WO2004071938A3 - Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency - Google Patents

Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency Download PDF

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Publication number
WO2004071938A3
WO2004071938A3 PCT/US2003/041226 US0341226W WO2004071938A3 WO 2004071938 A3 WO2004071938 A3 WO 2004071938A3 US 0341226 W US0341226 W US 0341226W WO 2004071938 A3 WO2004071938 A3 WO 2004071938A3
Authority
WO
WIPO (PCT)
Prior art keywords
generator
transducer
substrate
voltage
tuning
Prior art date
Application number
PCT/US2003/041226
Other languages
French (fr)
Other versions
WO2004071938A2 (en
Inventor
John Boyd
Andras Kuthi
William Thie
Michael G R Smith
Robert Knop
Thomas W Anderson
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/360,322 external-priority patent/US6995067B2/en
Priority claimed from US10/360,316 external-priority patent/US6998349B2/en
Priority claimed from US10/360,320 external-priority patent/US7033845B2/en
Priority claimed from US10/359,765 external-priority patent/US7053000B2/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Priority to EP03800161A priority Critical patent/EP1590828A2/en
Priority to CNB200380110213XA priority patent/CN100401479C/en
Priority to KR1020057014555A priority patent/KR101108901B1/en
Priority to JP2004568342A priority patent/JP4602773B2/en
Priority to AU2003299889A priority patent/AU2003299889A1/en
Publication of WO2004071938A2 publication Critical patent/WO2004071938A2/en
Publication of WO2004071938A3 publication Critical patent/WO2004071938A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B06B1/0223—Driving circuits for generating signals continuous in time
    • B06B1/0238—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave
    • B06B1/0246—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal
    • B06B1/0253—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal taken directly from the generator circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/71—Cleaning in a tank

Abstract

system and method of cleaning a substrate (202) includes a megasonic chamber (206) that includes a transducer (210) and a substrate (202). The transducer (210) is being oriented toward the substrate (202). A variable distance d separates the transducer (210) and the substrate (202). The system (200) also includes a dynamically adjustable RF generator (212) that has an output coupled to the transducer. The dynamically adjustable RF generator (212) can be controlled by a phase comparison of an oscillator output (306) voltage and a phase of an RF generator output voltage. The dynamically adjustable RF generator (212) can also be controlled by monitoring a peak voltage of an output signal and controlling the RF generator to maintain the peak voltage within a predetermined voltage range. The dynamically adjustable RF generator (212) can also be controlled by dynamically controlling a variable DC power supply voltage.
PCT/US2003/041226 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency WO2004071938A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP03800161A EP1590828A2 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency
CNB200380110213XA CN100401479C (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an RF generator at constant maximum efficiency
KR1020057014555A KR101108901B1 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto-tuning of an rf generator at constant maximum efficiency
JP2004568342A JP4602773B2 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using automatic adjustment of RF generator with constant maximum efficiency
AU2003299889A AU2003299889A1 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US10/360,322 US6995067B2 (en) 2003-02-06 2003-02-06 Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
US10/360,316 US6998349B2 (en) 2003-02-06 2003-02-06 System, method and apparatus for automatic control of an RF generator for maximum efficiency
US10/360,320 US7033845B2 (en) 2003-02-06 2003-02-06 Phase control of megasonic RF generator for optimum operation
US10/360,322 2003-02-06
US10/359,765 US7053000B2 (en) 2003-02-06 2003-02-06 System, method and apparatus for constant voltage control of RF generator for optimum operation
US10/360,316 2003-02-06
US10/360,320 2003-02-06
US10/359,765 2003-02-06

Publications (2)

Publication Number Publication Date
WO2004071938A2 WO2004071938A2 (en) 2004-08-26
WO2004071938A3 true WO2004071938A3 (en) 2004-12-29

Family

ID=32872957

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/041226 WO2004071938A2 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency

Country Status (7)

