WO2004032186B1 - Thermal enhanced package for block mold assembly - Google Patents

Thermal enhanced package for block mold assembly

Info

Publication number
WO2004032186B1
WO2004032186B1 PCT/US2003/029569 US0329569W WO2004032186B1 WO 2004032186 B1 WO2004032186 B1 WO 2004032186B1 US 0329569 W US0329569 W US 0329569W WO 2004032186 B1 WO2004032186 B1 WO 2004032186B1
Authority
WO
WIPO (PCT)
Prior art keywords
heat spreader
die
substrate
molding compound
package
Prior art date
Application number
PCT/US2003/029569
Other languages
French (fr)
Other versions
WO2004032186A3 (en
WO2004032186A2 (en
Inventor
Daniel K Lau
Edward L T Law
Original Assignee
Advanced Interconnect Tech Ltd
Daniel K Lau
Edward L T Law
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Interconnect Tech Ltd, Daniel K Lau, Edward L T Law filed Critical Advanced Interconnect Tech Ltd
Priority to US10/529,017 priority Critical patent/US7259445B2/en
Priority to JP2004541582A priority patent/JP2006501677A/en
Priority to EP03755842A priority patent/EP1556894A4/en
Priority to AU2003273342A priority patent/AU2003273342A1/en
Publication of WO2004032186A2 publication Critical patent/WO2004032186A2/en
Publication of WO2004032186A3 publication Critical patent/WO2004032186A3/en
Publication of WO2004032186B1 publication Critical patent/WO2004032186B1/en

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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract

A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a package strip (10) may consist of a row (linear array) of groups of die attach areas (e.g. in a rectangular array of four). The heat spreader precursor (20) may accommodate one such group or multiple groups along the package strip (10). The package strip (10) may then be singulated to form the individual packages. Each singulated package includes a die (14), its associated substrate 16 (e.g., either a lead frame or interposer type substrate) and a portion of the heat spreader precursor (24) as a heat spreader (20).

Claims

AMENDED CLAIMS[received by the International Bureau on 13 October 2004 (13.10.04); original claim 1 amended, other claims unchanged]
1. A device comprising: a substrate (16) having first and second generally opposite surfaces, the substrate (16) first surface having a plurality of bond sites (62) disposed thereon; a die (14) mounted to the first surface of the substrate (16), the die (14) having first and second generally opposite surfaces parallel to the substrate (16) first and second surfaces, the die (14) first surface having a plurality of I/O pads (60) disposed thereon, the I/O pads (60) being electrically connected to the bond sites (62); a molding compound (18) encapsulating the die (14) and at least the first surface of the substrate (16); a heat spreader (20) at least partially embedded in the molding compound (18) and having a peripheral cut edge portion (32) aligned with and not recessed f om associated peripheral cut edge portions (34, 36) of the substrate (16) and molding compound (18).
2. The device of claim 1 , wherein the heat spreader (20) has first and second generally opposite surfaces parallel to the die (14) first and second surfaces, the heat spreader (20) second surface being covered by the molding compound (18) and the heat spreader (20) first surface being uncovered by the molding compound (18).
3. The device of claim 2, wherein the heat spreader (20) is thermally connected to the die by a material (88) having a thermal conductivity higher than a thermal conductivity of the molding compound (18).
4. The device of claim 2, wherein the heat spreader (20) includes a protrusion (100) extending from the heat spreader (20) second surface, the protrusion contacting the die
(14).
5. The device of claim 1 , wherein the heat spreader (20) includes a down-set leg (52) contacting the substrate (16) first surface.
PCT/US2003/029569 2002-09-30 2003-09-23 Thermal enhanced package for block mold assembly WO2004032186A2 (en)

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US10/529,017 US7259445B2 (en) 2002-09-30 2003-09-23 Thermal enhanced package for block mold assembly
JP2004541582A JP2006501677A (en) 2002-09-30 2003-09-23 Heat resistant package for block molded assemblies
EP03755842A EP1556894A4 (en) 2002-09-30 2003-09-23 Thermal enhanced package for block mold assembly
AU2003273342A AU2003273342A1 (en) 2002-09-30 2003-09-23 Thermal enhanced package for block mold assembly

Applications Claiming Priority (2)

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US41518902P 2002-09-30 2002-09-30
US60/415,189 2002-09-30

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JP (1) JP2006501677A (en)
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AU (1) AU2003273342A1 (en)
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CN1685498A (en) 2005-10-19
EP1556894A4 (en) 2009-01-14
TW200416982A (en) 2004-09-01
EP1556894A2 (en) 2005-07-27
CN100380636C (en) 2008-04-09
AU2003273342A8 (en) 2004-04-23
WO2004032186A3 (en) 2004-10-28
US20060166397A1 (en) 2006-07-27
KR20050071524A (en) 2005-07-07
AU2003273342A1 (en) 2004-04-23
JP2006501677A (en) 2006-01-12
WO2004032186A2 (en) 2004-04-15
US7259445B2 (en) 2007-08-21
TWI281238B (en) 2007-05-11

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