WO2004083742A3 - Boiling temperature design in pumped microchannel cooling loops - Google Patents

Boiling temperature design in pumped microchannel cooling loops Download PDF

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Publication number
WO2004083742A3
WO2004083742A3 PCT/US2004/006746 US2004006746W WO2004083742A3 WO 2004083742 A3 WO2004083742 A3 WO 2004083742A3 US 2004006746 W US2004006746 W US 2004006746W WO 2004083742 A3 WO2004083742 A3 WO 2004083742A3
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
adjusting
pressure
heat
pumped
Prior art date
Application number
PCT/US2004/006746
Other languages
French (fr)
Other versions
WO2004083742A2 (en
Inventor
Peng Zhou
Shulin Zeng
Thomas W Kenny Jr
Mark Munch
Girish Upadhya
Kenneth Goodson
Juan G Santiago
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Publication of WO2004083742A2 publication Critical patent/WO2004083742A2/en
Publication of WO2004083742A3 publication Critical patent/WO2004083742A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of cooling at least one heat generating device (220) using a cooling system (200) is disclosed. The method comprises the steps of using at least one pump (240) to cause a fluid to flow in at least on heat exchanger (210) and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector (230) for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
PCT/US2004/006746 2003-03-17 2004-03-05 Boiling temperature design in pumped microchannel cooling loops WO2004083742A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US45572903P 2003-03-17 2003-03-17
US60/455,729 2003-03-17
US10/643,638 US20040182551A1 (en) 2003-03-17 2003-08-18 Boiling temperature design in pumped microchannel cooling loops
US10/643,638 2003-08-18

Publications (2)

Publication Number Publication Date
WO2004083742A2 WO2004083742A2 (en) 2004-09-30
WO2004083742A3 true WO2004083742A3 (en) 2005-11-24

Family

ID=32994652

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/006746 WO2004083742A2 (en) 2003-03-17 2004-03-05 Boiling temperature design in pumped microchannel cooling loops

Country Status (3)

Country Link
US (1) US20040182551A1 (en)
TW (1) TW200506305A (en)
WO (1) WO2004083742A2 (en)

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AU2011203084B2 (en) * 2004-11-03 2013-09-05 Velocys, Inc. Partial boiling in mini and micro-channels
US7327570B2 (en) * 2004-12-22 2008-02-05 Hewlett-Packard Development Company, L.P. Fluid cooled integrated circuit module
US20100044005A1 (en) * 2008-08-20 2010-02-25 International Business Machines Corporation Coolant pumping system for mobile electronic systems
US7872867B2 (en) * 2008-09-02 2011-01-18 International Business Machines Corporation Cooling system for an electronic component system cabinet
CN101881568A (en) * 2010-07-05 2010-11-10 云南汇博科技有限公司 Setting method for heat pipe start-up temperature value
WO2012145733A1 (en) 2011-04-22 2012-10-26 Vanderbilt University Para-hydrogen polarizer
CN103424018A (en) * 2012-05-14 2013-12-04 施耐德电器工业公司 Liquid phase-change heat transfer type pumping cooling system with booster pump
JP6439326B2 (en) 2014-08-29 2018-12-19 株式会社Ihi Reactor
CN106642809A (en) * 2016-12-28 2017-05-10 江苏康泰热交换设备工程有限公司 Microchannel heat pipe heating method and device
SG11202102482RA (en) * 2018-09-17 2021-04-29 Agency Science Tech & Res Liquid cooling module and method of forming the same
CN112736046B (en) * 2020-12-11 2024-03-22 杭州电子科技大学 Integrated chip heat dissipation device and heat dissipation method thereof

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Also Published As

Publication number Publication date
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US20040182551A1 (en) 2004-09-23
TW200506305A (en) 2005-02-16

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