WO2004053008A3 - Passivative chemical mechanical polishing composition for copper film planarization - Google Patents
Passivative chemical mechanical polishing composition for copper film planarization Download PDFInfo
- Publication number
- WO2004053008A3 WO2004053008A3 PCT/US2003/038047 US0338047W WO2004053008A3 WO 2004053008 A3 WO2004053008 A3 WO 2004053008A3 US 0338047 W US0338047 W US 0338047W WO 2004053008 A3 WO2004053008 A3 WO 2004053008A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- passivative
- mechanical polishing
- chemical mechanical
- polishing composition
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052802 copper Inorganic materials 0.000 title abstract 4
- 239000010949 copper Substances 0.000 title abstract 4
- 238000005498 polishing Methods 0.000 title abstract 2
- 239000000126 substance Substances 0.000 title 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 abstract 1
- 230000002411 adverse Effects 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 230000007812 deficiency Effects 0.000 abstract 1
- -1 e.g. Chemical compound 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/141—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003297590A AU2003297590A1 (en) | 2002-12-10 | 2003-12-02 | Passivative chemical mechanical polishing composition for copper film planarization |
EP03812786A EP1570015A4 (en) | 2002-12-10 | 2003-12-02 | Passivative chemical mechanical polishing composition for copper film planarization |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/315,641 US7300601B2 (en) | 2002-12-10 | 2002-12-10 | Passivative chemical mechanical polishing composition for copper film planarization |
US10/315,641 | 2002-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004053008A2 WO2004053008A2 (en) | 2004-06-24 |
WO2004053008A3 true WO2004053008A3 (en) | 2004-09-02 |
Family
ID=32468759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/038047 WO2004053008A2 (en) | 2002-12-10 | 2003-12-02 | Passivative chemical mechanical polishing composition for copper film planarization |
Country Status (6)
Country | Link |
---|---|
US (5) | US7300601B2 (en) |
EP (1) | EP1570015A4 (en) |
CN (2) | CN101085901A (en) |
AU (1) | AU2003297590A1 (en) |
TW (1) | TWI338711B (en) |
WO (1) | WO2004053008A2 (en) |
Families Citing this family (147)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040175942A1 (en) * | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
US7736405B2 (en) * | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
US8158532B2 (en) * | 2003-10-20 | 2012-04-17 | Novellus Systems, Inc. | Topography reduction and control by selective accelerator removal |
US7972970B2 (en) * | 2003-10-20 | 2011-07-05 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structure |
US8372757B2 (en) | 2003-10-20 | 2013-02-12 | Novellus Systems, Inc. | Wet etching methods for copper removal and planarization in semiconductor processing |
TWI244498B (en) * | 2003-11-20 | 2005-12-01 | Eternal Chemical Co Ltd | Chemical mechanical abrasive slurry and method of using the same |
US20050189322A1 (en) * | 2004-02-27 | 2005-09-01 | Lane Sarah J. | Compositions and methods for chemical mechanical polishing silica and silicon nitride |
US20050279964A1 (en) * | 2004-06-17 | 2005-12-22 | Ming-Tseh Tsay | Chemical mechanical polishing slurry for polishing copper layer on a wafer |
US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
US7144599B2 (en) | 2004-07-15 | 2006-12-05 | Birchwood Laboratories, Inc. | Hybrid metal oxide/organometallic conversion coating for ferrous metals |
US20060021972A1 (en) * | 2004-07-28 | 2006-02-02 | Lane Sarah J | Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride |
US8178482B2 (en) * | 2004-08-03 | 2012-05-15 | Avantor Performance Materials, Inc. | Cleaning compositions for microelectronic substrates |
