WO2004092672A2 - Amorphous carbon layer for heat exchangers - Google Patents
Amorphous carbon layer for heat exchangers Download PDFInfo
- Publication number
- WO2004092672A2 WO2004092672A2 PCT/US2004/010619 US2004010619W WO2004092672A2 WO 2004092672 A2 WO2004092672 A2 WO 2004092672A2 US 2004010619 W US2004010619 W US 2004010619W WO 2004092672 A2 WO2004092672 A2 WO 2004092672A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- amorphous carbon
- substrate
- carbon layer
- layer
- heat exchanger
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
Definitions
- the present invention relates generally to surface heat sinks (heat exchangers) having a plurality of fins that effectively increases the surface area thereby enhancing the heat transfer to the air.
- the heat dissipated by convection from the fins on heat exchanger is strongly limited by the thermal barrier of any oxide layer formed on the surface of the fins.
- the roughness of the surface of the fins be increased and/or increase the number of fins or length of the fins thereby enhancing the heat transfer of the air by turbulating the air.
- One problem with turbulating the air is that the pressure drop increase greatly outweighs the increase in heat transfer due to the laws of physics, and hence the limiting factor is fan power and noise under forced convection applications . Under natural convection applications turbulating the airflow may cause the airflow to stall .
- DLC thin amorphous carbon layer
- the sole drawing is a schema of a plasma enhanced chemical vapour deposition system (PECVD) for use in applying a DLC coating on substrates.
- PECVD plasma enhanced chemical vapour deposition system
- the invention in one aspect, relates to a heat exchanger comprising a heat sink having a portion of its surface a thin layer of an amorphous carbon having a hardness of at least 2000 Kg/mm 2 , a specific resistivity of at least 10 8 ohm cm, and a dielectric strength of at least 10 6 N/cm.
- the thin amorphous carbon layer has properties approaching those of diamonds such as a hardness between about 2000 to 9000 Kg/mm 2 , a specific resistivity between 10 8 to 10 13 ohm cm, and dielectric strength more than 10 6 V/cm.
- Another preferable property of DLC is a low friction of 0.02 in vacuum and less than 0.1 in air.
- the thickness of the DLC layer is preferably in the range of 1 to 5 ⁇ m.
- the DLC layer can be homogeneously deposited and adhere well to metals and semiconductors which form stable carbides. Virtually there is no adhesion on gold, copper, iron but intermediate layers (nickel or some other or material) can be used to solve the problem.
- DLC coatings adheres also on ceramic, glass, poly-carbonate, polyamides (nylon) and on all materials forming carbides (i.e. plastic) that can withstand 150 2 C.
- Preferably DLC coating can have a roughness, as coated, of 0.05 ⁇ m Ra . Basically roughness is the copy of that of the base material coated. Prior to coating, parts should be cleaned either ultrasonically or by immersion cleaning.
- the heat exchanger having extending fins, such as aluminum, copper, or steel with the more preferable being aluminum, and such fins having a DLC film deposited thereon.
- the best way to practice the invention is to remove the oxide layer on the fins and then apply the DLC coating on the surface of the fins .
- any cooled extended surface heat exchanger that uses aluminum fins can be used for car radiators/air conditioning condensers, truck radiators, aircraft heat exchangers, etc. Since most of these types of heat exchanger use turbulators on the fins, a DLC film on the fins may replace the turbulators. This would have an effect of reducing noise as the increase in air pressure drop due to the DLC film being effectively zero. Heat sinks that rely on conduction only of heat to the aluminum fins, i.e.
- the novel amorphous carbon (DLC) layer or coating is an PECVD coating and has the following properties;
- DLC generally adheres well to metals and semiconductors which form stable carbides. Metals including aluminum, titanium and molybdenum have been successfully coated as have the semiconductors, silicon and germanium. There is virtually no adhesion to copper, gold or other metal which do not form carbides, but intermediate layers may be introduced, such as aluminum, zinc, silicon, germanium and other materials that form carbides. Good adhering DLC films have also been deposited on silica, various glasses, titanium nitride and alumina. The bonding strengths of DLC to various plastics are similar to those of films chemically bonded by carbide formation. However, adhesion to plastic must be due to a different mechanism.
- Thicker DLC films may have adhesion problem because of the high compressive stress of about 10 9 Pa.
