WO2004070839A3 - Light emitting apparatus comprising semiconductor light emitting devices - Google Patents

Light emitting apparatus comprising semiconductor light emitting devices Download PDF

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Publication number
WO2004070839A3
WO2004070839A3 PCT/IB2004/000203 IB2004000203W WO2004070839A3 WO 2004070839 A3 WO2004070839 A3 WO 2004070839A3 IB 2004000203 W IB2004000203 W IB 2004000203W WO 2004070839 A3 WO2004070839 A3 WO 2004070839A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
lenses
output beam
circuit boards
emitting devices
Prior art date
Application number
PCT/IB2004/000203
Other languages
French (fr)
Other versions
WO2004070839A2 (en
Inventor
Vladimir Abramov
Dmitry Agafonov
Nikolai Scherbakov
Alexander Shishov
Valentin Scherbakov
Original Assignee
Acol Technologies S A
Vladimir Abramov
Dmitry Agafonov
Nikolai Scherbakov
Alexander Shishov
Valentin Scherbakov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acol Technologies S A, Vladimir Abramov, Dmitry Agafonov, Nikolai Scherbakov, Alexander Shishov, Valentin Scherbakov filed Critical Acol Technologies S A
Priority to EP04706239A priority Critical patent/EP1590831A2/en
Priority to CA002515314A priority patent/CA2515314A1/en
Publication of WO2004070839A2 publication Critical patent/WO2004070839A2/en
Publication of WO2004070839A3 publication Critical patent/WO2004070839A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

Semiconducto light emitting devices are incorporated with circuit boards and printed circuits to yield high performance illumination systems. Specifically, special circuit boards having high heat conductivity are arranged to support printed circuits to which light emitting diode die may be directly coupled. Lenses are attached to the substrate- printed circuit combination by way of an indexing system such that the lenses are properly aligned to focus light into a high power output beam. Some versions incorporate a novel reflector scheme to improve coupling between light emitted from the semiconductor chip and the output beam.
PCT/IB2004/000203 2003-02-05 2004-01-29 Light emitting apparatus comprising semiconductor light emitting devices WO2004070839A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04706239A EP1590831A2 (en) 2003-02-05 2004-01-29 Light emitting devices
CA002515314A CA2515314A1 (en) 2003-02-05 2004-01-29 Light emitting apparatus comprising semiconductor light emitting devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36023903A 2003-02-05 2003-02-05
US10/360,239 2003-02-05

Publications (2)

Publication Number Publication Date
WO2004070839A2 WO2004070839A2 (en) 2004-08-19
WO2004070839A3 true WO2004070839A3 (en) 2005-03-10

Family

ID=32849593

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2004/000203 WO2004070839A2 (en) 2003-02-05 2004-01-29 Light emitting apparatus comprising semiconductor light emitting devices

Country Status (5)