KR100672941B1 (en) * | 2004-10-06 | 2007-01-24 | 삼성전자주식회사 | Solution of inhibiting Copper erosion and CMP process using the solution |
JP5026665B2 (en) * | 2004-10-15 | 2012-09-12 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
US20060116313A1 (en) * | 2004-11-30 | 2006-06-01 | Denise Geitz | Compositions comprising tannic acid as corrosion inhibitor |
US20060124026A1 (en) * | 2004-12-10 | 2006-06-15 | 3M Innovative Properties Company | Polishing solutions |
US7446046B2 (en) * | 2005-01-06 | 2008-11-04 | Intel Corporation | Selective polish for fabricating electronic devices |
US7427362B2 (en) * | 2005-01-26 | 2008-09-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Corrosion-resistant barrier polishing solution |
US20060214133A1 (en) * | 2005-03-17 | 2006-09-28 | Fuji Photo Film Co., Ltd. | Metal polishing solution and polishing method |
US20060216935A1 (en) * | 2005-03-28 | 2006-09-28 | Ferro Corporation | Composition for oxide CMP in CMOS device fabrication |
US7467988B2 (en) * | 2005-04-08 | 2008-12-23 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
US7294044B2 (en) * | 2005-04-08 | 2007-11-13 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
US20110045741A1 (en) * | 2005-04-28 | 2011-02-24 | Techno Semichem Co., Ltd. | Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer |
KR100661273B1 (en) * | 2005-04-28 | 2006-12-26 | 테크노세미켐 주식회사 | Abrasive composition for polishing of wafer |
SG127749A1 (en) * | 2005-05-11 | 2006-12-29 | Agency Science Tech & Res | Method and solution for forming anatase titanium dioxide, and titanium dioxide particles, colloidal dispersion and film |
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US20060283093A1 (en) * | 2005-06-15 | 2006-12-21 | Ivan Petrovic | Planarization composition |
US7718536B2 (en) * | 2005-06-16 | 2010-05-18 | United Microelectronics Corp. | Planarization process for pre-damascene structure including metal hard mask |
JP4679277B2 (en) * | 2005-07-11 | 2011-04-27 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
WO2007019342A2 (en) * | 2005-08-05 | 2007-02-15 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
KR20070017762A (en) * | 2005-08-08 | 2007-02-13 | 엘지.필립스 엘시디 주식회사 | Etchant composition, method of patterning electroconductive film using the same and method of fabricating flat panel display using the same |
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WO2008048240A2 (en) * | 2005-09-22 | 2008-04-24 | Pantheon Chemical, Inc. | Copper chelating agent, composition including the agent, and methods of forming and using the agent and composition |
JP2007088379A (en) * | 2005-09-26 | 2007-04-05 | Fujifilm Corp | Aqueous polishing slurry and chemical mechanical polishing method |
JP4798134B2 (en) * | 2005-10-12 | 2011-10-19 | 日立化成工業株式会社 | Polishing liquid and polishing method for CMP |
US7435162B2 (en) * | 2005-10-24 | 2008-10-14 | 3M Innovative Properties Company | Polishing fluids and methods for CMP |
CN101356629B (en) | 2005-11-09 | 2012-06-06 | 高级技术材料公司 | Composition and method for recycling semiconductor wafers having low-K dielectric materials thereon |
US7534753B2 (en) * | 2006-01-12 | 2009-05-19 | Air Products And Chemicals, Inc. | pH buffered aqueous cleaning composition and method for removing photoresist residue |
US20070218692A1 (en) * | 2006-01-31 | 2007-09-20 | Nissan Chemical Industries, Ltd. | Copper-based metal polishing compositions and polishing processes |
KR20070088245A (en) * | 2006-02-24 | 2007-08-29 | 후지필름 가부시키가이샤 | Polishing liquid for metals |
US20070209287A1 (en) * | 2006-03-13 | 2007-09-13 | Cabot Microelectronics Corporation | Composition and method to polish silicon nitride |
US7820067B2 (en) * | 2006-03-23 | 2010-10-26 | Cabot Microelectronics Corporation | Halide anions for metal removal rate control |
