WO2004065289A3 - Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof - Google Patents

Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof Download PDF

Info

Publication number
WO2004065289A3
WO2004065289A3 PCT/IT2003/000857 IT0300857W WO2004065289A3 WO 2004065289 A3 WO2004065289 A3 WO 2004065289A3 IT 0300857 W IT0300857 W IT 0300857W WO 2004065289 A3 WO2004065289 A3 WO 2004065289A3
Authority
WO
WIPO (PCT)
Prior art keywords
getter material
micromechanical
deposit
support
production
Prior art date
Application number
PCT/IT2003/000857
Other languages
French (fr)
Other versions
WO2004065289A2 (en
Inventor
Marco Amiotti
Original Assignee
Getters Spa
Marco Amiotti
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa, Marco Amiotti filed Critical Getters Spa
Priority to EP03786227A priority Critical patent/EP1592643A2/en
Priority to CA002511836A priority patent/CA2511836A1/en
Priority to AU2003295223A priority patent/AU2003295223A1/en
Priority to JP2004567099A priority patent/JP2006513046A/en
Publication of WO2004065289A2 publication Critical patent/WO2004065289A2/en
Publication of WO2004065289A3 publication Critical patent/WO2004065289A3/en
Priority to NO20053804A priority patent/NO20053804L/en
Priority to HK06107278.2A priority patent/HK1087090A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters

Abstract

Micromechanical (10; 20) or microoptoelectronic (30) devices are described which comprises a deposit of getter material (17; 25; 35) for the sorption of gases being detrimental to the operation of said devices and an integrated system (18, 18’, 19, 19’) for heating the getter material from the outside at each moment this is required during the life of the device. Various embodiments of a support for manufacturing these devices are also described.
PCT/IT2003/000857 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof WO2004065289A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP03786227A EP1592643A2 (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof
CA002511836A CA2511836A1 (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof
AU2003295223A AU2003295223A1 (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof
JP2004567099A JP2006513046A (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with getter material deposits and built-in heaters, and support for their manufacture
NO20053804A NO20053804L (en) 2003-01-17 2005-08-12 Micromechanical or microoptoelectronic device with deposition of getter material and integrated heating device and support plate for production thereof
HK06107278.2A HK1087090A1 (en) 2003-01-17 2006-06-28 Micromechanical or microoptoelectronic devices and support for the production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMI2003A000069 2003-01-17
IT000069A ITMI20030069A1 (en) 2003-01-17 2003-01-17 MICROMECHANICAL OR MICROOPTOELECTRONIC DEVICES WITH STORAGE OF GETTER MATERIAL AND INTEGRATED HEATER.

Publications (2)

Publication Number Publication Date
WO2004065289A2 WO2004065289A2 (en) 2004-08-05
WO2004065289A3 true WO2004065289A3 (en) 2005-01-06

Family

ID=32750478

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IT2003/000857 WO2004065289A2 (en) 2003-01-17 2003-12-24 Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof

Country Status (12)

Country Link
EP (1) EP1592643A2 (en)
JP (1) JP2006513046A (en)
KR (1) KR20050092426A (en)
CN (1) CN100453442C (en)
AU (1) AU2003295223A1 (en)
CA (1) CA2511836A1 (en)
HK (1) HK1087090A1 (en)
IT (1) ITMI20030069A1 (en)
MY (1) MY157923A (en)
NO (1) NO20053804L (en)
TW (1) TW200500291A (en)
WO (1) WO2004065289A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005001449B3 (en) * 2005-01-12 2006-07-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. A method for generating a predetermined internal pressure in a cavity of a semiconductor device
ITMI20052343A1 (en) * 2005-12-06 2007-06-07 Getters Spa PROCESS FOR THE PRODUCTION OF MICROMECHANICAL DEVICES CONTAINING A GETTER MATERIAL AND DEVICES SO MANUFACTURED
FR2898597B1 (en) 2006-03-16 2008-09-19 Commissariat Energie Atomique ENCAPSULATION IN A HERMETIC CAVITY OF A MICROELECTRONIC COMPOUND, IN PARTICULAR A MEMS
FR2903678B1 (en) 2006-07-13 2008-10-24 Commissariat Energie Atomique ENCAPSULATED MICROCOMPONENT EQUIPPED WITH AT LEAST ONE GETTER
US7402905B2 (en) * 2006-08-07 2008-07-22 Honeywell International Inc. Methods of fabrication of wafer-level vacuum packaged devices
ITMI20070301A1 (en) 2007-02-16 2008-08-17 Getters Spa SUPPORTS INCLUDING GETTER MATERIALS AND ALKALINE OR ALKALINE-TERROSI METALS FOR THERMOREGULATION SYSTEMS BASED ON TUNNEL EFFECT
FR2933389B1 (en) 2008-07-01 2010-10-29 Commissariat Energie Atomique STRUCTURE BASED ON SUSPENDED GETTER MATERIAL
JP2010251702A (en) * 2009-03-27 2010-11-04 Kyocera Corp Electronic component, package and infrared sensor
FR2956521B1 (en) * 2010-02-16 2012-08-17 Thales Sa DEVICE COMPRISING ELECTRICAL, ELECTRONIC, ELECTROMECHANICAL OR ELECTRO-OPTICAL COMPONENTS WITH REDUCED SENSITIVITY AT LOW RATE OF DOSE
US9491802B2 (en) 2012-02-17 2016-11-08 Honeywell International Inc. On-chip alkali dispenser
EP2736071B8 (en) 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
JP6193480B2 (en) * 2013-05-24 2017-09-06 スナップトラック・インコーポレーテッド Microelectromechanical system device package and method for manufacturing microelectromechanical system device package
EP2813465B1 (en) 2013-06-12 2020-01-15 Tronic's Microsystems MEMS device with getter layer
FR3008965B1 (en) * 2013-07-26 2017-03-03 Commissariat Energie Atomique ENCAPSULATION STRUCTURE COMPRISING A MECHANICALLY REINFORCED HOOD AND GETTER EFFECT
CN104743502A (en) * 2013-12-31 2015-07-01 北京有色金属研究总院 MEMS component with composite getter layer and preparation method thereof
JP2017224704A (en) 2016-06-15 2017-12-21 セイコーエプソン株式会社 Vacuum package, electronic device, electronic equipment, and mobile
CN109173690B (en) * 2018-09-20 2020-10-09 内蒙古科技大学 Air consumption agent for metal material heat treatment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
EP0794558A1 (en) * 1996-02-26 1997-09-10 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
US5734226A (en) * 1992-08-12 1998-03-31 Micron Technology, Inc. Wire-bonded getters useful in evacuated displays
WO1998037392A1 (en) * 1997-02-20 1998-08-27 Cecap Ab A sensor element having an integrated reference pressure
US20020063322A1 (en) * 2000-11-30 2002-05-30 Robbins Roger A. Micromechanical getter anchor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5734226A (en) * 1992-08-12 1998-03-31 Micron Technology, Inc. Wire-bonded getters useful in evacuated displays
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
EP0794558A1 (en) * 1996-02-26 1997-09-10 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
WO1998037392A1 (en) * 1997-02-20 1998-08-27 Cecap Ab A sensor element having an integrated reference pressure
US20020063322A1 (en) * 2000-11-30 2002-05-30 Robbins Roger A. Micromechanical getter anchor

