WO2004052650A1 - Electrode structure and method of manufacture - Google Patents

Electrode structure and method of manufacture Download PDF

Info

Publication number
WO2004052650A1
WO2004052650A1 PCT/GB2003/005434 GB0305434W WO2004052650A1 WO 2004052650 A1 WO2004052650 A1 WO 2004052650A1 GB 0305434 W GB0305434 W GB 0305434W WO 2004052650 A1 WO2004052650 A1 WO 2004052650A1
Authority
WO
WIPO (PCT)
Prior art keywords
portions
electrically conductive
substrate
raised
pattern
Prior art date
Application number
PCT/GB2003/005434
Other languages
French (fr)
Inventor
Robert Keith Mellors
Original Assignee
Informatic Component Technology Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Informatic Component Technology Limited filed Critical Informatic Component Technology Limited
Priority to AU2003292416A priority Critical patent/AU2003292416A1/en
Publication of WO2004052650A1 publication Critical patent/WO2004052650A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Definitions

  • This invention concerns an electrode structure and method for the manufacture of the same, and relates more especially, but not exclusively, to an improved method for the manufacture of a charging electrode assembly for a continuous multi-jet ink jet printer.
  • Known charging electrodes for use in continuous ink jet printing comprise an insulating substrate upon which are provided individual electrodes and connecting leads in the form of a comb shaped structure, individual electrodes of which serve to effect programmed charging of ink droplets from corresponding jets of the printer, the charges applied selectively to ink droplets passing the charging electrode serving to control the pattern of printing, in known manner.
  • the electrodes and their connecting leads are provided by a metal that is plated onto a ceramic substrate, the form of the electrodes and connecting leads being defined by means of grooves machined into the ceramic substrate either before or after plating of the substrate with metal. Spaces between the electrodes are provided by removing plated metal from the substrate either during the machining of the aforementioned grooves, or in a subsequent finishing step.
  • an object of the present invention to provide an improved method for the formation of an electrode structure such as a charging electrode assembly for a continuous multi-jet ink jet printer.
  • the invention accordingly provides a method for the formation of an electrode structure comprising an insulating substrate bearing a raised pattern of electrically conductive electrodes, comprising the steps of providing an insulating substrate presenting at least one supporting surface for receiving electrodes, forming a structure comprising a body of electrically conductive material having portions raised therefrom in a predetermined pattern corresponding to a desired pattern of electrodes to be formed upon said supporting surface, bonding said raised portions of said body to said supporting surface and machining said body to remove at least a portion joining said raised portions, whereby residual portions of said body form the required electrode pattern.
  • a pattern of electrically conductive tracks is formed upon said surface, and said body is brought into a position such that individual raised portions of said body register with corresponding ones of said tracks.
  • the said bonding step may then include a first step in which terminal parts of said raised portions are joined with said conductive tracks and a second step in which opposed surfaces of said raised portions and said substrate are bonded together.
  • the method of the invention is applicable to the formation of an electrode structure on a single supporting surface of a substrate, a preferred embodiment of the invention particularly suitable for the formation of a charging electrode assembly for a continuous ink jet printer,
  • the said substrate may include two or more adjacent supporting surfaces, and the said body of electrically conductive material may be shaped so that the raised portions thereof fit against and extend around the respective supporting surfaces of the substrate.
  • the insulating substrate is a ceramic material such as alumina, and the body of electrically conductive material is formed of a compatible metal, such as titanium.
  • Figure 1 is a perspective view of an electrically insulating substrate provided with a pattern of electrically conductive tracks
  • Figure 2 is a perspective view of a body of electrically conductive material shaped to engage with the substrate of Figure 1 ,
  • Figure 3 is a perspective view showing an assembly formed by interengagement of the components shown in Figures 1 and 2, and
  • Figure 4 is a perspective view in diagrammatic form of a charging electrode structure formed from the assembly of Figure 3.
  • a substrate 1 formed of a ceramic material such as alumina, upon an upper surface of which is formed a pattern of electrically conductive tracks 2.
  • the electrically conductive tracks 2 may be formed of gold applied to the alumina substrate utilising known sputtering, electro plating and etching techniques.
  • the tracks 2 are intended for connection to electrodes of a charging electrode assembly for a continuous multi-jet ink jet printer.
  • Figure 1 shows only several conductive tracks 2, it will be appreciated that the number and pitch of the conductor tracks will correspond with the number and pitch of the ink jets in a conventional multi- jet printer.
  • such an electrode assembly might include a pattern of 250 electrodes at a pitch of 0.2 mm.
  • the substrate 1 defines a front edge 1A for supporting electrodes to be connected to the tracks 2, upper and lower corners of the front edge 1A being chamfered as indicated at 3.
  • Ends of the conductive tracks 2 adjacent the front edge 1A of the substrate are provided with small gold bumps 4 for the purpose to be described below.
  • a body 5 of electrically conductive material preferably a metal such as a titanium alloy having an appropriate hardness and a coefficient of expansion matching that of the substrate 1.
  • the body 5 comprises a base portion 5A the rearward edge of which as viewed in the drawing has a recess defined by surfaces 5B, 5C and 5D that are so dimensioned that the body 5 can be assembled with the substrate 1 of Figure 1 with the surface 5c fitting closely against the front edge 1A, and the surfaces 5B and 5D fitting against the lower and upper surfaces of the substrate.
  • the rearward portion of the body 5 is provided with a multiplicity of vertically extending slits 6 that are formed at a pitch corresponding with that of the tracks 2 shown in Figure 1 , such that residual comb portions 7 of the body 5 can be positioned to overly and register with the tracks 2.
  • the depth of the slits 6 in the plane of the upper surface of the body 5 as viewed in Figure 2 exceeds the dimension of the surface 5D, so that the slits 6 extend as grooves in the surface 5C.
  • Figure 3 shows an assembly formed by interengagement of the substrate
  • the chamfered corners 3 ensure that there is no interference with the fit between the body 5 and the substrate 1 owing to machining tolerances at the corners defined between the surfaces 5B, 5C and 5D.
  • the surfaces 5B, 5C and 5D of the body 5 Prior to assembly of the components 1 and 5, the surfaces 5B, 5C and 5D of the body 5 are provided with a thin sputtered layer of gold to assist bonding between the components. Initially the comb portions 7 are bonded to the tracks
  • bump bonding technique as known to one skilled in the art of flip-chip processing.
  • a suitable amount of heat and pressure is applied so that the bumps 4 on the tracks 2 are flattened and a metal to metal cold weld is achieved.
  • the remainder of the body 5 is then also bonded to the substrate 1 at the surfaces 5B, 5C and 5D, for example by utilising known resin bonding techniques.
  • the body 5 is machined to remove the major part of the body 5 and leave only isolated individual portions 8 bounding the surfaces 5B, 5C and 5D.
  • the isolated portions 8 thus serve to form the required electrodes of the charging electrode assembly and may be lapped down, for example, to a nominal thickness of 25 microns.
  • the finished electrode assembly can then be wire bonded to the conventional flexicircuit, as required, via the tracks 2.
  • the method of the invention according to the preferred embodiment as described above has significant advantages over known techniques for the formation of charging electrodes.
  • the fact that the machining required to form the electrodes of the assembly can be effected by machining of the metal body 5 rather than the ceramic substrate 1 enables greater accuracy to be achieved, with a potential for higher density printing than can be achieved in the known arrangements.
  • the electrodes 8 may be formed from a material having characteristics that are superior to those of metals that are capable of being plated onto a ceramic substrate.