- films thicker than 2 ⁇ m on germanium may cause spalling problems while films on aluminum have a 50 ⁇ m thickness or larger without any problems because of the plastic flow in the substrate.
- DLC coating is a hard material and has a high cohesive energy, short bond length and a high degree of covalent bonding. DLC hardness is comparable to the conventional PVD and CVD typical materials such as TiN, SiC and Boron Carbide. Hardness can be up to 9000 Kg/mm 2 or higher.
- Coefficient of sliding friction of DLC against a steel ball is in the range of 0.005 - 0.02 under vacuum condition rising to 0.2 under 100% humidity. Dry nitrogen atmosphere is better in friction than dry oxygen. DLC coatings normally shows a high resistance to wear.
- the typical properties of the DLC layer are hardness, low friction, generally chemical inertness, hydrophobic and the amorphous structure contribute to amplify the wear resistance of a hard material.
- DLC is an insulator having a specific resistivity between 10 7 and 10 13 ohm cm. The value decrease when temperature increase. DLC has a high dielectric strength that is generally in the range of more than 10 V/cm.
- DLC coatings can be used on heat sinks but this use is limited to enhancement of solid/ solid heat transfer, that is, transfer between the base of the heat sink and en electronic component.
- the oxide layer of an aluminum fin can be replaced with a highly thermally conductive layer (DLC) so as to reduce the overall resistance to heat transfer, that is the aluminum fins (sheets) will be able to give up heat to the air more effectively.
- DLC highly thermally conductive layer
- Textile reeds, shuttles, healds, needles for mechanical looms, thread guides (ceramic, chromium plated, steel) to improve friction, and for chromium replacement in all the textile operations;
- Chemical small pump pistons, rings, gear pumps parts, bearings '
- Plastic and glass moulding dies
- Automotive clutch pistons, clutch rings, parts for chromium replacement
- Valves ball valves for dry lubrication on soft seated valves ;
- the invention also relates to a process for depositing a thin amorphous carbon layer onto a substrate wherein said layer having a hardness of at least 2000 Kg/mm 2 , a specific resistivity of at least 10 8 ohm cm, and a dielectric strength of at least 10° V/cm; comprising the steps of preparing a plasma vapour deposition chamber; pumping into the chamber a carbon containing gas at a pressure range between about 10 ⁇ 2 and 10 "5 mbar (preferably between 10 "3 and 10 ⁇ 4 mbar) ; supplying a voltage (RF) of at least 1 kV to self sustain a glow discharge as the gas is ignited; depositing an amorphous carbon from the gas onto a substrate in the chamber and removing the coated substrate from the chamber.
- RF voltage
- the sole drawing is coating system for DLC coatings.
- the coating system for DLC thin layer deposition is a Plasma Enhanced Chemical Vapour Deposition (PECVD) that involve the dissociation of hydrocarbon gases (or extremely volatile hydrocarbon solvent) .
- the drawing shows a general schema of the PECVD.
- the system is composed by a vacuum chamber 2 with its vacuum pumping system 4, a multiple gas manifold 6 and a RF power generator 8.
- a gas is introduced in the preferred pressure range 10 "3 - 10 "4 mbar and a RF voltage of one to several thousands is applied, a self sustained glow discharge is ignited. With a DC supply, the smaller electrode is normally connected to the negative terminal 10.
- a dark space forms, across which there is the main potential drop, the plasma assuming a potential close to that of the anode.
- the negative electrode is therefor bombarded with high energy ions.
- a DC supply generally cannot be used if an insulating layer forms on the cathode (as in the case of DLC) .
- the smaller electrode charges negatively because the different mobility of ions and electrons. For a net zero current to flow during the cycle, the smaller electrode becomes negatively charged on average during cycle and is again bombarded by energetic ions.
- a carrier gas containing carbon hydrogen or some halogens is ionized, solid films are deposited on the electrode and this is the PECVD process.
- the growing films are bombarded with ions, probably giving rise to the metastable, mostly amorphous structures of PECVD layers .
- the layers will be dense and hard because weakly bonded atoms will be resputtered.
- hard amorphous hydrogenated carbon films are obtained from hydrocarbon gases.
- process parameters are to be considered: type of gas, gas pressure, gas mixture ratio, substrate temperature, electrode and substrate geometry and electric field frequency. The most important parameters to control are the self bias potential, gas pressure and gas mixture ratio.