Country Link
EP (1) EP1590828A2 (en)
JP (1) JP4602773B2 (en)
KR (1) KR101108901B1 (en)
CN (1) CN100401479C (en)
AU (1) AU2003299889A1 (en)
TW (1) TWI292985B (en)
WO (1) WO2004071938A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2270838B1 (en) 2009-07-02 2019-06-12 IMEC vzw Method and apparatus for controlling optimal operation of acoustic cleaning
TWI490931B (en) * 2009-10-05 2015-07-01 Tokyo Electron Ltd Ultrasonic cleaning device, ultrasonic cleaning method, and recording medium that records computer program for executing the ultrasonic cleaning method
TWI716699B (en) * 2018-06-29 2021-01-21 施俊名 Ultrasonic frequency adjusting device for ultrasonic processing apparatus
CN110801160B (en) * 2018-08-06 2021-06-18 佛山市顺德区美的电热电器制造有限公司 Control method and system of cooking device and cooking device
CN113578859A (en) * 2021-08-02 2021-11-02 史荃 Staggered phase difference frequency type ultrasonic online sterilization, crushing, stirring and cleaning method and equipment
CN113787050B (en) * 2021-09-27 2023-08-18 韶关市洁盟超声科技有限公司 Ultrasonic cleaner with controllable ultrasonic output waveform
CN116581067B (en) * 2023-07-12 2023-09-22 北京东方金荣超声电器有限公司 Control method of megasonic system based on wet processing of device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5601655A (en) * 1995-02-14 1997-02-11 Bok; Hendrik F. Method of cleaning substrates
US5931173A (en) * 1997-06-09 1999-08-03 Cypress Semiconductor Corporation Monitoring cleaning effectiveness of a cleaning system
US6311702B1 (en) * 1998-11-11 2001-11-06 Applied Materials, Inc. Megasonic cleaner
US6333268B1 (en) * 1999-09-17 2001-12-25 Novellus Systems, Inc. Method and apparatus for removing post-etch residues and other adherent matrices
US6370005B1 (en) * 1998-10-14 2002-04-09 Delsys Pharmaceutical Corporation Electrostatic sensing chuck using area matched electrodes
US6503454B1 (en) * 2000-11-22 2003-01-07 Xerox Corporation Multi-ejector system for ejecting biofluids
US6623700B1 (en) * 2000-11-22 2003-09-23 Xerox Corporation Level sense and control system for biofluid drop ejection devices
US6681781B2 (en) * 1999-05-13 2004-01-27 Fsi International, Inc. Methods for cleaning microelectronic substrates using ultradilute cleaning liquids
US6706337B2 (en) * 2001-03-12 2004-03-16 Agfa Corporation Ultrasonic method for applying a coating material onto a substrate and for cleaning the coating material from the substrate
US6713022B1 (en) * 2000-11-22 2004-03-30 Xerox Corporation Devices for biofluid drop ejection

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418229A (en) * 1987-07-14 1989-01-23 Oki Electric Ind Co Ltd Super-ultrasonic cleaning device
JP3112542B2 (en) * 1992-01-24 2000-11-27 オリンパス光学工業株式会社 Ultrasonic polishing equipment
US5339844A (en) * 1992-08-10 1994-08-23 Hughes Aircraft Company Low cost equipment for cleaning using liquefiable gases
JP2001346805A (en) 2000-06-09 2001-12-18 Olympus Optical Co Ltd Ultrasonic surgical instrument
US20020049551A1 (en) * 2000-10-20 2002-04-25 Ethicon Endo-Surgery, Inc. Method for differentiating between burdened and cracked ultrasonically tuned blades

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5601655A (en) * 1995-02-14 1997-02-11 Bok; Hendrik F. Method of cleaning substrates
US5931173A (en) * 1997-06-09 1999-08-03 Cypress Semiconductor Corporation Monitoring cleaning effectiveness of a cleaning system
US6370005B1 (en) * 1998-10-14 2002-04-09 Delsys Pharmaceutical Corporation Electrostatic sensing chuck using area matched electrodes
US6311702B1 (en) * 1998-11-11 2001-11-06 Applied Materials, Inc. Megasonic cleaner
US6681781B2 (en) * 1999-05-13 2004-01-27 Fsi International, Inc. Methods for cleaning microelectronic substrates using ultradilute cleaning liquids
US6333268B1 (en) * 1999-09-17 2001-12-25 Novellus Systems, Inc. Method and apparatus for removing post-etch residues and other adherent matrices
US6503454B1 (en) * 2000-11-22 2003-01-07 Xerox Corporation Multi-ejector system for ejecting biofluids
US6623700B1 (en) * 2000-11-22 2003-09-23 Xerox Corporation Level sense and control system for biofluid drop ejection devices
US6713022B1 (en) * 2000-11-22 2004-03-30 Xerox Corporation Devices for biofluid drop ejection
US6706337B2 (en) * 2001-03-12 2004-03-16 Agfa Corporation Ultrasonic method for applying a coating material onto a substrate and for cleaning the coating material from the substrate

Also Published As

Publication number Publication date
WO2004071938A2 (en) 2004-08-26
AU2003299889A1 (en) 2004-09-06
JP2006513844A (en) 2006-04-27
EP1590828A2 (en) 2005-11-02
TWI292985B (en) 2008-01-21
CN100401479C (en) 2008-07-09
CN1759471A (en) 2006-04-12
TW200421713A (en) 2004-10-16
AU2003299889A8 (en) 2004-09-06
KR20050097992A (en) 2005-10-10
KR101108901B1 (en) 2012-02-20
JP4602773B2 (en) 2010-12-22

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