Abstract

A method is provided for the formation of an electrode structure comprising an insulating substrate (1) bearing a raised pattern of electrically conductive electrodes. A structure comprising a body (5) of electrically conductive material having portions raised therefrom is formed. The raised portions of the body are bonded to the surface of the insulating substrate (1). The body is machined to remove at least the portion underlying the raised portions, whereby residual portions (8) of the body form the required electrode pattern.

Description

ELECTRODE STRUCTURE AND METHOD OF MANUFACTURE
This invention concerns an electrode structure and method for the manufacture of the same, and relates more especially, but not exclusively, to an improved method for the manufacture of a charging electrode assembly for a continuous multi-jet ink jet printer.
Known charging electrodes for use in continuous ink jet printing comprise an insulating substrate upon which are provided individual electrodes and connecting leads in the form of a comb shaped structure, individual electrodes of which serve to effect programmed charging of ink droplets from corresponding jets of the printer, the charges applied selectively to ink droplets passing the charging electrode serving to control the pattern of printing, in known manner.
Examples of such charging electrodes and methods for the formation thereof are disclosed in US-A-5,561 ,452. In such hitherto known methods, the electrodes and their connecting leads are provided by a metal that is plated onto a ceramic substrate, the form of the electrodes and connecting leads being defined by means of grooves machined into the ceramic substrate either before or after plating of the substrate with metal. Spaces between the electrodes are provided by removing plated metal from the substrate either during the machining of the aforementioned grooves, or in a subsequent finishing step.
In the hitherto known methods, the requirement for precision machining of a ceramic substrate to define the form of the electrodes and the fact that the electrodes must necessarily be formed from a metal capable of being plated onto the substrate, have attendant disadvantages.
Accordingly, it is an object of the present invention to provide an improved method for the formation of an electrode structure such as a charging electrode assembly for a continuous multi-jet ink jet printer.
The invention accordingly provides a method for the formation of an electrode structure comprising an insulating substrate bearing a raised pattern of electrically conductive electrodes, comprising the steps of providing an insulating substrate presenting at least one supporting surface for receiving electrodes, forming a structure comprising a body of electrically conductive material having portions raised therefrom in a predetermined pattern corresponding to a desired pattern of electrodes to be formed upon said supporting surface, bonding said raised portions of said body to said supporting surface and machining said body to remove at least a portion joining said raised portions, whereby residual portions of said body form the required electrode pattern.
Advantageously, prior to the bonding of said body to said supporting surface a pattern of electrically conductive tracks is formed upon said surface, and said body is brought into a position such that individual raised portions of said body register with corresponding ones of said tracks. The said bonding step may then include a first step in which terminal parts of said raised portions are joined with said conductive tracks and a second step in which opposed surfaces of said raised portions and said substrate are bonded together.
Whilst the method of the invention is applicable to the formation of an electrode structure on a single supporting surface of a substrate, a preferred embodiment of the invention particularly suitable for the formation of a charging electrode assembly for a continuous ink jet printer, the said substrate may include two or more adjacent supporting surfaces, and the said body of electrically conductive material may be shaped so that the raised portions thereof fit against and extend around the respective supporting surfaces of the substrate.
Preferably, the insulating substrate is a ceramic material such as alumina, and the body of electrically conductive material is formed of a compatible metal, such as titanium.
The invention is illustrated by way of example in the accompanying drawings, in which:
Figure 1 is a perspective view of an electrically insulating substrate provided with a pattern of electrically conductive tracks, Figure 2 is a perspective view of a body of electrically conductive material shaped to engage with the substrate of Figure 1 ,