- the preferred procedure for producing hard DLC layers consist of first introducing argon at a pressure of 10 " 2 - 10 ⁇ 3 mbar with a RF voltage of about lkV to clean components . Argon is then replaced by a hydrocarbon solvent (highly volatile at low pressure) at a pressure of lO "1 -10 ⁇ " mbar and later mixed with another hydrocarbon gas as discussed above.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0409103-5A BRPI0409103A (en) | 2003-04-10 | 2004-04-08 | heat exchanger, substrate, and process for depositing an amorphous carbon layer on a substrate |
EP04759186A EP1611405A2 (en) | 2003-04-10 | 2004-04-08 | Amorphous carbon layer for heat exchangers |
JP2006509754A JP2006526075A (en) | 2003-04-10 | 2004-04-08 | Amorphous carbon layer for heat exchanger |
NO20055165A NO20055165L (en) | 2003-04-10 | 2005-11-03 | Amorphous carbon layer for heat exchanger |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/410,211 US20040200599A1 (en) | 2003-04-10 | 2003-04-10 | Amorphous carbon layer for heat exchangers and processes thereof |
US10/410,211 | 2003-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004092672A2 true WO2004092672A2 (en) | 2004-10-28 |
WO2004092672A3 WO2004092672A3 (en) | 2004-12-23 |
Family
ID=33130753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/010619 WO2004092672A2 (en) | 2003-04-10 | 2004-04-08 | Amorphous carbon layer for heat exchangers |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040200599A1 (en) |
EP (1) | EP1611405A2 (en) |
JP (1) | JP2006526075A (en) |
CN (1) | CN1802881A (en) |
BR (1) | BRPI0409103A (en) |
NO (1) | NO20055165L (en) |
WO (1) | WO2004092672A2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006270068A (en) * | 2005-03-21 | 2006-10-05 | Mitac Technology Corp | Semiconductor chip cooling system, structure and manufacturing method of heat exchange device for the same |
WO2020157077A3 (en) * | 2019-01-28 | 2020-09-17 | Cellink Ab | A compact fluorescence microscope and a cell monitoring system |
US11186736B2 (en) | 2018-10-10 | 2021-11-30 | Cellink Ab | Double network bioinks |
US11826951B2 (en) | 2019-09-06 | 2023-11-28 | Cellink Ab | Temperature-controlled multi-material overprinting |
US11931966B2 (en) | 2018-01-26 | 2024-03-19 | Cellink Bioprinting Ab | Systems and methods for optical assessments of bioink printability |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4423989B2 (en) * | 2004-02-05 | 2010-03-03 | トヨタ自動車株式会社 | Thermoelectric generator for internal combustion engine |
US7352584B1 (en) | 2005-05-10 | 2008-04-01 | Chien-Min Sung | Diamond-like carbon coated devices |
CN1870863B (en) * | 2005-05-28 | 2011-06-08 | 鸿富锦精密工业(深圳)有限公司 | Casing of portable electronic device and its manufacturing method |
JP4735309B2 (en) * | 2006-02-10 | 2011-07-27 | トヨタ自動車株式会社 | Cavitation erosion resistant member and method of manufacturing the same |
CN100412228C (en) * | 2006-06-08 | 2008-08-20 | 哈尔滨工业大学 | Composite reinforcing and treating method for alumium or alumium alloy substrate surface through ion implantation and deposition |
US7968473B2 (en) * | 2006-11-03 | 2011-06-28 | Applied Materials, Inc. | Low temperature process for depositing a high extinction coefficient non-peeling optical absorber for a scanning laser surface anneal of implanted dopants |
TW201020336A (en) * | 2008-11-20 | 2010-06-01 | Yu-Hsueh Lin | Method for plating film on surface of heat dissipation module and film-plated heat dissipation module |
CN101736312B (en) * | 2008-11-26 | 2012-11-21 | 林玉雪 | Method for coating surface of radiation module and coated radiation module |
US10433463B2 (en) * | 2011-10-20 | 2019-10-01 | Crucible Intellectual Property, Llc | Bulk amorphous alloy heat sink |
DE102018101453A1 (en) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heating device and method for producing a heating rod |
Citations (4)