CN100491072C (en) * | 2006-06-09 | 2009-05-27 | 河北工业大学 | Method for controlling disc-like pit during chemically mechanical polishing for ULSI multiple-layered copper wiring |
US7396768B2 (en) * | 2006-10-20 | 2008-07-08 | Hitachi Global Storage Technologies Netherlands B.V. | Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication |
EP2092031A1 (en) * | 2006-12-04 | 2009-08-26 | Basf Se | Planarization composition for metal surfaces comprising an alumina hydrate abrasive |
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US20100087065A1 (en) * | 2007-01-31 | 2010-04-08 | Advanced Technology Materials, Inc. | Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications |
JP5121273B2 (en) * | 2007-03-29 | 2013-01-16 | 富士フイルム株式会社 | Polishing liquid for metal and polishing method |
US20100112728A1 (en) * | 2007-03-31 | 2010-05-06 | Advanced Technology Materials, Inc. | Methods for stripping material for wafer reclamation |
US7670497B2 (en) * | 2007-07-06 | 2010-03-02 | International Business Machines Corporation | Oxidant and passivant composition and method for use in treating a microelectronic structure |
KR101325455B1 (en) * | 2007-07-26 | 2013-11-04 | 캐보트 마이크로일렉트로닉스 코포레이션 | Compositions and methods for chemical-mechanical polishing of phase change materials |
US20090031636A1 (en) * | 2007-08-03 | 2009-02-05 | Qianqiu Ye | Polymeric barrier removal polishing slurry |
US20090032765A1 (en) * | 2007-08-03 | 2009-02-05 | Jinru Bian | Selective barrier polishing slurry |
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US8425797B2 (en) * | 2008-03-21 | 2013-04-23 | Cabot Microelectronics Corporation | Compositions for polishing aluminum/copper and titanium in damascene structures |
US8247326B2 (en) * | 2008-07-10 | 2012-08-21 | Cabot Microelectronics Corporation | Method of polishing nickel-phosphorous |
US8361237B2 (en) * | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
KR101279966B1 (en) * | 2008-12-29 | 2013-07-05 | 제일모직주식회사 | CMP slurry composition for polishing metal wiring and polishing method using the same |
KR20100091436A (en) * | 2009-02-10 | 2010-08-19 | 삼성전자주식회사 | Composition of solution for chemical mechanical polishing |
US8845915B2 (en) | 2009-02-16 | 2014-09-30 | Hitachi Chemical Company, Ltd. | Abrading agent and abrading method |
TWI535834B (en) * | 2009-02-16 | 2016-06-01 | 日立化成股份有限公司 | Polishing agent for polishing copper and polishing method using the same |
EP2226374B1 (en) * | 2009-03-06 | 2012-05-16 | S.O.I. TEC Silicon | Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition |
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US8309468B1 (en) * | 2011-04-28 | 2012-11-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys |
US8790160B2 (en) * | 2011-04-28 | 2014-07-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for polishing phase change alloys |
JP5933950B2 (en) | 2011-09-30 | 2016-06-15 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Etching solution for copper or copper alloy |
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US9346977B2 (en) | 2012-02-21 | 2016-05-24 | Hitachi Chemical Company, Ltd. | Abrasive, abrasive set, and method for abrading substrate |
CN107617968A (en) | 2012-02-21 | 2018-01-23 | 日立化成株式会社 | The Ginding process of grinding agent, grinding agent group and matrix |
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US9039914B2 (en) | 2012-05-23 | 2015-05-26 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous-coated memory disks |
WO2014089196A1 (en) | 2012-12-05 | 2014-06-12 | Advanced Technology Materials, Inc. | Compositions for cleaning iii-v semiconductor materials and methods of using same |
KR101933529B1 (en) * | 2012-12-28 | 2019-03-15 | 동우 화인켐 주식회사 | Etchant composition for copper-containing metal layer and preparing method of an array substrate for liquid crystal display using same |
CN103450812B (en) * | 2013-01-10 | 2014-09-17 | 湖南皓志新材料股份有限公司 | Polishing solution for sapphire substrate |