Figure 3 is a perspective view showing an assembly formed by interengagement of the components shown in Figures 1 and 2, and
Figure 4 is a perspective view in diagrammatic form of a charging electrode structure formed from the assembly of Figure 3.
Referring to Figure 1 , there is shown a substrate 1 formed of a ceramic material such as alumina, upon an upper surface of which is formed a pattern of electrically conductive tracks 2. The electrically conductive tracks 2 may be formed of gold applied to the alumina substrate utilising known sputtering, electro plating and etching techniques. The tracks 2 are intended for connection to electrodes of a charging electrode assembly for a continuous multi-jet ink jet printer. Although for the sake of clarity Figure 1 shows only several conductive tracks 2, it will be appreciated that the number and pitch of the conductor tracks will correspond with the number and pitch of the ink jets in a conventional multi- jet printer. For example, such an electrode assembly might include a pattern of 250 electrodes at a pitch of 0.2 mm.
The substrate 1 defines a front edge 1A for supporting electrodes to be connected to the tracks 2, upper and lower corners of the front edge 1A being chamfered as indicated at 3.
Ends of the conductive tracks 2 adjacent the front edge 1A of the substrate are provided with small gold bumps 4 for the purpose to be described below.
Referring to Figure 2, there is shown a body 5 of electrically conductive material, preferably a metal such as a titanium alloy having an appropriate hardness and a coefficient of expansion matching that of the substrate 1. The body 5 comprises a base portion 5A the rearward edge of which as viewed in the drawing has a recess defined by surfaces 5B, 5C and 5D that are so dimensioned that the body 5 can be assembled with the substrate 1 of Figure 1 with the surface 5c fitting closely against the front edge 1A, and the surfaces 5B and 5D fitting against the lower and upper surfaces of the substrate. The rearward portion of the body 5 is provided with a multiplicity of vertically extending slits 6 that are formed at a pitch corresponding with that of the tracks 2 shown in Figure 1 , such that residual comb portions 7 of the body 5 can be positioned to overly and register with the tracks 2. Although not clearly shown in Figure 2, the depth of the slits 6 in the plane of the upper surface of the body 5 as viewed in Figure 2 exceeds the dimension of the surface 5D, so that the slits 6 extend as grooves in the surface 5C.
Figure 3 shows an assembly formed by interengagement of the substrate
1 and body 5, the comb portions 7 overlying the tracks 2 and the surface 5c abutting closely against the front edge 1A of the substrate 1. The chamfered corners 3 ensure that there is no interference with the fit between the body 5 and the substrate 1 owing to machining tolerances at the corners defined between the surfaces 5B, 5C and 5D.
Prior to assembly of the components 1 and 5, the surfaces 5B, 5C and 5D of the body 5 are provided with a thin sputtered layer of gold to assist bonding between the components. Initially the comb portions 7 are bonded to the tracks
2 using a so called bump bonding technique as known to one skilled in the art of flip-chip processing. A suitable amount of heat and pressure is applied so that the bumps 4 on the tracks 2 are flattened and a metal to metal cold weld is achieved. The remainder of the body 5 is then also bonded to the substrate 1 at the surfaces 5B, 5C and 5D, for example by utilising known resin bonding techniques.
Following the bonding of the components shown in Figure 3, the body 5 is machined to remove the major part of the body 5 and leave only isolated individual portions 8 bounding the surfaces 5B, 5C and 5D. The isolated portions 8 thus serve to form the required electrodes of the charging electrode assembly and may be lapped down, for example, to a nominal thickness of 25 microns. The finished electrode assembly can then be wire bonded to the conventional flexicircuit, as required, via the tracks 2.
It will be appreciated that the method of the invention according to the preferred embodiment as described above has significant advantages over known techniques for the formation of charging electrodes. Thus, the fact that the machining required to form the electrodes of the assembly can be effected by machining of the metal body 5 rather than the ceramic substrate 1 enables greater accuracy to be achieved, with a potential for higher density printing than can be achieved in the known arrangements. Moreover, the electrodes 8 may be formed from a material having characteristics that are superior to those of metals that are capable of being plated onto a ceramic substrate.

