WO2004072331A3 - Apparatus and method for highly controlled electrodeposition - Google Patents

Apparatus and method for highly controlled electrodeposition Download PDF

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Publication number
WO2004072331A3
WO2004072331A3 PCT/US2004/004277 US2004004277W WO2004072331A3 WO 2004072331 A3 WO2004072331 A3 WO 2004072331A3 US 2004004277 W US2004004277 W US 2004004277W WO 2004072331 A3 WO2004072331 A3 WO 2004072331A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
plating
current distribution
highly controlled
anode
Prior art date
Application number
PCT/US2004/004277
Other languages
French (fr)
Other versions
WO2004072331A2 (en
Inventor
Thomas P Griego
Fernando M Sanchez
Original Assignee
Surfect Technologies Inc
Thomas P Griego
Fernando M Sanchez
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/728,636 external-priority patent/US20040115340A1/en
Application filed by Surfect Technologies Inc, Thomas P Griego, Fernando M Sanchez filed Critical Surfect Technologies Inc
Publication of WO2004072331A2 publication Critical patent/WO2004072331A2/en
Publication of WO2004072331A3 publication Critical patent/WO2004072331A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/20—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
    • H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Abstract

An apparatus and method for highly controlled electrodeposition, particularly useful for electroplating submicron structures. Enhanced control of the process provides for a more uniform deposit thickness over the entire substrate, and permits reliable plating of submicron features. The apparatus includes a pressurized electrochemical cell (10) to improve plating efficiency and reduce defects, vertical laminar flow of the electrolyte solution to remove surface gases from the vertically arranged substrate, a rotating wafer chuck (12) to eliminate edge plating effects, and a variable aperture (18) to control the current distribution and ensure deposit uniformity across the entire substrate. Also a dynamic profile anode whose shape can be varied to optimize the current distribution to the substrate. The anode is advantageously able to use metallic ion sources and may be placed close to the cathode thus minimizing contamination of the substrate.
PCT/US2004/004277 2003-02-12 2004-02-12 Apparatus and method for highly controlled electrodeposition WO2004072331A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US44717503P 2003-02-12 2003-02-12
US60/447,175 2003-02-12
US51981303P 2003-11-12 2003-11-12
US60/519,813 2003-11-12
US10/728,636 US20040115340A1 (en) 2001-05-31 2003-12-05 Coated and magnetic particles and applications thereof
US10/728,636 2003-12-05

Publications (2)

Publication Number Publication Date
WO2004072331A2 WO2004072331A2 (en) 2004-08-26
WO2004072331A3 true WO2004072331A3 (en) 2004-10-28

Family

ID=32872767

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/004277 WO2004072331A2 (en) 2003-02-12 2004-02-12 Apparatus and method for highly controlled electrodeposition

Country Status (2)

Country Link
US (1) US20040256222A1 (en)
WO (1) WO2004072331A2 (en)

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US20060011487A1 (en) * 2001-05-31 2006-01-19 Surfect Technologies, Inc. Submicron and nano size particle encapsulation by electrochemical process and apparatus
WO2004052547A2 (en) * 2002-12-05 2004-06-24 Surfect Technologies, Inc. Coated and magnetic particles and applications thereof
TW200533791A (en) * 2004-02-04 2005-10-16 Surfect Technologies Inc Plating apparatus and method
US7837851B2 (en) * 2005-05-25 2010-11-23 Applied Materials, Inc. In-situ profile measurement in an electroplating process
WO2006127320A2 (en) * 2005-05-25 2006-11-30 Applied Materials, Inc. Electroplating apparatus based on an array of anodes
KR100806032B1 (en) * 2006-10-09 2008-02-26 동부일렉트로닉스 주식회사 Electrolysis plating system
US8101052B2 (en) * 2006-11-27 2012-01-24 Taiwan Semiconductor Manufacturing Co., Ltd. Adjustable anode assembly for a substrate wet processing apparatus
US20090038947A1 (en) * 2007-08-07 2009-02-12 Emat Technology, Llc. Electroplating aqueous solution and method of making and using same
US8241471B2 (en) * 2008-11-06 2012-08-14 Griffin Linnard Gene Hydrogen production systems utilizing electrodes formed from nano-particles suspended in an electrolyte
JP2011040036A (en) * 2009-03-30 2011-02-24 Avaya Inc System and method for managing communication session using graphical user interface
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
US9797057B2 (en) * 2009-08-24 2017-10-24 Empire Technology Development Llc Magnetic electro-plating
WO2013074702A1 (en) 2011-11-15 2013-05-23 Ashwin-Ushas Corporation, Inc. Complimentary polymer electrochromic device
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US10147510B1 (en) 2013-11-15 2018-12-04 National Technology & Engineering Solutions Of Sandia, Llc Electroplated AU for conformal coating of high aspect ratio silicon structures
JP6335777B2 (en) * 2014-12-26 2018-05-30 株式会社荏原製作所 Substrate holder, method for holding substrate with substrate holder, and plating apparatus
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
CN106677655A (en) * 2015-11-05 2017-05-17 江苏永兴金融设备有限公司 Reinforced electronic cabinet door capable of achieving automatic money depositing and withdrawing
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same

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Also Published As

Publication number Publication date
US20040256222A1 (en) 2004-12-23
WO2004072331A2 (en) 2004-08-26

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