WO2004075264A3 - Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems - Google Patents

Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems Download PDF

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Publication number
WO2004075264A3
WO2004075264A3 PCT/US2004/005120 US2004005120W WO2004075264A3 WO 2004075264 A3 WO2004075264 A3 WO 2004075264A3 US 2004005120 W US2004005120 W US 2004005120W WO 2004075264 A3 WO2004075264 A3 WO 2004075264A3
Authority
WO
WIPO (PCT)
Prior art keywords
syringe
methods
fluid
coating module
delivery systems
Prior art date
Application number
PCT/US2004/005120
Other languages
French (fr)
Other versions
WO2004075264A2 (en
Inventor
Branko Bem
Dikran Babikian
Original Assignee
Asml Holding Nv
Branko Bem
Dikran Babikian
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Holding Nv, Branko Bem, Dikran Babikian filed Critical Asml Holding Nv
Priority to JP2006501184A priority Critical patent/JP4227171B2/en
Publication of WO2004075264A2 publication Critical patent/WO2004075264A2/en
Publication of WO2004075264A3 publication Critical patent/WO2004075264A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles

Abstract

Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.
PCT/US2004/005120 2003-02-20 2004-02-20 Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems WO2004075264A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006501184A JP4227171B2 (en) 2003-02-20 2004-02-20 Method and apparatus for dispensing semiconductor processing solutions using a multi-syringe fluid dispensing system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/372,028 2003-02-20
US10/372,028 US7041172B2 (en) 2003-02-20 2003-02-20 Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

Publications (2)

Publication Number Publication Date
WO2004075264A2 WO2004075264A2 (en) 2004-09-02
WO2004075264A3 true WO2004075264A3 (en) 2005-01-13

Family

ID=32907686

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/005120 WO2004075264A2 (en) 2003-02-20 2004-02-20 Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

Country Status (5)

Country Link
US (2) US7041172B2 (en)
JP (1) JP4227171B2 (en)
KR (1) KR101028520B1 (en)
CN (1) CN100399499C (en)
WO (1) WO2004075264A2 (en)

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JP2015115486A (en) * 2013-12-12 2015-06-22 東京エレクトロン株式会社 Liquid supply device
CN105319855B (en) * 2014-06-25 2020-02-07 沈阳芯源微电子设备股份有限公司 Glue head and rubber tube integrated motion structure
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JP6352824B2 (en) * 2015-01-23 2018-07-04 東芝メモリ株式会社 Substrate processing apparatus, control program, and control method
JP6527716B2 (en) * 2015-02-27 2019-06-05 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and control method of substrate processing apparatus
US9915633B2 (en) * 2015-07-28 2018-03-13 The Boeing Company Two-dimensional array depression profiler and measurement device
KR102385264B1 (en) * 2015-08-28 2022-04-13 세메스 주식회사 Apparatus and method for treating a substrate
WO2018006011A1 (en) * 2016-07-01 2018-01-04 Carbon, Inc. Method and system for spin-coating multi-layer thin films having liquid conservation features
JP7073691B2 (en) * 2017-11-30 2022-05-24 東京エレクトロン株式会社 Liquid treatment equipment and liquid treatment method
IT201900016925A1 (en) * 2019-09-23 2021-03-23 Altergon Sa Punch for syringe pump for soft capsule encapsulating machine, and syringe pump comprising one or more of said punches
KR20210153298A (en) * 2020-06-10 2021-12-17 실이엔지 주식회사 Capsule type chemical solution supply apparatus and chemical solution supply method using the same

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JPS60251623A (en) * 1984-05-28 1985-12-12 Nec Corp Liquid material discharging device for semiconductor device
US5033656A (en) * 1989-02-21 1991-07-23 Minnesota Mining And Manufacturing Company Method and apparatus for precision squeeze tube valving, pumping and dispensing of work fluid (s)
US20030000462A1 (en) * 1998-03-02 2003-01-02 Prentice Thomas C. Dispensing system and method
US6280799B1 (en) * 1998-12-28 2001-08-28 Dai Nippon Printing Co., Ltd. Viscous substance discharging method using a viscous substance dispenser and pattern forming method using a viscous substance dispenser
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Also Published As

Publication number Publication date
KR101028520B1 (en) 2011-04-11
KR20050115864A (en) 2005-12-08
US20040248425A1 (en) 2004-12-09
JP2006518931A (en) 2006-08-17
US7041172B2 (en) 2006-05-09
JP4227171B2 (en) 2009-02-18
US20060127822A1 (en) 2006-06-15
WO2004075264A2 (en) 2004-09-02
US7485346B2 (en) 2009-02-03
CN1754247A (en) 2006-03-29
CN100399499C (en) 2008-07-02

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