WO2004030013A3 - Baffle plate in a plasma processing system - Google Patents
Baffle plate in a plasma processing system Download PDFInfo
- Publication number
- WO2004030013A3 WO2004030013A3 PCT/IB2003/004943 IB0304943W WO2004030013A3 WO 2004030013 A3 WO2004030013 A3 WO 2004030013A3 IB 0304943 W IB0304943 W IB 0304943W WO 2004030013 A3 WO2004030013 A3 WO 2004030013A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- baffle plate
- processing system
- plasma processing
- plasma
- fabrication
- Prior art date
Links
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004539388A JP4627660B2 (en) | 2002-09-30 | 2003-09-29 | Apparatus for improved baffle plates in plasma processing systems. |
AU2003274581A AU2003274581A1 (en) | 2002-09-30 | 2003-09-29 | Baffle plate in a plasma processing system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/259,382 | 2002-09-30 | ||
US10/259,382 US6837966B2 (en) | 2002-09-30 | 2002-09-30 | Method and apparatus for an improved baffle plate in a plasma processing system |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2004030013A2 WO2004030013A2 (en) | 2004-04-08 |
WO2004030013A3 true WO2004030013A3 (en) | 2004-09-16 |
WO2004030013A8 WO2004030013A8 (en) | 2004-10-07 |
Family
ID=32029497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2003/004943 WO2004030013A2 (en) | 2002-09-30 | 2003-09-29 | Baffle plate in a plasma processing system |
Country Status (6)
Country | Link |
---|---|
US (3) | US6837966B2 (en) |
JP (1) | JP4627660B2 (en) |
KR (1) | KR100733167B1 (en) |
CN (1) | CN100380564C (en) |
AU (1) | AU2003274581A1 (en) |
WO (1) | WO2004030013A2 (en) |
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US8057600B2 (en) | 2011-11-15 |
CN1682341A (en) | 2005-10-12 |
WO2004030013A8 (en) | 2004-10-07 |
US20040060658A1 (en) | 2004-04-01 |
US7282112B2 (en) | 2007-10-16 |
US20070204794A1 (en) | 2007-09-06 |
AU2003274581A8 (en) | 2004-04-19 |
KR20050067405A (en) | 2005-07-01 |
KR100733167B1 (en) | 2007-06-27 |
JP4627660B2 (en) | 2011-02-09 |
AU2003274581A1 (en) | 2004-04-19 |
CN100380564C (en) | 2008-04-09 |
JP2006501647A (en) | 2006-01-12 |
US6837966B2 (en) | 2005-01-04 |
WO2004030013A2 (en) | 2004-04-08 |
US20050103268A1 (en) | 2005-05-19 |
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