Claims

1. A method for the formation of an electrode structure comprising an insulating substrate bearing a raised pattern of electrically conductive electrodes, comprising the steps of providing an insulating substrate presenting at least one supporting surface for receiving electrodes, forming a structure comprising a body of electrically conductive material having portions raised therefrom in a predetermined pattern corresponding to a desired pattern of electrodes to be formed upon said supporting surface, bonding said raised portions of said body to said supporting surface and machining said body to remove at least the portion underlying said raised portions, whereby residual portions of said body form the required'electrode pattern.
2. A method according to claim 1 , wherein prior to the bonding of said body to said supporting surface a pattern of electrically conductive tracks is formed upon said surface, and said body is brought into a position such that individual raised portions of said body register with corresponding ones of said tracks.
3. A method according to claim 2, wherein said bonding step includes a first step in which terminal parts of said raised portions are joined with said conductive tracks and a second step in which opposed surfaces of said raised portions and said substrate are bonded together.
4. A method according to any one of claims 1-3, wherein said substrate includes at least two adjacent supporting surfaces and raised portions of said body are shaped to extend over said adjacent supporting surfaces.
5. A method according to any one of claims 1-4, wherein said insulating substrate is formed of a ceramic material.
6. A method according to claim 5, wherein said ceramic material is alumina.
7. A method according to any one of claims 1-6, wherein said body of electrically conductive material is formed of a metal.
8. A method according to claim 7, wherein said metal is titanium.
9. An electrode structure when formed by the method of any one of claims 1-8.
10. A charging electrode assembly for a continuous ink jet printer, when formed by the method of any one of claims 1-8.
PCT/GB2003/005434 2002-12-12 2003-12-11 Electrode structure and method of manufacture WO2004052650A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003292416A AU2003292416A1 (en) 2002-12-12 2003-12-11 Electrode structure and method of manufacture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0228992.4 2002-12-12
GB0228992A GB2396257B (en) 2002-12-12 2002-12-12 Electrode structure and method of manufacture

Publications (1)

Publication Number Publication Date
WO2004052650A1 true WO2004052650A1 (en) 2004-06-24

Family

ID=9949567

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2003/005434 WO2004052650A1 (en) 2002-12-12 2003-12-11 Electrode structure and method of manufacture

Country Status (3)

