WO2004027882A3 - Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung - Google Patents

Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung Download PDF

Info

Publication number
WO2004027882A3
WO2004027882A3 PCT/DE2003/002953 DE0302953W WO2004027882A3 WO 2004027882 A3 WO2004027882 A3 WO 2004027882A3 DE 0302953 W DE0302953 W DE 0302953W WO 2004027882 A3 WO2004027882 A3 WO 2004027882A3
Authority
WO
WIPO (PCT)
Prior art keywords
leadframe
based housing
production method
optoelectronic component
mounted optoelectronic
Prior art date
Application number
PCT/DE2003/002953
Other languages
English (en)
French (fr)
Other versions
WO2004027882A2 (de
Inventor
Joerg Erich Sorg
Original Assignee
Osram Opto Semiconductors Gmbh
Joerg Erich Sorg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Joerg Erich Sorg filed Critical Osram Opto Semiconductors Gmbh
Priority to US10/527,836 priority Critical patent/US7102213B2/en
Priority to JP2004536842A priority patent/JP4351631B2/ja
Priority to EP03747830.2A priority patent/EP1540745B1/de
Publication of WO2004027882A2 publication Critical patent/WO2004027882A2/de
Publication of WO2004027882A3 publication Critical patent/WO2004027882A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

Die Erfindung beschreibt ein Leadframe-basiertes Gehäuse für ein oberflächenmontierbares Bauelement, insbesondere ein strahlungsemittierendes Bauelement, wobei das Leadframe-basierte Gehäuse elektrische Anschlußstreifen und zumindest eine Chip-Montagefläche aufweist und wobei in einem der Anschlußstreifen erfindungsgemäß eine Anspritz-Fenster vorgesehen ist, welche die Herstellung eines Leadframe-basierten Gehäuses mit einer geringen Dicke in einem Spritzgußverfahren ermöglicht. Weiterhin wird ein Verfahren zur Herstellung solcher Gehäuse angegeben.
PCT/DE2003/002953 2002-09-17 2003-09-05 Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung WO2004027882A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/527,836 US7102213B2 (en) 2002-09-17 2003-09-05 Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method
JP2004536842A JP4351631B2 (ja) 2002-09-17 2003-09-05 リードフレームをベースとしたハウジング、表面実装可能な光電構成素子及び製造法
EP03747830.2A EP1540745B1 (de) 2002-09-17 2003-09-05 Verfahren zur herstellung eines leadframe-basierten gehäuses

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10243247A DE10243247A1 (de) 2002-09-17 2002-09-17 Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung
DE10243247.3 2002-09-17

Publications (2)

Publication Number Publication Date
WO2004027882A2 WO2004027882A2 (de) 2004-04-01
WO2004027882A3 true WO2004027882A3 (de) 2004-07-29

Family

ID=31969180

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/002953 WO2004027882A2 (de) 2002-09-17 2003-09-05 Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung

Country Status (7)

