02511—Vertical, i.e. perpendicular to the substrate plane
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20040759781 EP1618658B1 (en) | 2003-04-16 | 2004-03-30 | Temperature compensation for silicon mems resonator |
CN2004800090144A CN1768475B (en) | 2003-04-16 | 2004-03-30 | MEMS resonator and its manufacture method |
ES04759781.0T ES2538154T3 (en) | 2003-04-16 | 2004-03-30 | Temperature compensation for silicon MEMS resonator |
JP2006509524A JP4589920B2 (en) | 2003-04-16 | 2004-03-30 | Temperature compensation for silicon MEMS resonators |
CA2513976A CA2513976C (en) | 2003-04-16 | 2004-03-30 | Temperature compensation for silicon mems resonator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/414,793 US6987432B2 (en) | 2003-04-16 | 2003-04-16 | Temperature compensation for silicon MEMS resonator |
US10/414,793 | 2003-04-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004095696A2 WO2004095696A2 (en) | 2004-11-04 |
WO2004095696A3 true WO2004095696A3 (en) | 2005-07-07 |
Family
ID=33158772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/009881 WO2004095696A2 (en) | 2003-04-16 | 2004-03-30 | Temperature compensation for silicon mems resonator |
Country Status (8)
Country | Link |
---|---|
US (4) | US6987432B2 (en) |
EP (1) | EP1618658B1 (en) |
JP (1) | JP4589920B2 (en) |
KR (1) | KR100943777B1 (en) |
CN (1) | CN1768475B (en) |
CA (2) | CA2805322C (en) |
ES (1) | ES2538154T3 (en) |
WO (1) | WO2004095696A2 (en) |
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US7202761B2 (en) | 2007-04-10 |
ES2538154T3 (en) | 2015-06-17 |
EP1618658A2 (en) | 2006-01-25 |
CN1768475B (en) | 2011-11-16 |
KR100943777B1 (en) | 2010-02-23 |
EP1618658B1 (en) | 2015-05-13 |
EP1618658A4 (en) | 2008-04-23 |
US7071793B2 (en) | 2006-07-04 |
CA2805322C (en) | 2015-05-19 |
US20070188269A1 (en) | 2007-08-16 |
CN1768475A (en) | 2006-05-03 |
CA2805322A1 (en) | 2004-11-04 |
CA2513976A1 (en) | 2004-11-04 |
US7362197B2 (en) | 2008-04-22 |
US20060186971A1 (en) | 2006-08-24 |
CA2513976C (en) | 2013-04-16 |
JP4589920B2 (en) | 2010-12-01 |
US6987432B2 (en) | 2006-01-17 |
WO2004095696A2 (en) | 2004-11-04 |
US20040207489A1 (en) | 2004-10-21 |
KR20050120748A (en) | 2005-12-23 |
JP2006524020A (en) | 2006-10-19 |
US20050162239A1 (en) | 2005-07-28 |
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