Country Link
EP (1) EP1590831A2 (en)
CN (1) CN1748310A (en)
CA (1) CA2515314A1 (en)
RU (1) RU2005127684A (en)
WO (1) WO2004070839A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060044806A1 (en) * 2004-08-25 2006-03-02 Abramov Vladimir S Light emitting diode system packages
US7329982B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
WO2006109113A2 (en) * 2005-04-12 2006-10-19 Acol Technologies Sa Primary optic for a light emitting diode
US8163580B2 (en) 2005-08-10 2012-04-24 Philips Lumileds Lighting Company Llc Multiple die LED and lens optical system
DE102006032428A1 (en) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Radiation emitting component for use as surface mount device component, has housing body including fastening device, which is curved or provided with projection in such a manner that optical unit is irreversibly fixed at housing body
JP4816482B2 (en) * 2007-02-07 2011-11-16 船井電機株式会社 Television receiver and LED display mechanism
EP2863104B1 (en) * 2007-05-02 2019-07-10 Signify Holding B.V. Solid-state lighting device
DE102007034123B4 (en) * 2007-07-21 2016-02-11 Automotive Lighting Reutlingen Gmbh Light module for a xenon light or semiconductor light source headlight
US9263651B2 (en) 2007-09-20 2016-02-16 Koninklijke Philips N.V. Collimator
CN101981610A (en) * 2008-02-08 2011-02-23 G-Lec欧洲有限公司 Display device and securing means
DE102008039364A1 (en) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung Semiconductor light emitting device
DE102008059316B4 (en) * 2008-11-27 2023-11-02 Vitesco Technologies Germany Gmbh Electronic component in a housing
DE102010000128B4 (en) * 2009-01-21 2019-04-04 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg LED array
CZ19871U1 (en) * 2009-06-05 2009-07-20 Cernoch@Jakub Light fitting
AT509562A1 (en) * 2010-02-24 2011-09-15 Thallner Erich LIGHTING DEVICE AND METHOD FOR PRODUCING SUCH A
IT1404069B1 (en) * 2010-05-03 2013-11-08 Menegon ROTATION SYSTEM FOR LUMINOUS FLOW CONVEYOR WITH REFERENCE FEET.
RU2454760C1 (en) * 2010-12-27 2012-06-27 Российская академия наук Учреждение Российской академии наук Институт систем обработки изображений РАН (ИСОИ РАН) Planar binary microlens
CN103133895A (en) * 2011-11-29 2013-06-05 欧司朗股份有限公司 Light emitting diode (LED) lighting device and manufacturing method thereof
RU2513645C2 (en) * 2012-06-15 2014-04-20 Инесса Петровна Полякова Light-emitting diode device
RU2513640C2 (en) * 2012-06-27 2014-04-20 Инесса Петровна Полякова Light-emitting diode device
JP2017050345A (en) * 2015-08-31 2017-03-09 シチズン電子株式会社 Manufacturing method for light-emitting device
DE102015013510A1 (en) * 2015-10-15 2017-04-20 Jenoptik Polymer Systems Gmbh Illuminating device and method for producing a luminous means
MX2018016024A (en) * 2016-07-08 2019-05-13 Eaton Intelligent Power Ltd Led light system.
EP4163537A1 (en) * 2021-10-11 2023-04-12 ZKW Group GmbH Circuit board assembly for a motor vehicle headlight

Citations (9)

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Publication number Priority date Publication date Assignee Title
JPS5935492A (en) * 1982-08-23 1984-02-27 Toshiba Corp Manuscript lighting device
JPS6333879A (en) * 1986-07-28 1988-02-13 Mitsubishi Cable Ind Ltd Light-emitting diode structure
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US4975814A (en) * 1988-08-10 1990-12-04 Telefunken Electronic Gmbh Wide-area lamp
EP0585186A2 (en) * 1992-08-28 1994-03-02 Eastman Kodak Company Semiconductor insulation for optical devices
JPH10242523A (en) * 1997-02-28 1998-09-11 Kouha:Kk Light emitting diode display device and picture display device utilizing the same
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
US6392294B1 (en) * 1998-12-22 2002-05-21 Rohm Co., Ltd. Semiconductor device with stable protection coating

Patent Citations (9)

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Publication number Priority date Publication date Assignee Title
JPS5935492A (en) * 1982-08-23 1984-02-27 Toshiba Corp Manuscript lighting device
JPS6333879A (en) * 1986-07-28 1988-02-13 Mitsubishi Cable Ind Ltd Light-emitting diode structure
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US4975814A (en) * 1988-08-10 1990-12-04 Telefunken Electronic Gmbh Wide-area lamp
EP0585186A2 (en) * 1992-08-28 1994-03-02 Eastman Kodak Company Semiconductor insulation for optical devices
JPH10242523A (en) * 1997-02-28 1998-09-11 Kouha:Kk Light emitting diode display device and picture display device utilizing the same
US6392294B1 (en) * 1998-12-22 2002-05-21 Rohm Co., Ltd. Semiconductor device with stable protection coating
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same

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PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *

Also Published As

Publication number Publication date
EP1590831A2 (en) 2005-11-02
WO2004070839A2 (en) 2004-08-19
CN1748310A (en) 2006-03-15
RU2005127684A (en) 2006-01-27
CA2515314A1 (en) 2004-08-19

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