Also Published As

Publication number Publication date
CN1738765A (en) 2006-02-22
WO2004065289A2 (en) 2004-08-05
NO20053804L (en) 2005-08-12
AU2003295223A1 (en) 2004-08-13
CA2511836A1 (en) 2004-08-05
KR20050092426A (en) 2005-09-21
EP1592643A2 (en) 2005-11-09
TW200500291A (en) 2005-01-01
JP2006513046A (en) 2006-04-20
HK1087090A1 (en) 2006-10-06
CN100453442C (en) 2009-01-21
ITMI20030069A1 (en) 2004-07-18
MY157923A (en) 2016-08-15

Similar Documents

Publication Publication Date Title
WO2004065289A3 (en) Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof
EP1505167A3 (en) Evaporation source
WO2003009318A8 (en) Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
AU2002951274A0 (en) Methods for the chemical and physical modification of nanotubes, methods for linking the nanotubes, methods for the directed positioning of nanotubes, and uses thereof
JP2004538039A5 (en)
AU2003207185A1 (en) Organic semiconductor structure, process for producing the same, and organic semiconductor device
WO2006113587A3 (en) Carton with support
WO2003018632A3 (en) Epitope regions of a thyrotrophin (tsh) receptor, uses thereof and antibodies thereto
DE602006016850D1 (en) METHOD OF PRODUCING MICROMECHANICAL DEVICES CONTAINING A SUPPORTING MATERIAL AND DEVICES MADE THEREFOR
AU6421399A (en) Interpretive language architecture for controlling the attributes of a physical,chemical, or thermodynamic process
AU2003284416A1 (en) Silicon carbide porous body, process for producing the same and honeycomb structure
NO20060595L (en) Manufacture of devices with non-evaporable getter material
EP1855313A4 (en) Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film
MY128708A (en) Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
DE60230165D1 (en) PLASMA DISPLAY DEVICE, FLUORESCENT MATERIAL AND ITS MANUFACTURE
ZA200205643B (en) Bonded fabrics with high liquid absorption and regular structure, process for the manufacture thereof and their use.
WO2004067849A3 (en) Flexible sleeve
WO2002064557A3 (en) New crystal forms of oxcarbazepine and processes for their preparation
EP1273821A4 (en) Controlled, liquid sealed-in type vibration damper
WO2007030342A3 (en) Method and apparatus for locating multimode communication devices
Ishii et al. A convenient method for the generation of a disulfur monoxide equivalent and its reaction with diazoalkanes to yield dithiirane 1-oxides this work was supported by a Grant-in-Aid for Scientific Research (No. 90193242) from the Ministry of Education, Science, Sports, and Culture, Japan
WO2001093313A3 (en) Developing methods for photoresist, apparatuses for coating
DE502004006389D1 (en) Flammhemmfolie
EP1231444A3 (en) Thermal treatment kiln, particularly for ceramic articles
TR200000441A3 (en) Process for the manufacture of organic azides.

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2511836

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2003786227

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 20038A8858X

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020057013228

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2004567099

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 1020057013228

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2003786227

Country of ref document: EP