US10472567B2 (en) | 2013-03-04 | 2019-11-12 | Entegris, Inc. | Compositions and methods for selectively etching titanium nitride |
JP6203525B2 (en) * | 2013-04-19 | 2017-09-27 | 関東化學株式会社 | Cleaning liquid composition |
SG10201708364XA (en) * | 2013-06-06 | 2017-11-29 | Entegris Inc | Compositions and methods for selectively etching titanium nitride |
US8974692B2 (en) * | 2013-06-27 | 2015-03-10 | Air Products And Chemicals, Inc. | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications |
CN112442374A (en) | 2013-07-31 | 2021-03-05 | 恩特格里斯公司 | Aqueous formulations with Cu/W compatibility for removal of metal hardmask and post-etch residues |
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CN104449564A (en) * | 2013-09-23 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | Monodisperse grinding fluid and preparation method thereof and method for preparing inorganic oxide sol |
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TWI662379B (en) | 2013-12-20 | 2019-06-11 | 美商恩特葛瑞斯股份有限公司 | Use of non-oxidizing strong acids for the removal of ion-implanted resist |
US10475658B2 (en) | 2013-12-31 | 2019-11-12 | Entegris, Inc. | Formulations to selectively etch silicon and germanium |
WO2015116818A1 (en) | 2014-01-29 | 2015-08-06 | Advanced Technology Materials, Inc. | Post chemical mechanical polishing formulations and method of use |
US11127587B2 (en) | 2014-02-05 | 2021-09-21 | Entegris, Inc. | Non-amine post-CMP compositions and method of use |
CN103789770B (en) * | 2014-02-14 | 2016-08-31 | 东莞宜安科技股份有限公司 | Large block amorphous and nanometer crystal alloy Surface Chemical Polishing technique |
JP6879202B2 (en) * | 2015-03-10 | 2021-06-02 | 昭和電工マテリアルズ株式会社 | Abrasives, storage solutions for abrasives and polishing methods |
CN104746082B (en) * | 2015-03-12 | 2017-05-17 | 深圳新宙邦科技股份有限公司 | Water-based copper anti-rusting agent and preparation method thereof |
US9978609B2 (en) | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
CN105002498A (en) * | 2015-07-24 | 2015-10-28 | 金川集团股份有限公司 | GH625 high-temperature alloy metallographic etchant and preparation and application method thereof |
CN105086836A (en) * | 2015-08-19 | 2015-11-25 | 三峡大学 | Cerium oxide polishing solution and preparation method thereof |
WO2017156304A1 (en) | 2016-03-09 | 2017-09-14 | Entegris, Inc. | Tungsten post-cmp cleaning compositions |
CN105802582A (en) * | 2016-05-23 | 2016-07-27 | 昆山金城试剂有限公司 | Rare earth grinding fluid |
WO2017214995A1 (en) * | 2016-06-17 | 2017-12-21 | 深圳市恒兆智科技有限公司 | Polishing agent, copper part and polishing treatment method therefor |
KR101943704B1 (en) * | 2016-06-27 | 2019-01-29 | 삼성에스디아이 주식회사 | Cmp slurry composition for metal film and polishing method |
CN106119855B (en) * | 2016-08-17 | 2018-08-21 | 安徽红桥金属制造有限公司 | A kind of preparation method of stainless steel material polishing agent |
WO2018056122A1 (en) * | 2016-09-21 | 2018-03-29 | 日立化成株式会社 | Slurry and polishing method |
US10655035B2 (en) * | 2017-05-25 | 2020-05-19 | Saint-Gobain Ceramics & Plastics, Inc. | Oxidizing fluid for the chemical-mechanical polishing of ceramic materials |
CN107164764A (en) * | 2017-06-09 | 2017-09-15 | 大连理工大学 | A kind of environment protection chemical mechanical polishing method of copper |
CN110832043A (en) * | 2017-07-03 | 2020-02-21 | 深圳市宏昌发科技有限公司 | Polishing agent, copper piece and polishing treatment method thereof |
US11401441B2 (en) | 2017-08-17 | 2022-08-02 | Versum Materials Us, Llc | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications |
US10465096B2 (en) | 2017-08-24 | 2019-11-05 | Versum Materials Us, Llc | Metal chemical mechanical planarization (CMP) composition and methods therefore |
WO2019113005A1 (en) * | 2017-12-04 | 2019-06-13 | Chemtreat, Inc. | Methods and compositions for inhibiting corrosion on metal surfaces |
