WO2004027882A3 - Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung - Google Patents
Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung Download PDFInfo
- Publication number
- WO2004027882A3 WO2004027882A3 PCT/DE2003/002953 DE0302953W WO2004027882A3 WO 2004027882 A3 WO2004027882 A3 WO 2004027882A3 DE 0302953 W DE0302953 W DE 0302953W WO 2004027882 A3 WO2004027882 A3 WO 2004027882A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- leadframe
- based housing
- production method
- optoelectronic component
- mounted optoelectronic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 230000005693 optoelectronics Effects 0.000 title 1
- 238000001746 injection moulding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004536842A JP4351631B2 (ja) | 2002-09-17 | 2003-09-05 | リードフレームをベースとしたハウジング、表面実装可能な光電構成素子及び製造法 |
EP03747830.2A EP1540745B1 (de) | 2002-09-17 | 2003-09-05 | Verfahren zur herstellung eines leadframe-basierten gehäuses |
US10/527,836 US7102213B2 (en) | 2002-09-17 | 2003-09-05 | Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10243247.3 | 2002-09-17 | ||
DE10243247A DE10243247A1 (de) | 2002-09-17 | 2002-09-17 | Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004027882A2 WO2004027882A2 (de) | 2004-04-01 |
WO2004027882A3 true WO2004027882A3 (de) | 2004-07-29 |
Family
ID=31969180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/002953 WO2004027882A2 (de) | 2002-09-17 | 2003-09-05 | Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7102213B2 (de) |
EP (1) | EP1540745B1 (de) |
JP (1) | JP4351631B2 (de) |
CN (1) | CN100449798C (de) |
DE (1) | DE10243247A1 (de) |
TW (1) | TWI257692B (de) |
WO (1) | WO2004027882A2 (de) |
Cited By (2)
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US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
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US20070117248A1 (en) * | 2003-12-09 | 2007-05-24 | Jochen Kunze | Method for the production of light-emitting semiconductor diodes |
DE102004033533B4 (de) * | 2004-07-09 | 2007-06-21 | G.L.I. Global Light Industries Gmbh | Leuchteinheit mit integrierter Platine |
TWI237409B (en) | 2004-10-08 | 2005-08-01 | Kingbright Electronics Co Ltd | Method of fabricating light emitting diode (LED) |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
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US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
WO2007135707A1 (ja) | 2006-05-18 | 2007-11-29 | Nichia Corporation | 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
DE112007001950T5 (de) | 2006-08-21 | 2009-07-02 | Innotec Corporation, Zeeland | Elektrische Vorrichtung mit platinenloser Montageanordnung für elektrische Komponenten |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US7633055B2 (en) * | 2007-03-08 | 2009-12-15 | Lumination Llc | Sealed light emitting diode assemblies including annular gaskets and methods of making same |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
US8581278B2 (en) * | 2007-04-06 | 2013-11-12 | Kingbright Electronic Co., Ltd. | Light-emitting diode packaging structure |
CN100487310C (zh) * | 2007-07-06 | 2009-05-13 | 深圳市泓亚光电子有限公司 | Led平板式多芯大功率光源 |
US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US8230575B2 (en) | 2007-12-12 | 2012-07-31 | Innotec Corporation | Overmolded circuit board and method |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
JP2009238970A (ja) * | 2008-03-27 | 2009-10-15 | Panasonic Corp | 半導体装置用パッケージと光半導体装置 |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
JP5464825B2 (ja) * | 2008-07-23 | 2014-04-09 | ローム株式会社 | Ledモジュール |
DE102008048259A1 (de) * | 2008-09-22 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauteil |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US20110037083A1 (en) * | 2009-01-14 | 2011-02-17 | Alex Chi Keung Chan | Led package with contrasting face |
WO2010092853A1 (ja) * | 2009-02-10 | 2010-08-19 | 三洋電機株式会社 | フレームパッケージの製造方法 |
US8610156B2 (en) * | 2009-03-10 | 2013-12-17 | Lg Innotek Co., Ltd. | Light emitting device package |
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US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
US8598809B2 (en) | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US20110101062A1 (en) * | 2009-11-04 | 2011-05-05 | Benjamin Franklin Roberts | Pouch and pouches to carry personal items and lights on a belt |
KR101193909B1 (ko) * | 2009-12-31 | 2012-10-29 | 장광균 | Led 조명용 리드 프레임 및 그 제조방법 |
DE102010012039A1 (de) * | 2010-03-19 | 2011-09-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
