WO2004040620A2 - Method and apparatus for implementing measurement or instrumentation on production equipment - Google Patents

Method and apparatus for implementing measurement or instrumentation on production equipment Download PDF

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Publication number
WO2004040620A2
WO2004040620A2 PCT/US2003/033715 US0333715W WO2004040620A2 WO 2004040620 A2 WO2004040620 A2 WO 2004040620A2 US 0333715 W US0333715 W US 0333715W WO 2004040620 A2 WO2004040620 A2 WO 2004040620A2
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WO
WIPO (PCT)
Prior art keywords
module
enclosure
interface
frame
equipment
Prior art date
Application number
PCT/US2003/033715
Other languages
French (fr)
Other versions
WO2004040620A3 (en
Inventor
Keith Pearson
Original Assignee
Keith Pearson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keith Pearson filed Critical Keith Pearson
Priority to AU2003286648A priority Critical patent/AU2003286648A1/en
Publication of WO2004040620A2 publication Critical patent/WO2004040620A2/en
Publication of WO2004040620A3 publication Critical patent/WO2004040620A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • the present invention relates generally to production equipment and more particularly to a method and apparatus for implementing measurement instrumentation on production equipment.
  • a module for use in a process tool comprising an enclosure for housing a device to be tested; and a frame coupled to the enclosure.
  • the frame includes a standard interface to the process tool and a kinematic interface to the enclosure to facilitate repeatable and high accuracy docking of the enclosure.
  • These could be inspection components, measurement devices or other forms of instrumentation that are used for gathering information and/or analyzing data.
  • the equipment could be used for, but not limited to, the fabrication of substrates, including semiconductor devices, reticles, and other products.
  • FIG. 1 illustrates a standard integrated module (SIM) assembly in accordance with the present invention.
  • FIG. 2 is an exploded view of the SIM assembly in accordance with the present
  • the SIM comprises an enclosure and a frame.
  • Figure 3 illustrates a front view of the SIM enclosure in accordance with the present invention.
  • Figure 4 illustrates an interior perspective of the front view of the SIM enclosure illustrated in Figure 3.
  • Figure 5 illustrates a side view of the SIM assembly in accordance with the present invention.
  • Figure 6 is an interior perspective of the side view of the SIM assembly illustrated in Figure 5.
  • Figure 7 illustrates a bottom view of the SIM assembly in accordance with the present invention.
  • Figure 8 illustrates the front view of the frame of the SIM assembly in accordance with the present invention.
  • Figure 9 illustrates a back view of the frame.
  • FIG 10 illustrates the SIM assembly installed on an equipment front end module (EFEM).
  • EFEM equipment front end module
  • Figure 11 illustrates the internal air path across the substrate.
  • Figure 12 illustrates the internal air path for cooling the electronics and other equipment.
  • Figure 13 illustrates the kinematic interface on the frame.
  • Figure 14 illustrates a cone or V groove as a connector for the module.
  • Figure 15 illustrates a flat surface as a connector for the module.
  • the present invention relates generally to production equipment and more particularly to a method and apparatus for implementing measurement or instrumentation on production equipment.
  • the following description is presented to enable one of ordinary skill in the art to make and use the invention and is provided in the context of a patent application and its requirements.
  • Various modifications to the preferred embodiment and the generic principles and features described herein will be readily apparent to those skilled in the art.
  • the present invention is not intended to be limited to the embodiment shown but is to be accorded the widest scope consistent with the principles and features described herein.
  • a system and method in accordance with the present invention comprises a standard integrated module (SIM) for integrating equipment and instrumentation systems onto a process tool's Equipment Front End Module (EFEM) through a standard BOLTS interface such as a BOLTS interface.
  • the SDVI comprises a kinematic docking frame, quick access panels for easy integration and servicing; space for mounting equipment, and flexible support for integrating a wide range of measurement and other equipment.
  • the SIM provides a simple "Plug-N-Play" approach to developing and implementing measurement modules for both the OEM and end user.
  • the common platform architecture of the SIM supports a wide range of equipment and applications. Its standard physical package, interface, and facilities provide a simple and straight-forward solution for end users, while providing the OEM the flexibility to customize the internal design to fit their products and applications.
  • the standard integrated module in accordance with the present invention can be attached to the standard load port interfaces found on the semiconductor industry EFEMs (Equipment Front End Modules).
  • EFEMs Equipment Front End Modules
  • a method for attaching measurement or instrumentation devices to research and development, laboratory or production equipment is disclosed.
  • the measurement or instrumentation devices could be, but are not limited to, inspection components, measurement devices or other forms of instrumentation that are used for gathering information and/or analyzing data.
  • the equipment could be used for, but not limited to, the fabrication or processing of substrates, including semiconductor devices, reticles, and other products.
  • the enclosure 102 in a preferred embodiment of the present invention is a fabricated unit that houses the measurement or instrumentation device along with electronic or support modules.
  • the enclosure 102 provides separate environments for the substrate and the equipment in the module. Cooling air for the electronics and other equipment in the module is isolated from the area around the substrate.
  • Frame 104
  • Figure 8 illustrates a front view of the frame 104 of the SIM assembly in accordance with the present invention.
  • the frame 104 attaches to a vertical surface on the assembly.
  • the size, shape, and hole locations on the frame 104 correspond to the mounting hole pattern of a standard interface such as a BOLTS interface typically found on a semiconductor process tool.
  • the frame 104 allows the enclosure 102 to be easily and quickly attached and removed from the equipment.
  • Figure 9 illustrates a back view of the frame 104 as is seen.
  • An opening 902 is provided for wafer transfer and for a clean air path.
  • Ethernet connections 904 are provided for communications.
  • Signal and interface connections 906 are provided for control.
  • a connector 908 allows for a power connection.
  • FIG 10 illustrates the SIM assembly installed on an equipment front end module (EFEM) 1002.
  • An EFEM 1002 is usually found on process and metrology or measurement tools.
  • the EFEM 1002 typically include a robot, FOUP or SMIF load ports (a 300 MM FOUP load port 1004 is shown in Figure 10), and a mini-environment for keeping the substrates clean.
  • the function of the EFEM 1002 is to transfer the substrates from their SMIF or FOUP carriers into the various modules or locations in the tool.
  • Load ports 1004 attach to the EFEM 1002 through a SEMI standards physical interface called BOLTS.
  • the SIM assembly features an air handling design that incorporates an isolated air flow path for a substrate and ducts in the panel to direct the heated air into the exhaust.
  • Figure 11 illustrates the internal air path across the substrate 1102.
  • This isolated air path from the EFEM 1002 through the equipment maintains a clean, controlled environment for the substrate 1102.
  • clean air enters in through an opening in a SIM panel 1104 from the EFEM 1002.
  • the air travels across the substrate 1102 that is located on the instrument module's stage or chuck.
  • the air then exits out of the SIM assembly through openings 1106 on the outside panel.
  • This isolated air path keeps the substrate 1102 in a clean environment and minimizes exposure to contamination.
  • FIG 12 illustrates the internal air path for cooling the electronics and other equipment.
  • Fans 1202 draw the heated air from the electronics and equipment and direct the air down the ducts 1204 in a side panel 1206.
  • the frame 104 includes a kinematic interface to the enclosure that consists of three spherical contact points 1302 and their mating components 1304, 1306, 1308.
  • the spherical contact points may include tooling balls, canoe balls, or similar devices with spherical shapes.
  • the mating components are usually machined parts that have features, which may include grooves, cones, and flat surfaces. The purpose of the interface is to consistently provide an accurate physical relationship between the frame and the enclosure.
  • Figure 13 illustrates the kinematic interface on the frame 104.
  • the kinematic interface allows the SIM enclosure to be easily removed and then re-installed with precision and reliability. It usually consists of three balls or spherical shaped objects and either three machined groove features or a cone, groove and flat machined features.
  • Figure 14 illustrates a cone or N groove as a connector for the module.
  • Figure 15 illustrates a flat surface as a connector for the module.
  • the standard integrated module in accordance with the present invention can be attached to the standard load port interfaces found on the semiconductor industry EFEMs,
  • Utilization of the SIM in accordance with the present invention will relieve the integrated module from having to develop a solution in house and allow them to concentrate on their core business.

Abstract

A module for use in a process tool is disclosed. The module comprising an enclosure for housing a device to be tested; and a frame coupled to the enclosure. The frame includes a standard interface to the process tool and a kinematic interface to the enclosure to facilitate repeatable and high accuracy docking of the enclosure. These could be inspection components, measurement devices or other forms of instrumentation that are used for gathering information and/or analyzing data. The equipment could be used for, but not limited to, the fabrication of substrates, including semiconductor devices, reticles, and other products.

Description

METHOD AND APPARATUS FOR IMPLEMENTING MEASUREMENT OR INSTRUMENTATION ON PRODUCTION EQUIPMENT
FIELD OF THE INVENTION
The present invention relates generally to production equipment and more particularly to a method and apparatus for implementing measurement instrumentation on production equipment.
BACKGROUND OF THE INVENTION
The current practice in the semiconductor industry is to have a stand-alone metrology or inspection tool along with the process tools inside of a fab. Recent technology developments in instrumentation and metrology have driven down the size of this equipment. The trend is for process tool equipment makers to incorporate these new smaller inspection and metrology modules inside of their equipment. This provides a faster and tighter "closing the loop" on process tool performance while lowering overall costs.
There are limitations to this approach. One is that process tool OEMs are usually limited to offering only one integrated metrology solution on their equipment. The second is the high cost and lengthy development time of designing in a metrology module into their tool.
SUMMARY OF THE INVENTION
A module for use in a process tool is disclosed. The module comprising an enclosure for housing a device to be tested; and a frame coupled to the enclosure. The frame includes a standard interface to the process tool and a kinematic interface to the enclosure to facilitate repeatable and high accuracy docking of the enclosure. These could be inspection components, measurement devices or other forms of instrumentation that are used for gathering information and/or analyzing data. The equipment could be used for, but not limited to, the fabrication of substrates, including semiconductor devices, reticles, and other products.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 illustrates a standard integrated module (SIM) assembly in accordance with the present invention.
Figure 2 is an exploded view of the SIM assembly in accordance with the present
invention. As is seen, the SIM comprises an enclosure and a frame.
Figure 3 illustrates a front view of the SIM enclosure in accordance with the present invention.
Figure 4 illustrates an interior perspective of the front view of the SIM enclosure illustrated in Figure 3. Figure 5 illustrates a side view of the SIM assembly in accordance with the present invention.
Figure 6 is an interior perspective of the side view of the SIM assembly illustrated in Figure 5.
Figure 7 illustrates a bottom view of the SIM assembly in accordance with the present invention.
Figure 8 illustrates the front view of the frame of the SIM assembly in accordance with the present invention.
Figure 9 illustrates a back view of the frame.
Figure 10 illustrates the SIM assembly installed on an equipment front end module (EFEM).
Figure 11 illustrates the internal air path across the substrate.
Figure 12 illustrates the internal air path for cooling the electronics and other equipment. Figure 13 illustrates the kinematic interface on the frame.
Figure 14 illustrates a cone or V groove as a connector for the module.
Figure 15 illustrates a flat surface as a connector for the module.
DETAILED DESCRIPTION The present invention relates generally to production equipment and more particularly to a method and apparatus for implementing measurement or instrumentation on production equipment. The following description is presented to enable one of ordinary skill in the art to make and use the invention and is provided in the context of a patent application and its requirements. Various modifications to the preferred embodiment and the generic principles and features described herein will be readily apparent to those skilled in the art. Thus, the present invention is not intended to be limited to the embodiment shown but is to be accorded the widest scope consistent with the principles and features described herein.
A system and method in accordance with the present invention comprises a standard integrated module (SIM) for integrating equipment and instrumentation systems onto a process tool's Equipment Front End Module (EFEM) through a standard BOLTS interface such as a BOLTS interface. The SDVI comprises a kinematic docking frame, quick access panels for easy integration and servicing; space for mounting equipment, and flexible support for integrating a wide range of measurement and other equipment. The SIM provides a simple "Plug-N-Play" approach to developing and implementing measurement modules for both the OEM and end user. The common platform architecture of the SIM supports a wide range of equipment and applications. Its standard physical package, interface, and facilities provide a simple and straight-forward solution for end users, while providing the OEM the flexibility to customize the internal design to fit their products and applications.
The standard integrated module in accordance with the present invention can be attached to the standard load port interfaces found on the semiconductor industry EFEMs (Equipment Front End Modules). A method for attaching measurement or instrumentation devices to research and development, laboratory or production equipment is disclosed. The measurement or instrumentation devices could be, but are not limited to, inspection components, measurement devices or other forms of instrumentation that are used for gathering information and/or analyzing data. The equipment could be used for, but not limited to, the fabrication or processing of substrates, including semiconductor devices, reticles, and other products.
Enclosure 102
The enclosure 102 in a preferred embodiment of the present invention is a fabricated unit that houses the measurement or instrumentation device along with electronic or support modules. The enclosure 102 provides separate environments for the substrate and the equipment in the module. Cooling air for the electronics and other equipment in the module is isolated from the area around the substrate. Frame 104
Figure 8 illustrates a front view of the frame 104 of the SIM assembly in accordance with the present invention. The frame 104 attaches to a vertical surface on the assembly. The size, shape, and hole locations on the frame 104 correspond to the mounting hole pattern of a standard interface such as a BOLTS interface typically found on a semiconductor process tool. The frame 104 allows the enclosure 102 to be easily and quickly attached and removed from the equipment.
Figure 9 illustrates a back view of the frame 104 as is seen. An opening 902 is provided for wafer transfer and for a clean air path. Ethernet connections 904 are provided for communications. Signal and interface connections 906 are provided for control. A connector 908 allows for a power connection.
SIM Installed on an EFEM
Figure 10 illustrates the SIM assembly installed on an equipment front end module (EFEM) 1002. An EFEM 1002 is usually found on process and metrology or measurement tools. The EFEM 1002 typically include a robot, FOUP or SMIF load ports (a 300 MM FOUP load port 1004 is shown in Figure 10), and a mini-environment for keeping the substrates clean. The function of the EFEM 1002 is to transfer the substrates from their SMIF or FOUP carriers into the various modules or locations in the tool. Load ports 1004 attach to the EFEM 1002 through a SEMI standards physical interface called BOLTS.
The SIM assembly features an air handling design that incorporates an isolated air flow path for a substrate and ducts in the panel to direct the heated air into the exhaust. There are two separate air environments inside the SLM assembly. One environment is for cooling the electronics and other equipment and the other provides a clean environment for the substrate.
Figure 11 illustrates the internal air path across the substrate 1102. This isolated air path from the EFEM 1002 through the equipment maintains a clean, controlled environment for the substrate 1102. For the substrate environment, clean air enters in through an opening in a SIM panel 1104 from the EFEM 1002. The air travels across the substrate 1102 that is located on the instrument module's stage or chuck. The air then exits out of the SIM assembly through openings 1106 on the outside panel. This isolated air path keeps the substrate 1102 in a clean environment and minimizes exposure to contamination.
Figure 12 illustrates the internal air path for cooling the electronics and other equipment. Fans 1202 draw the heated air from the electronics and equipment and direct the air down the ducts 1204 in a side panel 1206.
Kinematic Interface
The frame 104 includes a kinematic interface to the enclosure that consists of three spherical contact points 1302 and their mating components 1304, 1306, 1308. The spherical contact points may include tooling balls, canoe balls, or similar devices with spherical shapes. The mating components are usually machined parts that have features, which may include grooves, cones, and flat surfaces. The purpose of the interface is to consistently provide an accurate physical relationship between the frame and the enclosure.
Figure 13 illustrates the kinematic interface on the frame 104. The kinematic interface allows the SIM enclosure to be easily removed and then re-installed with precision and reliability. It usually consists of three balls or spherical shaped objects and either three machined groove features or a cone, groove and flat machined features. Figure 14 illustrates a cone or N groove as a connector for the module. Figure 15 illustrates a flat surface as a connector for the module.
Advantages / Benefits
The standard integrated module in accordance with the present invention can be attached to the standard load port interfaces found on the semiconductor industry EFEMs,
thus providing two benefits:
1. Utilization of the SIM in accordance with the present invention will relieve the integrated module from having to develop a solution in house and allow them to concentrate on their core business.
2. Through utilization of the SIM in accordance with the present invention, end users can have a physical "plug and play" approach to testing and adopting different technologies in their fabrication for different processes.
Although the present invention has been described in accordance with the embodiments shown, one of ordinary skill in the art will readily recognize that there could be variations to the embodiments and those variations would be within the spirit and scope of the present invention. Accordingly, many modifications may be made by one of ordinary skill in the art without departing from the spirit and scope of the appended claims.

Claims

CLAIMSWhat is claimed is:
1. A module for use in a process tool comprising: an enclosure for housing a device to be tested; and a frame coupled to the enclosure, the frame including a standard interface to the process tool and a kinematic interface to the enclosure to facilitate, repeatable and high accuracy docking of the enclosure.
2. The module of claim 1 , wherein the standard interface comprises a BOLTS interface.
3. The module of claim 1 , wherein the process tool comprises an equipment front end module (EFEM).
4. The module of claim 2, wherein the kinematic interface comprises: a plurality of spherical shaped objects on the frame which engage a plurality of machined features on the enclosure.
5. The module of claim 4, wherein the machined features comprises a cone, groove or flat machined features.
6. The module of claim 1 , wherein the enclosure includes first an internal air path to keep a substrate located therein substantially clean.
7. The module of claim 6, wherein the enclosure includes: a second internal air path to cool electronics via the use of fans to draw heat air from the electronics out of the enclosure via ducts.
8. The module of claim 1 , wherein the enclosure includes fan modules for removing hot air from the module.
9. The module of claim 8. wherein the enclosure includes an exhaust vent.
PCT/US2003/033715 2002-10-25 2003-10-24 Method and apparatus for implementing measurement or instrumentation on production equipment WO2004040620A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003286648A AU2003286648A1 (en) 2002-10-25 2003-10-24 Method and apparatus for implementing measurement or instrumentation on production equipment

Applications Claiming Priority (4)

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US42126802P 2002-10-25 2002-10-25
US60/421,268 2002-10-25
US10/693,170 US20040090152A1 (en) 2002-10-25 2003-10-23 Method and apparatus for implementing measurement or instrumentation on production equipment
US10/693,170 2003-10-23

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WO2004040620A2 true WO2004040620A2 (en) 2004-05-13
WO2004040620A3 WO2004040620A3 (en) 2009-08-27

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US5733024A (en) * 1995-09-13 1998-03-31 Silicon Valley Group, Inc. Modular system
US6134107A (en) * 1998-10-19 2000-10-17 International Business Machines Corporation Reverse convective airflow cooling of computer enclosure
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6193339B1 (en) * 1999-04-12 2001-02-27 Inclose Design, Inc. Docking adapter for memory storage devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US5733024A (en) * 1995-09-13 1998-03-31 Silicon Valley Group, Inc. Modular system
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6134107A (en) * 1998-10-19 2000-10-17 International Business Machines Corporation Reverse convective airflow cooling of computer enclosure
US6193339B1 (en) * 1999-04-12 2001-02-27 Inclose Design, Inc. Docking adapter for memory storage devices
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications

Also Published As

Publication number Publication date
US20040090152A1 (en) 2004-05-13
AU2003286648A8 (en) 2009-10-08
WO2004040620A3 (en) 2009-08-27
AU2003286648A1 (en) 2004-05-25

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