US11560533B2 (en) * | 2018-06-26 | 2023-01-24 | Versum Materials Us, Llc | Post chemical mechanical planarization (CMP) cleaning |
CN111378972A (en) * | 2018-12-29 | 2020-07-07 | 安集微电子(上海)有限公司 | Chemical mechanical polishing solution |
US20200277514A1 (en) | 2019-02-28 | 2020-09-03 | Versum Materials Us, Llc | Chemical Mechanical Polishing For Copper And Through Silicon Via Applications |
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CN110256968B (en) * | 2019-05-29 | 2021-01-01 | 湖南皓志科技股份有限公司 | Aluminum oxide polishing solution for copper polishing and preparation method thereof |
US11268025B2 (en) * | 2019-06-13 | 2022-03-08 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
US20220372332A1 (en) * | 2019-09-24 | 2022-11-24 | Versum Materials Us, Llc | With-In Die Non-Uniformities (WID-NU) In Planarization |
EP4038155A4 (en) * | 2019-09-30 | 2023-11-22 | Versum Materials US, LLC | Low dishing copper chemical mechanical planarization |
CN111235579A (en) * | 2019-12-31 | 2020-06-05 | 南方科技大学 | Metal polishing method |
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CN114855156A (en) * | 2022-05-09 | 2022-08-05 | 如皋市凯源电器设备有限公司 | Preparation process of corrosion-resistant conductive strip |
CN115449302A (en) * | 2022-09-20 | 2022-12-09 | 江西鑫铂瑞科技有限公司 | Use method of novel polishing solution for electrolytic copper foil cathode titanium roller |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010008828A1 (en) * | 2000-01-12 | 2001-07-19 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5332341B2 (en) * | 1973-03-27 | 1978-09-07 | ||
US4468339B1 (en) * | 1982-01-21 | 1989-05-16 | Aqueous compositions containing overbased materials | |
JP2781954B2 (en) * | 1994-03-04 | 1998-07-30 | メック株式会社 | Copper and copper alloy surface treatment agent |
US20020111024A1 (en) * | 1996-07-25 | 2002-08-15 | Small Robert J. | Chemical mechanical polishing compositions |
WO1998004646A1 (en) * | 1996-07-25 | 1998-02-05 | Ekc Technology, Inc. | Chemical mechanical polishing composition and process |
US5954997A (en) * | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6126853A (en) * | 1996-12-09 | 2000-10-03 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6099604A (en) * | 1997-08-21 | 2000-08-08 | Micron Technology, Inc. | Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto |
US6168508B1 (en) * | 1997-08-25 | 2001-01-02 | Lsi Logic Corporation | Polishing pad surface for improved process control |
US6068879A (en) * | 1997-08-26 | 2000-05-30 | Lsi Logic Corporation | Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing |
US6190237B1 (en) * | 1997-11-06 | 2001-02-20 | International Business Machines Corporation | pH-buffered slurry and use thereof for polishing |
JP4163785B2 (en) * | 1998-04-24 | 2008-10-08 | スピードファム株式会社 | Polishing composition and polishing method |
US6114215A (en) * | 1998-07-06 | 2000-09-05 | Lsi Logic Corporation | Generating non-planar topology on the surface of planar and near-planar substrates |
JP4095731B2 (en) | 1998-11-09 | 2008-06-04 | 株式会社ルネサステクノロジ | Semiconductor device manufacturing method and semiconductor device |
US6184141B1 (en) | 1998-11-24 | 2001-02-06 | Advanced Micro Devices, Inc. | Method for multiple phase polishing of a conductive layer in a semidonductor wafer |
JP4053165B2 (en) * | 1998-12-01 | 2008-02-27 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
EP1148538A4 (en) * | 1998-12-25 | 2009-10-21 | Hitachi Chemical Co Ltd | Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate |
JP2001015460A (en) | 1999-06-30 | 2001-01-19 | Toshiba Corp | Fabrication of semiconductor device |
US6159077A (en) * | 1999-07-30 | 2000-12-12 | Corning Incorporated | Colloidal silica polishing abrasive |
TW499471B (en) * | 1999-09-01 | 2002-08-21 | Eternal Chemical Co Ltd | Chemical mechanical/abrasive composition for semiconductor processing |