Country Link
US (1) US7102213B2 (de)
EP (1) EP1540745B1 (de)
JP (1) JP4351631B2 (de)
CN (1) CN100449798C (de)
DE (1) DE10243247A1 (de)
TW (1) TWI257692B (de)
WO (1) WO2004027882A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070117248A1 (en) * 2003-12-09 2007-05-24 Jochen Kunze Method for the production of light-emitting semiconductor diodes
DE102004033533B4 (de) * 2004-07-09 2007-06-21 G.L.I. Global Light Industries Gmbh Leuchteinheit mit integrierter Platine
TWI237409B (en) * 2004-10-08 2005-08-01 Kingbright Electronics Co Ltd Method of fabricating light emitting diode (LED)
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
KR100616684B1 (ko) * 2005-06-03 2006-08-28 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
EP1848042A1 (de) * 2006-04-21 2007-10-24 LEXEDIS Lighting GmbH LED-Gehäuse mit Montagebasis
US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7909482B2 (en) 2006-08-21 2011-03-22 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7633055B2 (en) * 2007-03-08 2009-12-15 Lumination Llc Sealed light emitting diode assemblies including annular gaskets and methods of making same
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
US7712933B2 (en) 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
US8581278B2 (en) * 2007-04-06 2013-11-12 Kingbright Electronic Co., Ltd. Light-emitting diode packaging structure
CN100487310C (zh) * 2007-07-06 2009-05-13 深圳市泓亚光电子有限公司 Led平板式多芯大功率光源
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US8230575B2 (en) 2007-12-12 2012-07-31 Innotec Corporation Overmolded circuit board and method
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
JP2009238970A (ja) * 2008-03-27 2009-10-15 Panasonic Corp 半導体装置用パッケージと光半導体装置
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
JP5464825B2 (ja) * 2008-07-23 2014-04-09 ローム株式会社 Ｌｅｄモジュール
DE102008048259A1 (de) * 2008-09-22 2010-04-08 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauteil
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) * 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
WO2010092853A1 (ja) * 2009-02-10 2010-08-19 三洋電機株式会社 フレームパッケージの製造方法
US8610156B2 (en) * 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
TWI485878B (zh) * 2009-04-01 2015-05-21 Lite On Technology Corp 形成發光二極體之透鏡結構之方法及其相關架構
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US20110101062A1 (en) * 2009-11-04 2011-05-05 Benjamin Franklin Roberts Pouch and pouches to carry personal items and lights on a belt
KR101193909B1 (ko) * 2009-12-31 2012-10-29 장광균 Ｌｅｄ 조명용 리드 프레임 및 그 제조방법
DE102010012039A1 (de) * 2010-03-19 2011-09-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
TWI596796B (zh) 2010-03-30 2017-08-21 Dainippon Printing Co Ltd Light-emitting diode lead frame or substrate, semiconductor device, and light-emitting diode lead frame or substrate manufacturing method
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
KR101778832B1 (ko) 2010-11-02 2017-09-14 다이니폰 인사츠 가부시키가이샤 Ｌｅｄ 소자 탑재용 리드 프레임, 수지 부착 리드 프레임, 반도체 장치의 제조 방법 및 반도체 소자 탑재용 리드 프레임
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
JP5857709B2 (ja) * 2011-12-14 2016-02-10 日産自動車株式会社 半導体装置
JP5885493B2 (ja) * 2011-12-21 2016-03-15 住友化学株式会社 半導体用パッケージ及び半導体発光装置
DE112013002944T5 (de) 2012-06-13 2015-02-19 Innotec, Corp. Flexibler Hohllichtleiter
CN102718953B (zh) * 2012-07-05 2014-07-16 江苏申久化纤有限公司 一种聚酯生产中自动调整酯化釜eg回流比的工艺
JP6244873B2 (ja) * 2013-12-16 2017-12-13 三菱電機株式会社 映像表示ユニットおよび発光装置
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
WO2017005704A1 (en) * 2015-07-08 2017-01-12 Firecomms Limited An optoelectronic device
DE102015214588A1 (de) * 2015-07-31 2017-02-02 Robert Bosch Gmbh Anordnung zum Messen einer Drehzahl, insbesondere eines Turboladers eines Kraftfahrzeugs
CN106571383B (zh) 2015-10-08 2020-04-28 联华电子股份有限公司 半导体元件及其制作方法
USD799103S1 (en) * 2016-05-20 2017-10-03 Heptagon Micro Optics Pte. Ltd. Optical emitter module
DE102017110850A1 (de) * 2017-05-18 2018-11-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102017112642A1 (de) * 2017-06-08 2018-12-13 Osram Opto Semiconductors Gmbh Led-filament
CN110024139B (zh) * 2017-07-06 2022-03-04 欧司朗光电半导体有限公司 用于制造光电子部件的方法及光电子部件
DE102017127621A1 (de) * 2017-11-22 2019-05-23 Osram Opto Semiconductors Gmbh Vorrichtung mit Leiterrahmen und Verfahren zur Herstellung einer Mehrzahl von Vorrichtungen
WO2020131933A1 (en) * 2018-12-17 2020-06-25 Lilibrand Llc Strip lighting systems which comply with ac driving power
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147141A (ja) * 1982-02-26 1983-09-01 Nec Corp 電子部品
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US4803544A (en) * 1986-07-11 1989-02-07 Junghans Uhren Gmbh Prefabricated strip conductor network assembly unit and process for making same
EP0723293A1 (de) * 1994-12-16 1996-07-24 Seiko Epson Corporation Halbleiteranordnung mit einer Wärmesenke und Herstellungsverfahren des Wärmesenke
EP0854523A2 (de) * 1997-01-15 1998-07-22 Toshiba Corporation Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
JPH11340403A (ja) * 1998-05-28 1999-12-10 Sony Corp リードフレーム
WO2003019677A2 (de) * 2001-08-21 2003-03-06 Osram Opto Semiconductors Gmbh Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
EP0400176B1 (de) 1989-05-31 2000-07-26 Osram Opto Semiconductors GmbH & Co. OHG Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements
DE10117889A1 (de) * 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
DE10140831A1 (de) * 2001-08-21 2003-03-13 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147141A (ja) * 1982-02-26 1983-09-01 Nec Corp 電子部品
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US4803544A (en) * 1986-07-11 1989-02-07 Junghans Uhren Gmbh Prefabricated strip conductor network assembly unit and process for making same
EP0723293A1 (de) * 1994-12-16 1996-07-24 Seiko Epson Corporation Halbleiteranordnung mit einer Wärmesenke und Herstellungsverfahren des Wärmesenke
EP0854523A2 (de) * 1997-01-15 1998-07-22 Toshiba Corporation Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
JPH11340403A (ja) * 1998-05-28 1999-12-10 Sony Corp リードフレーム
WO2003019677A2 (de) * 2001-08-21 2003-03-06 Osram Opto Semiconductors Gmbh Leiterrahmen und gehäuse für ein strahlungsemittierendes bauelement

