WO2004080134A3 - High frequency chip packages with connecting elements - Google Patents

High frequency chip packages with connecting elements Download PDF

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Publication number
WO2004080134A3
WO2004080134A3 PCT/US2003/041132 US0341132W WO2004080134A3 WO 2004080134 A3 WO2004080134 A3 WO 2004080134A3 US 0341132 W US0341132 W US 0341132W WO 2004080134 A3 WO2004080134 A3 WO 2004080134A3
Authority
WO
WIPO (PCT)
Prior art keywords
leads
connecting element
circuit board
frequency chip
assembly
Prior art date
Application number
PCT/US2003/041132
Other languages
French (fr)
Other versions
WO2004080134A2 (en
Inventor
Masud Beroz
Michael Warner
Lee Smith
Glenn Urbish
Teck-Gyu Kang
Jae M Park
Yoichi Kubota
Original Assignee
Tessera Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera Inc filed Critical Tessera Inc
Priority to JP2004569225A priority Critical patent/JP4504204B2/en
Priority to AU2003299866A priority patent/AU2003299866A1/en
Publication of WO2004080134A2 publication Critical patent/WO2004080134A2/en
Publication of WO2004080134A3 publication Critical patent/WO2004080134A3/en

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

A radio frequency chip package is formed by assembling a connecting element such as a circuit board (52) or flexible circuit tape having chips (72, 84) thereon with a bottom plane element (20) such as a lead frame incorporating a large thermally-conductive plate (22) and leads (40, 42) projecting upwardly from the plane of the plate. The assembly step places the rear surfaces (78) of the chips (72) on the bottom side of the connecting element (52) into proximity with the thermal conductor (22) and joins the conductive traces (60) on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends (45) of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board (102). The leads (40, 42) provide robust electrical connections between the connecting element (52) and the circuit board (102).
PCT/US2003/041132 2003-02-25 2003-12-24 High frequency chip packages with connecting elements WO2004080134A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004569225A JP4504204B2 (en) 2003-02-25 2003-12-24 High frequency chip package with connecting elements
AU2003299866A AU2003299866A1 (en) 2003-02-25 2003-12-24 High frequency chip packages with connecting elements

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44967303P 2003-02-25 2003-02-25
US60/449,673 2003-02-25
US46217003P 2003-04-11 2003-04-11
US60/462,170 2003-04-11

Publications (2)

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WO2004080134A2 WO2004080134A2 (en) 2004-09-16
WO2004080134A3 true WO2004080134A3 (en) 2005-01-27

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Country Status (3)

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JP (1) JP4504204B2 (en)
AU (1) AU2003299866A1 (en)
WO (1) WO2004080134A2 (en)

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US9142527B2 (en) 2002-10-15 2015-09-22 Qualcomm Incorporated Method of wire bonding over active area of a semiconductor circuit

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Also Published As

Publication number Publication date
AU2003299866A1 (en) 2004-09-28
JP4504204B2 (en) 2010-07-14
AU2003299866A8 (en) 2004-09-28
WO2004080134A2 (en) 2004-09-16
JP2006514438A (en) 2006-04-27

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