JP4505891B2 (en) | 1999-09-06 | 2010-07-21 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion used in the manufacture of semiconductor devices |
JP2001077060A (en) * | 1999-09-08 | 2001-03-23 | Toshiba Corp | Manufacture of semiconductor device |
DE19942984A1 (en) * | 1999-09-09 | 2001-03-15 | Schaeffler Waelzlager Ohg | Radial-axial bearing unit |
US6656842B2 (en) | 1999-09-22 | 2003-12-02 | Applied Materials, Inc. | Barrier layer buffing after Cu CMP |
JP3490038B2 (en) * | 1999-12-28 | 2004-01-26 | Necエレクトロニクス株式会社 | Metal wiring formation method |
JP2001187877A (en) * | 1999-12-28 | 2001-07-10 | Nec Corp | Slurry for chemical mechanical polishing |
JP2001269859A (en) | 2000-03-27 | 2001-10-02 | Jsr Corp | Aqueous dispersing element for polishing chemical machine |
JP4078787B2 (en) * | 2000-03-31 | 2008-04-23 | Jsr株式会社 | Aqueous dispersion for chemical mechanical polishing |
JP2002075927A (en) * | 2000-08-24 | 2002-03-15 | Fujimi Inc | Composition for polishing and polishing method using it |
US6551935B1 (en) * | 2000-08-31 | 2003-04-22 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
US6612911B2 (en) * | 2001-01-16 | 2003-09-02 | Cabot Microelectronics Corporation | Alkali metal-containing polishing system and method |
US6811470B2 (en) * | 2001-07-16 | 2004-11-02 | Applied Materials Inc. | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
US6805812B2 (en) | 2001-10-11 | 2004-10-19 | Cabot Microelectronics Corporation | Phosphono compound-containing polishing composition and method of using same |
KR100428787B1 (en) | 2001-11-28 | 2004-04-28 | 삼성전자주식회사 | Slurry supply appratus having a mixing unit at a point of use and a slurry storage unit |
US7132058B2 (en) * | 2002-01-24 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tungsten polishing solution |
US20030162398A1 (en) * | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
US6936543B2 (en) | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
US20070269987A1 (en) | 2003-05-09 | 2007-11-22 | Sanyo Chemical Industries, Ltd. | Polishing Liquid for Cmp Process and Polishing Method |
-
2002
- 2002-12-10 US US10/315,641 patent/US7300601B2/en not_active Expired - Lifetime
-
2003
- 2003-12-02 CN CNA2007101065751A patent/CN101085901A/en active Pending
- 2003-12-02 AU AU2003297590A patent/AU2003297590A1/en not_active Abandoned
- 2003-12-02 EP EP03812786A patent/EP1570015A4/en not_active Withdrawn
- 2003-12-02 CN CNB2003801085064A patent/CN1329467C/en not_active Expired - Lifetime
- 2003-12-02 WO PCT/US2003/038047 patent/WO2004053008A2/en not_active Application Discontinuation
- 2003-12-09 TW TW092134672A patent/TWI338711B/en not_active IP Right Cessation
-
2005
- 2005-04-28 US US11/117,274 patent/US7361603B2/en not_active Expired - Fee Related
- 2005-04-28 US US11/117,282 patent/US20050263490A1/en not_active Abandoned
-
2007
- 2007-04-10 US US11/733,410 patent/US20070181852A1/en not_active Abandoned
-
2008
- 2008-09-19 US US12/234,199 patent/US8236695B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010008828A1 (en) * | 2000-01-12 | 2001-07-19 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
Also Published As
Publication number | Publication date |
---|---|
US7300601B2 (en) | 2007-11-27 |
US20050263490A1 (en) | 2005-12-01 |
AU2003297590A1 (en) | 2004-06-30 |
EP1570015A4 (en) | 2006-01-25 |
EP1570015A2 (en) | 2005-09-07 |
CN101085901A (en) | 2007-12-12 |
US8236695B2 (en) | 2012-08-07 |
US20050255693A1 (en) | 2005-11-17 |
CN1735671A (en) | 2006-02-15 |
US20070181852A1 (en) | 2007-08-09 |
TWI338711B (en) | 2011-03-11 |
CN1329467C (en) | 2007-08-01 |
WO2004053008A2 (en) | 2004-06-24 |
AU2003297590A8 (en) | 2004-06-30 |
TW200417600A (en) | 2004-09-16 |
US20040108302A1 (en) | 2004-06-10 |
US20090137122A1 (en) | 2009-05-28 |
US7361603B2 (en) | 2008-04-22 |
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