WO2011122665A1 (ja) | 2010-03-30 | 2011-10-06 | 大日本印刷株式会社 | Led用リードフレームまたは基板、半導体装置、およびled用リードフレームまたは基板の製造方法 |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
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US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
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DE102015214588A1 (de) * | 2015-07-31 | 2017-02-02 | Robert Bosch Gmbh | Anordnung zum Messen einer Drehzahl, insbesondere eines Turboladers eines Kraftfahrzeugs |
CN106571383B (zh) | 2015-10-08 | 2020-04-28 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
USD799103S1 (en) * | 2016-05-20 | 2017-10-03 | Heptagon Micro Optics Pte. Ltd. | Optical emitter module |
DE102017110850A1 (de) | 2017-05-18 | 2018-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
DE102017112642A1 (de) * | 2017-06-08 | 2018-12-13 | Osram Opto Semiconductors Gmbh | Led-filament |
DE112017000857B4 (de) * | 2017-07-06 | 2024-02-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102017127621A1 (de) * | 2017-11-22 | 2019-05-23 | Osram Opto Semiconductors Gmbh | Vorrichtung mit Leiterrahmen und Verfahren zur Herstellung einer Mehrzahl von Vorrichtungen |
US11353200B2 (en) * | 2018-12-17 | 2022-06-07 | Korrus, Inc. | Strip lighting system for direct input of high voltage driving power |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147141A (ja) * | 1982-02-26 | 1983-09-01 | Nec Corp | 電子部品 |
US4791472A (en) * | 1985-09-23 | 1988-12-13 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
US4803544A (en) * | 1986-07-11 | 1989-02-07 | Junghans Uhren Gmbh | Prefabricated strip conductor network assembly unit and process for making same |
EP0723293A1 (de) * | 1994-12-16 | 1996-07-24 | Seiko Epson Corporation | Halbleiteranordnung mit einer Wärmesenke und Herstellungsverfahren des Wärmesenke |
EP0854523A2 (de) * | 1997-01-15 | 1998-07-22 | Toshiba Corporation | Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren |
JPH11340403A (ja) * | 1998-05-28 | 1999-12-10 | Sony Corp | リードフレーム |
WO2003019677A2 (de) * | 2001-08-21 | 2003-03-06 | Osram Opto Semiconductors Gmbh | Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1195782A (en) * | 1981-07-06 | 1985-10-22 | Mikio Nishikawa | Lead frame for plastic encapsulated semiconductor device |
DE58909875D1 (de) | 1989-05-31 | 2000-08-31 | Osram Opto Semiconductors Gmbh | Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
DE10140831A1 (de) * | 2001-08-21 | 2003-03-13 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen |
-
2002
- 2002-09-17 DE DE10243247A patent/DE10243247A1/de not_active Withdrawn
-
2003
- 2003-09-05 WO PCT/DE2003/002953 patent/WO2004027882A2/de active Application Filing
- 2003-09-05 JP JP2004536842A patent/JP4351631B2/ja not_active Expired - Lifetime
- 2003-09-05 US US10/527,836 patent/US7102213B2/en not_active Expired - Lifetime
- 2003-09-05 CN CNB038220679A patent/CN100449798C/zh not_active Expired - Lifetime
- 2003-09-05 EP EP03747830.2A patent/EP1540745B1/de not_active Expired - Lifetime
- 2003-09-16 TW TW092125466A patent/TWI257692B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147141A (ja) * | 1982-02-26 | 1983-09-01 | Nec Corp | 電子部品 |
US4791472A (en) * | 1985-09-23 | 1988-12-13 | Hitachi, Ltd. | Lead frame and semiconductor device using the same |
US4803544A (en) * | 1986-07-11 | 1989-02-07 | Junghans Uhren Gmbh | Prefabricated strip conductor network assembly unit and process for making same |
EP0723293A1 (de) * | 1994-12-16 | 1996-07-24 | Seiko Epson Corporation | Halbleiteranordnung mit einer Wärmesenke und Herstellungsverfahren des Wärmesenke |
EP0854523A2 (de) * | 1997-01-15 | 1998-07-22 | Toshiba Corporation | Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren |
JPH11340403A (ja) * | 1998-05-28 | 1999-12-10 | Sony Corp | リードフレーム |
WO2003019677A2 (de) * | 2001-08-21 | 2003-03-06 | Osram Opto Semiconductors Gmbh | Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 007, no. 264 (E - 212) 24 November 1983 (1983-11-24) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 03 30 March 2000 (2000-03-30) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
Also Published As
Publication number | Publication date |
---|---|
DE10243247A1 (de) | 2004-04-01 |
WO2004027882A2 (de) | 2004-04-01 |
EP1540745B1 (de) | 2014-10-29 |
JP4351631B2 (ja) | 2009-10-28 |
CN100449798C (zh) | 2009-01-07 |
JP2005539386A (ja) | 2005-12-22 |
US7102213B2 (en) | 2006-09-05 |
TW200406892A (en) | 2004-05-01 |
CN1682383A (zh) | 2005-10-12 |
US20060157828A1 (en) | 2006-07-20 |
EP1540745A2 (de) | 2005-06-15 |
TWI257692B (en) | 2006-07-01 |
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