WO2004071700A3 - Room temperature metal direct bonding - Google Patents

Room temperature metal direct bonding Download PDF

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Publication number
WO2004071700A3
WO2004071700A3 PCT/US2004/002006 US2004002006W WO2004071700A3 WO 2004071700 A3 WO2004071700 A3 WO 2004071700A3 US 2004002006 W US2004002006 W US 2004002006W WO 2004071700 A3 WO2004071700 A3 WO 2004071700A3
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WO
WIPO (PCT)
Prior art keywords
metallic
bonding pads
room temperature
direct bonding
substrate
Prior art date
Application number
PCT/US2004/002006
Other languages
French (fr)
Other versions
WO2004071700A2 (en
Inventor
Qin-Yi Tong
Paul M Enquist
Anthony Scot Rose
Original Assignee
Ziptronix Inc
Qin-Yi Tong
Paul M Enquist
Anthony Scot Rose
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ziptronix Inc, Qin-Yi Tong, Paul M Enquist, Anthony Scot Rose filed Critical Ziptronix Inc
Priority to KR1020127003621A priority Critical patent/KR101252292B1/en
Priority to EP04708960.2A priority patent/EP1603702B1/en
Priority to CA2515375A priority patent/CA2515375C/en
Priority to JP2006502988A priority patent/JP5372325B2/en
Publication of WO2004071700A2 publication Critical patent/WO2004071700A2/en
Publication of WO2004071700A3 publication Critical patent/WO2004071700A3/en

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Abstract

A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.
PCT/US2004/002006 2003-02-07 2004-02-06 Room temperature metal direct bonding WO2004071700A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020127003621A KR101252292B1 (en) 2003-02-07 2004-02-06 Room temperature metal direct bonding
EP04708960.2A EP1603702B1 (en) 2003-02-07 2004-02-06 Bonding method for room temperature metal direct bonding
CA2515375A CA2515375C (en) 2003-02-07 2004-02-06 Room temperature metal direct bonding
JP2006502988A JP5372325B2 (en) 2003-02-07 2004-02-06 Room temperature metal direct bonding

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/359,608 2003-02-07
US10/359,608 US6962835B2 (en) 2003-02-07 2003-02-07 Method for room temperature metal direct bonding

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WO2004071700A2 WO2004071700A2 (en) 2004-08-26
WO2004071700A3 true WO2004071700A3 (en) 2005-04-21

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EP (1) EP1603702B1 (en)
JP (5) JP5372325B2 (en)
KR (2) KR101257274B1 (en)
CA (1) CA2515375C (en)
SG (1) SG2011091576A (en)
TW (1) TWI339408B (en)
WO (1) WO2004071700A2 (en)

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