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 264 (E - 212) 24 November 1983 (1983-11-24) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 03 30 March 2000 (2000-03-30) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same

Also Published As

Publication number Publication date
EP1540745B1 (de) 2014-10-29
US7102213B2 (en) 2006-09-05
WO2004027882A2 (de) 2004-04-01
EP1540745A2 (de) 2005-06-15
TWI257692B (en) 2006-07-01
CN1682383A (zh) 2005-10-12
DE10243247A1 (de) 2004-04-01
US20060157828A1 (en) 2006-07-20
JP4351631B2 (ja) 2009-10-28
CN100449798C (zh) 2009-01-07
JP2005539386A (ja) 2005-12-22
TW200406892A (en) 2004-05-01

Similar Documents

Publication Publication Date Title
WO2004027882A3 (de) Leadframe-basiertes gehäuse, oberflächenmontierbares optoelektronisches bauelement und verfahren zur herstellung
EP1098368A4 (de) Modulkomponente und herstellungsverfahren dafür
JP3138503U (ja) アンテナ及びケースの複合構造
AU2002342623A8 (en) Method for producing electronic components
WO2003056638A3 (de) Verfahren zum herstellen von lichtleitenden led-körpern in zwei zeitlich getrennten stufen
EP1130270A3 (de) Lüfter und dessen Herstellungverfahren
SE9800462L (sv) Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden
TW200603413A (en) MOS varactor and method for making the same
WO2003067657A3 (de) Halbleiterbauteil mit sensor- bzw. aktoroberfläche und verfahren zu seiner herstellung
TW200706508A (en) Method for producing an electronic component passivated by lead free glass
WO2002099871A3 (de) Kunststoffgehäuse mit mehreren halbleiterchips und einer umverdrahtungsplatte sowie ein verfahren zur herstellung des kunststoffgehäuses in einer spritzgussform
TW200501856A (en) Method of mounting an electronic part
WO2004025739A3 (de) Verfahren zum herstellen einer integrierten pin-diode und zugehörige schaltungsanordnung
BR0313626B1 (pt) composiÇço ignÍfuga, processo de fabricaÇço de uma composiÇço ignÍfuga, processo de fabricaÇço de um artigo e artigo.
TW200739161A (en) Method for manufacturing optical coupling part and optical coupling part
WO2005048344A3 (de) Einpressdiode
WO2004041712A3 (en) Method of making a nanoscale electronic device
AU2001248586A1 (en) Process for forming electrical/mechanical connections
WO2003054588A3 (en) Etalon based optical circuit and method for its production
PT1051891E (pt) Metodo de fabricacao de um suporte provido de um escudo contra a radiacao de interferencia
WO2009117530A3 (en) Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
AU2003284629A1 (en) Electrical connector for board, method of molding electrical connector housing for board, and metal mold for injection molding of electrical connector housing
DE602004005598D1 (de) Verfahren zur herstellung einer midplane
US20230327056A1 (en) Surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material
WO2002097880A3 (de) Leistungsalbleitermodul und verfahren zum herstellen eines leistungshalbleitermoduls

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003747830

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2006157828

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10527836

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2004536842

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 20038220679

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2003747830

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 10527836

Country of ref document: US