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US5031029A (en) * | 1990-04-04 | 1991-07-09 | International Business Machines Corporation | Copper device and use thereof with semiconductor devices |
US5786633A (en) * | 1992-01-23 | 1998-07-28 | Siemens Aktiengesellschaft | Semiconductor module having high insulating power and high thermal conductivity |
US6131533A (en) * | 1996-08-15 | 2000-10-17 | Citizen Watch Co., Ltd. | Jig for forming hard carbon film over inner surface of guide bush using the jig |
JP2002228391A (en) * | 2001-01-30 | 2002-08-14 | Daikin Ind Ltd | Air heat exchanger with fins |
Family Cites Families (7)
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JPH0344485A (en) * | 1989-07-12 | 1991-02-26 | Matsushita Refrig Co Ltd | Fin material for heat exchanger |
US5840427A (en) * | 1996-05-21 | 1998-11-24 | Teledyne Industries Incorporated | Method for making corrosion resistant electrical components |
US5981000A (en) * | 1997-10-14 | 1999-11-09 | International Business Machines Corporation | Method for fabricating a thermally stable diamond-like carbon film |
US6301333B1 (en) * | 1999-12-30 | 2001-10-09 | Genvac Aerospace Corp. | Process for coating amorphous carbon coating on to an x-ray target |
US6713179B2 (en) * | 2000-05-24 | 2004-03-30 | Guardian Industries Corp. | Hydrophilic DLC on substrate with UV exposure |
US6788841B2 (en) * | 2002-01-16 | 2004-09-07 | Genvac Corporation | Diamond-like carbon heat sink for reflective optical switches and devices |
US6891324B2 (en) * | 2002-06-26 | 2005-05-10 | Nanodynamics, Inc. | Carbon-metal nano-composite materials for field emission cathodes and devices |
-
2003
- 2003-04-10 US US10/410,211 patent/US20040200599A1/en not_active Abandoned
-
2004
- 2004-04-08 JP JP2006509754A patent/JP2006526075A/en not_active Abandoned
- 2004-04-08 EP EP04759186A patent/EP1611405A2/en not_active Withdrawn
- 2004-04-08 BR BRPI0409103-5A patent/BRPI0409103A/en not_active IP Right Cessation
- 2004-04-08 WO PCT/US2004/010619 patent/WO2004092672A2/en not_active Application Discontinuation
- 2004-04-08 CN CN200480015652.7A patent/CN1802881A/en active Pending
-
2005
- 2005-11-03 NO NO20055165A patent/NO20055165L/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5031029A (en) * | 1990-04-04 | 1991-07-09 | International Business Machines Corporation | Copper device and use thereof with semiconductor devices |
US5786633A (en) * | 1992-01-23 | 1998-07-28 | Siemens Aktiengesellschaft | Semiconductor module having high insulating power and high thermal conductivity |
US6131533A (en) * | 1996-08-15 | 2000-10-17 | Citizen Watch Co., Ltd. | Jig for forming hard carbon film over inner surface of guide bush using the jig |
JP2002228391A (en) * | 2001-01-30 | 2002-08-14 | Daikin Ind Ltd | Air heat exchanger with fins |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006270068A (en) * | 2005-03-21 | 2006-10-05 | Mitac Technology Corp | Semiconductor chip cooling system, structure and manufacturing method of heat exchange device for the same |
US11931966B2 (en) | 2018-01-26 | 2024-03-19 | Cellink Bioprinting Ab | Systems and methods for optical assessments of bioink printability |
US11186736B2 (en) | 2018-10-10 | 2021-11-30 | Cellink Ab | Double network bioinks |
WO2020157077A3 (en) * | 2019-01-28 | 2020-09-17 | Cellink Ab | A compact fluorescence microscope and a cell monitoring system |
US11826951B2 (en) | 2019-09-06 | 2023-11-28 | Cellink Ab | Temperature-controlled multi-material overprinting |
Also Published As
Publication number | Publication date |
---|---|
JP2006526075A (en) | 2006-11-16 |
NO20055165L (en) | 2005-11-03 |
CN1802881A (en) | 2006-07-12 |
BRPI0409103A (en) | 2006-04-04 |
WO2004092672A3 (en) | 2004-12-23 |
EP1611405A2 (en) | 2006-01-04 |
US20040200599A1 (en) | 2004-10-14 |
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