Country Link
AU (1) AU2003292416A1 (en)
GB (1) GB2396257B (en)
WO (1) WO2004052650A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4223321A (en) * 1979-04-30 1980-09-16 The Mead Corporation Planar-faced electrode for ink jet printer and method of manufacture
JPS55128473A (en) * 1979-03-29 1980-10-04 Fuji Xerox Co Ltd Preparing method for electrode electrifying ink drip
JPS58108168A (en) * 1981-12-23 1983-06-28 Ricoh Co Ltd Ink jet recorder
US4419674A (en) * 1982-02-12 1983-12-06 Mead Corporation Wire wound flat-faced charge plate
US4636808A (en) * 1985-09-09 1987-01-13 Eastman Kodak Company Continuous ink jet printer
US4651163A (en) * 1985-05-20 1987-03-17 Burlington Industries, Inc. Woven-fabric electrode for ink jet printer
US4928116A (en) * 1988-10-31 1990-05-22 Eastman Kodak Company Ink jet printer having improved print head heater construction
US5512117A (en) * 1992-05-29 1996-04-30 Scitex Digital Printing, Inc. Charge plate fabrication process
US5561452A (en) 1989-01-12 1996-10-01 Videojet Systems International, Inc. Continuous ink jet printing electrode assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4091125A (en) * 1976-11-08 1978-05-23 Delgadillo Joseph A Circuit board and method for producing same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128473A (en) * 1979-03-29 1980-10-04 Fuji Xerox Co Ltd Preparing method for electrode electrifying ink drip
US4223321A (en) * 1979-04-30 1980-09-16 The Mead Corporation Planar-faced electrode for ink jet printer and method of manufacture
JPS58108168A (en) * 1981-12-23 1983-06-28 Ricoh Co Ltd Ink jet recorder
US4419674A (en) * 1982-02-12 1983-12-06 Mead Corporation Wire wound flat-faced charge plate
US4651163A (en) * 1985-05-20 1987-03-17 Burlington Industries, Inc. Woven-fabric electrode for ink jet printer
US4636808A (en) * 1985-09-09 1987-01-13 Eastman Kodak Company Continuous ink jet printer
US4928116A (en) * 1988-10-31 1990-05-22 Eastman Kodak Company Ink jet printer having improved print head heater construction
US5561452A (en) 1989-01-12 1996-10-01 Videojet Systems International, Inc. Continuous ink jet printing electrode assembly
US5512117A (en) * 1992-05-29 1996-04-30 Scitex Digital Printing, Inc. Charge plate fabrication process

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 004, no. 179 (M - 046) 11 December 1980 (1980-12-11) *
PATENT ABSTRACTS OF JAPAN vol. 007, no. 215 (M - 244) 22 September 1983 (1983-09-22) *

Also Published As

Publication number Publication date
GB2396257A (en) 2004-06-16
AU2003292416A1 (en) 2004-06-30
GB2396257B (en) 2005-11-23
GB0228992D0 (en) 2003-01-15

Similar Documents

Publication Publication Date Title
US5821494A (en) Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
EP0321075B1 (en) Integrated thermal ink jet printhead and method of manufacturing
KR100279036B1 (en) Method of forming raised metallic contacts on electrical circuits for permanent bonding
EP1202390B1 (en) An electronic component and a method of manufacturing the same
AU737697B2 (en) Method for making a transponder coil and transponder produced by this method
JP4074751B2 (en) Electronic components
WO2004052650A1 (en) Electrode structure and method of manufacture
EP2417842B1 (en) Conductor grid for electronic housings and manufacturing method
KR20030034214A (en) Droplet deposition apparatus
EP1445999B1 (en) A method of providing a PWB with a shield can and a PWB therefor
JPH07263496A (en) Bonding tool
US7354797B2 (en) Method for producing a plurality of electronic devices
JPH0553281B2 (en)
JP3460410B2 (en) Metal lead with bump and method of manufacturing the same
US6376362B1 (en) Production of semiconductor device
EP0876661B1 (en) Magnetic head having an integrated circuit and method of manufacturing same
US6399895B1 (en) Component hybridizing system allowing for defective planarity
JP4599388B2 (en) Electronic component and its manufacturing method
JP2775718B2 (en) Chip resistor and manufacturing method thereof
JP3282893B2 (en) Method of forming bump electrodes on ceramic substrate
US6500528B1 (en) Enhancements in sheet processing and lead formation
JPH08203909A (en) Bump forming method of semiconductor device
JP2968370B2 (en) Manufacturing method of intermediate board for mounting circuit parts
JPH03262141A (en) Lead with bump
JP2004039780A (en) Electrode unit joining method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP