WO2004038760A3 - High temperature, high strength, colorable materials for use with electronics processing applications - Google Patents

High temperature, high strength, colorable materials for use with electronics processing applications Download PDF

Info

Publication number
WO2004038760A3
WO2004038760A3 PCT/US2003/027562 US0327562W WO2004038760A3 WO 2004038760 A3 WO2004038760 A3 WO 2004038760A3 US 0327562 W US0327562 W US 0327562W WO 2004038760 A3 WO2004038760 A3 WO 2004038760A3
Authority
WO
WIPO (PCT)
Prior art keywords
materials
high temperature
high strength
processing applications
electronics processing
Prior art date
Application number
PCT/US2003/027562
Other languages
French (fr)
Other versions
WO2004038760A2 (en
Inventor
Charles W Extrad
Original Assignee
Entegris Inc
Charles W Extrad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Charles W Extrad filed Critical Entegris Inc
Priority to EP03809512A priority Critical patent/EP1536943A4/en
Priority to JP2004546717A priority patent/JP2006506278A/en
Priority to AU2003296901A priority patent/AU2003296901A1/en
Publication of WO2004038760A2 publication Critical patent/WO2004038760A2/en
Publication of WO2004038760A3 publication Critical patent/WO2004038760A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a general shape other than plane
    • B32B1/08—Tubular products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/34—Trays or like shallow containers
    • B65D1/36—Trays or like shallow containers with moulded compartments or partitions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]

Abstract

Certain embodiments include an electrostatic-discharge safe tray (100) for receiving and/or storing electronic components, e.g., read/write heads. Such trays (100) may be made from a mixture of at least one high temperature, high strength polymer, at least one metal oxide, and at least one pigment. The use of the metal oxides as conductive materials advantageously allows for light-colored electrostatic-discharge safe materials to be made, so that such materials may be colored with pigments without compromise of material performance specifications.
PCT/US2003/027562 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications WO2004038760A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03809512A EP1536943A4 (en) 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications
JP2004546717A JP2006506278A (en) 2002-09-03 2003-09-03 High temperature high strength colorable materials for use in electronics processing applications
AU2003296901A AU2003296901A1 (en) 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40774902P 2002-09-03 2002-09-03
US60/407,749 2002-09-03

Publications (2)

Publication Number Publication Date
WO2004038760A2 WO2004038760A2 (en) 2004-05-06
WO2004038760A3 true WO2004038760A3 (en) 2004-12-23

Family

ID=32176438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/027562 WO2004038760A2 (en) 2002-09-03 2003-09-03 High temperature, high strength, colorable materials for use with electronics processing applications

Country Status (8)

Country Link
US (1) US20040126521A1 (en)
EP (1) EP1536943A4 (en)
JP (1) JP2006506278A (en)
KR (1) KR20050039871A (en)
CN (1) CN1694803A (en)
AU (1) AU2003296901A1 (en)
TW (1) TW200408693A (en)
WO (1) WO2004038760A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070026171A1 (en) * 2002-09-03 2007-02-01 Extrand Charles W High temperature, high strength, colorable materials for use with electronics processing applications
WO2004033103A2 (en) * 2002-10-09 2004-04-22 Entegris, Inc. High temperature, high strength, colorable materials for device processing systems
US7250612B2 (en) * 2005-09-28 2007-07-31 General Electric Company Devices and methods capable of authenticating batteries
WO2007149783A1 (en) * 2006-06-20 2007-12-27 Polyone Corporation Thermally conductive polymer compounds containing zinc sulfide and thermal carbon black
US7476339B2 (en) * 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
JP2013541181A (en) 2010-08-18 2013-11-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Light emitting diode assembly and thermal control blanket and method related thereto
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
US8758860B1 (en) 2012-11-07 2014-06-24 Bayer Materialscience Llc Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior
EP2799940B1 (en) * 2013-04-30 2019-07-17 The Swatch Group Management Services AG Packaging for hands of watches
CN106496992B (en) * 2016-10-26 2018-08-14 宁国市大荣电器有限公司 A kind of heat-resistant, high strength degree capacitor plastic housing
KR20200142622A (en) * 2019-06-12 2020-12-23 삼성디스플레이 주식회사 Substrate transferring apparatus and substrate transferring method using the same
CN116554638A (en) * 2023-06-13 2023-08-08 南京肯特复合材料股份有限公司 Conductive indium-doped tin oxide and polyether-ether-ketone composite material and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6395149B1 (en) * 1998-06-30 2002-05-28 3M Innovative Properties Company Method of making light colored, electrically conductive coated particles

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US132136A (en) * 1872-10-15 Improvement in coffee cleaners and polishers
US132232A (en) * 1872-10-15 Improvement in steam road-rollers
US146218A (en) * 1874-01-06 Improvement in billiard-registers
DE3416856A1 (en) * 1984-05-08 1985-11-14 Basf Ag, 6700 Ludwigshafen THERMOPLASTIC MOLDS
US4816556A (en) * 1985-02-22 1989-03-28 E. I. Du Pont De Nemours And Company Ordered polyetherketones
CA1262000A (en) * 1985-02-27 1989-09-26 Isaburo Fukawa Process for preparing crystalline aromatic polyetherketones
US4818437A (en) * 1985-07-19 1989-04-04 Acheson Industries, Inc. Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability
JPH0714744B2 (en) * 1988-12-15 1995-02-22 旭有機材工業株式会社 Tray for integrated circuits
JP2816864B2 (en) * 1989-07-07 1998-10-27 大塚化学株式会社 Transfer wafer basket and storage case
JP2794850B2 (en) * 1989-12-01 1998-09-10 住友化学工業株式会社 Aromatic polysulfone resin composition
US5890599A (en) * 1990-09-25 1999-04-06 R.H. Murphy Company Tray for integrated circuits
US5338334A (en) * 1992-01-16 1994-08-16 Institute Of Gas Technology Process for preparing submicron/nanosize ceramic powders from precursors incorporated within a polymeric foam
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
JPH0752661B2 (en) * 1992-12-01 1995-06-05 山一電機株式会社 IC carrier
US5447708A (en) * 1993-01-21 1995-09-05 Physical Sciences, Inc. Apparatus for producing nanoscale ceramic powders
JP2959928B2 (en) * 1993-06-23 1999-10-06 チタン工業株式会社 White conductive resin composition
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
US5348151A (en) * 1993-12-20 1994-09-20 Empak, Inc. Low profile disk carrier
US5538675A (en) * 1994-04-14 1996-07-23 The Dow Chemical Company Method for producing silicon nitride/silicon carbide composite
US5767198A (en) * 1994-04-28 1998-06-16 Daikin Industries, Ltd. Thermoplastic resin composition
JP2688664B2 (en) * 1994-09-07 1997-12-10 シノン電気産業株式会社 Tray for semiconductor device
EP0776998A4 (en) * 1995-06-14 1998-09-02 Otsuka Kagaku Kk Titanate whisker and process for the production thereof
JPH09111135A (en) * 1995-10-23 1997-04-28 Mitsubishi Materials Corp Conductive polymer composition
JPH09172059A (en) * 1995-12-18 1997-06-30 Nippon Precision Circuits Kk Chip tray for ic
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
DE19629675A1 (en) * 1996-07-23 1998-01-29 Merck Patent Gmbh Laser-markable plastics
US5921397A (en) * 1996-12-10 1999-07-13 Empak, Inc. Disk cassette
US5794783A (en) * 1996-12-31 1998-08-18 Intel Corporation Die-level burn-in and test flipping tray
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket
US6413489B1 (en) * 1997-04-15 2002-07-02 Massachusetts Institute Of Technology Synthesis of nanometer-sized particles by reverse micelle mediated techniques
US6105749A (en) * 1997-11-25 2000-08-22 International Business Machines Corporation Enhanced matrix tray feeder
KR100560077B1 (en) * 1998-01-09 2006-03-13 인티그리스, 인코포레이티드 Container washing apparatus
US6202883B1 (en) * 1998-02-06 2001-03-20 Mitsubishi Engineering-Plastics Corp. Tray for semiconductor integrated circuit devices
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US6329058B1 (en) * 1998-07-30 2001-12-11 3M Innovative Properties Company Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers
SG92640A1 (en) * 1999-06-07 2002-11-19 E Pak Resources S Pte Ltd Stud and rider for use on matrix trays
US6474477B1 (en) * 2001-05-02 2002-11-05 Ching T. Chang Carrier assembly for semiconductor IC (integrated circuit) packages

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395149B1 (en) * 1998-06-30 2002-05-28 3M Innovative Properties Company Method of making light colored, electrically conductive coated particles
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray

Also Published As

Publication number Publication date
AU2003296901A8 (en) 2004-05-13
KR20050039871A (en) 2005-04-29
JP2006506278A (en) 2006-02-23
AU2003296901A1 (en) 2004-05-13
US20040126521A1 (en) 2004-07-01
EP1536943A4 (en) 2005-12-28
EP1536943A2 (en) 2005-06-08
TW200408693A (en) 2004-06-01
WO2004038760A2 (en) 2004-05-06
CN1694803A (en) 2005-11-09

Similar Documents

Publication Publication Date Title
WO2004038760A3 (en) High temperature, high strength, colorable materials for use with electronics processing applications
WO2007120203A3 (en) Flame retardant compositions with a phosphorated compound
EP2075290A3 (en) Improved effect pigment comprising a mixture of at least 2 substrate materials
WO2007078713A3 (en) High glass transition temperature thermoplastic articles
EP1209211A4 (en) Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
DE502006007605D1 (en) HALOGEN-FREE FLAME-PROTECTED THERMOPLASTIC POLYESTER
WO2004028824A3 (en) Security element
CA2496072A1 (en) Conductive polyvinyl alcohol fiber
WO2004033103A3 (en) High temperature, high strength, colorable materials for device processing systems
ATE407173T1 (en) GLASS POWDER AND RESIN COMPOSITION CONTAINING THE SAME
EP1661869A3 (en) Ferrite material and electronic component using same
ATE549949T1 (en) PRINTED TEXTILE ELEMENT
WO2002046288A3 (en) Flame retardant resin composition and molded products thereof
WO2002054492A3 (en) Circuit
US20080029379A1 (en) Slide button and casing using the same
WO2004106674A8 (en) Goods protection device with a closed container
EP2160661A1 (en) Display module
WO2019137650A1 (en) Device comprising an electronics unit and a housing
WO2008113343A3 (en) Electronic module comprising a conductor fuse
AU2002352091A8 (en) Articles having low reflectance conductive coatings with conductive component outermost
AU2002361110A1 (en) Maleimido-bearing compounds, resin compositions containing the same and cured articles thereof
WO2005060718A3 (en) Cap at resistors of electrical test probe
CN209129913U (en) A kind of protective device preventing blower oil starvation scuffing of cylinder bore
CA2020527A1 (en) Elastomeric thermoplastic copolyesters endowed with high rheological and mechanical properties and an improved ageing resistance
AU7691494A (en) Substituted lactic-acid derivatives with an organic n-group in the beta position, their preparation and their use as herbicides and antidotes

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2004546717

Country of ref document: JP

Ref document number: 1020057003705

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2003809512

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020057003705

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20038249502

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2003809512

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2003809512

Country of ref document: EP